Patents by Inventor Nobuo Segawa

Nobuo Segawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic circuit device
    Patent number: 10084305
    Abstract: An electronic circuit device comprises an output part, which includes at least three phase parts and a first temperature sensor and a second temperature sensor, which output detection signals corresponding to temperatures of the output part. Each phase part includes two high-side and low-side switching elements. The first temperature sensor is located at a position between the first phase part and the second phase part. The second temperature sensor is located at a position between the second phase part and the third phase part. The electronic circuit device further comprises a control circuit part, which specifies a phase part of overheat among the phase parts based on the detection signals of the first temperature sensor and the second temperature sensor.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: September 25, 2018
    Assignee: DENSO CORPORATION
    Inventors: Yusuke Michishita, Nobuo Segawa
  • ELECTRONIC CIRCUIT DEVICE
    Publication number: 20170005463
    Abstract: An electronic circuit device comprises an output part, which includes at least three phase parts and a first temperature sensor and a second temperature sensor, which output detection signals corresponding to temperatures of the output part. Each phase part includes two high-side and low-side switching elements. The first temperature sensor is located at a position between the first phase part and the second phase part. The second temperature sensor is located at a position between the second phase part and the third phase part. The electronic circuit device further comprises a control circuit part, which specifies a phase part of overheat among the phase parts based on the detection signals of the first temperature sensor and the second temperature sensor.
    Type: Application
    Filed: March 18, 2016
    Publication date: January 5, 2017
    Inventors: Yusuke MICHISHITA, Nobuo SEGAWA
  • Electrical shield structure for pressure sensor
    Patent number: 7171856
    Abstract: A pressure sensor includes a case having a concave portion, a sensing portion disposed in the concave portion to output an electrical signal proportional to an applied pressure, a circuit portion disposed in the concave portion and connected to the sensing portion and a conductive diaphragm fixed to the case to cover the concave portion. A conductive member surrounds the sensing portion and the circuit portion to provide an electrical shield. The diaphragm is used as a part of the conductive member.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: February 6, 2007
    Assignee: Denso Corporation
    Inventors: Haruhisa Koike, Hironobu Baba, Nobuo Segawa
  • Electrical shield structure for pressure sensor
    Publication number: 20050199070
    Abstract: A pressure sensor includes a case having a concave portion, a sensing portion disposed in the concave portion to output an electrical signal proportional to an applied pressure, a circuit portion disposed in the concave portion and connected to the sensing portion and a conductive diaphragm fixed to the case to cover the concave portion. A conductive member surrounds the sensing portion and the circuit portion to provide an electrical shield. The diaphragm is used as a part of the conductive member.
    Type: Application
    Filed: March 8, 2005
    Publication date: September 15, 2005
    Inventors: Haruhisa Koike, Hironobu Baba, Nobuo Segawa