Patents by Inventor Nobuo Sasaoka

Nobuo Sasaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7724478
    Abstract: Terminals of a flexible printed circuit board and terminals of a wiring trace in a head suspension assembly are to be connected with each other by soldering without causing a soldering defect. In an embodiment, a terminal structure of a multi-connector in a wiring trace which includes an insulating layer and a conductor pattern portion formed on a surface of the insulating layer is provided with exposed portions of terminals exposed from apertures formed in part of the insulating layer and is also provided with lining portions adjacent to the exposed portions in a longitudinal direction of the conductor pattern portion and bonded to the insulating layer. Even if terminals of the multi-connector are cracked when soldered, not only conductivity is ensured, but also it is possible to strengthen the terminals, because the lining portions of the terminals are bonded to the insulating layer.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: May 25, 2010
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Takaaki Deguchi, Toshiyuki Katoh, Katsumi Kiguchi, Nobuo Sasaoka, Kohichi Suzuki, Shingo Tsuda
  • Publication number: 20080239578
    Abstract: Terminals of a flexible printed circuit board and terminals of a wiring trace in a head suspension assembly are to be connected with each other by soldering without causing a soldering defect. In an embodiment, a terminal structure of a multi-connector in a wiring trace which includes an insulating layer and a conductor pattern portion formed on a surface of the insulating layer is provided with exposed portions of terminals exposed from apertures formed in part of the insulating layer and is also provided with lining portions adjacent to the exposed portions in a longitudinal direction of the conductor pattern portion and bonded to the insulating layer. Even if terminals of the multi-connector are cracked when soldered, not only conductivity is ensured, but also it is possible to strengthen the terminals, because the lining portions of the terminals are bonded to the insulating layer.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 2, 2008
    Applicant: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Takaaki Deguchi, Toshiyuki Katoh, Katsumi Kiguchi, Nobuo Sasaoka, Kohichi Suzuki, Shingo Tsuda
  • Patent number: 7372669
    Abstract: Terminals of a flexible printed circuit board and terminals of a wiring trace in a head suspension assembly are to be connected with each other by soldering without causing a soldering defect. In an embodiment, a terminal structure of a multi-connector in a wiring trace which includes an insulating layer and a conductor pattern portion formed on a surface of the insulating layer is provided with exposed portions of terminals exposed from apertures formed in part of the insulating layer and is also provided with lining portions adjacent to the exposed portions in a longitudinal direction of the conductor pattern portion and bonded to the insulating layer. Even if terminals of the multi-connector are cracked when soldered, not only conductivity is ensured, but also it is possible to strengthen the terminals, because the lining portions of the terminals are bonded to the insulating layer.
    Type: Grant
    Filed: August 9, 2005
    Date of Patent: May 13, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Takaaki Deguchi, Toshiyuki Katoh, Katsumi Kiguchi, Nobuo Sasaoka, Kohichi Suzuki, Shingo Tsuda
  • Publication number: 20060034018
    Abstract: Terminals of a flexible printed circuit board and terminals of a wiring trace in a head suspension assembly are to be connected with each other by soldering without causing a soldering defect. In an embodiment, a terminal structure of a multi-connector in a wiring trace which includes an insulating layer and a conductor pattern portion formed on a surface of the insulating layer is provided with exposed portions of terminals exposed from apertures formed in part of the insulating layer and is also provided with lining portions adjacent to the exposed portions in a longitudinal direction of the conductor pattern portion and bonded to the insulating layer. Even if terminals of the multi-connector are cracked when soldered, not only conductivity is ensured, but also it is possible to strengthen the terminals, because the lining portions of the terminals are bonded to the insulating layer.
    Type: Application
    Filed: August 9, 2005
    Publication date: February 16, 2006
    Applicant: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Takaaki Deguchi, Toshiyuki Katoh, Katsumi Kiguchi, Nobuo Sasaoka, Kohichi Suzuki, Shingo Tsuda