Abstract: A heat radiating substrate (10) includes an insulating layer (11) and a circuit pattern (20) of a metal formed on the insulating layer (11) in direct contact with the insulating layer (11), in which a side surface (that is, metal layer side surface (23)) of the circuit pattern (20) has a region in which an angle ? formed by a surface (insulating layer upper surface (11a)) of the insulating layer (11) (insulating substrate) and a tangential line L at a middle portion (X1) in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.

Abstract: A heat radiating substrate (10) (circuit board) includes: an insulating layer (11) (insulating substrate); and a circuit pattern (20) of a metal provided on the insulating layer (11) in direct contact with the insulating layer (11), in which the circuit pattern (20) has a first circuit pattern formed in a first region on the insulating layer (11) and a second circuit pattern (120) formed in a second region on the insulating layer (11), and the first region (that is, the first circuit pattern) surrounds and closes the second region (that is, second circuit pattern (120)) when viewed in a top view.

Abstract: A heat radiating substrate includes an insulating layer (11) (insulating substrate) and a circuit pattern (20) of a metal provided on the insulating layer (11) in direct contact with the insulating layer (11), in which a contour line of the circuit pattern (20) has a corner portion (27) that forms a curved line exhibiting a circular arc with a radius of 0.2 mm or more and 5 mm or less when viewed in a top view.

Abstract: A heat radiating substrate (10) includes an insulating layer (11) and a circuit pattern (20) of a metal formed on the insulating layer (11) in direct contact with the insulating layer (11), in which a side surface (that is, metal layer side surface (23)) of the circuit pattern (20) has a region in which an angle ? formed by a surface (insulating layer upper surface (11a)) of the insulating layer (11) (insulating substrate) and a tangential line L at a middle portion (X1) in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.

Abstract: Copolymers and compositions thereof useful for forming self-imageable films encompassing such copolymers are disclosed. Such copolymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such and maleic anhydride-type repeating units have been ring-opened. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.

Abstract: Embodiments in accordance with the present invention provide polymers for forming layers/films useful in the manufacture of a variety of types of optoelectronic displays. Such embodiments also provide compositions of such polymers for forming such layers/films where the formed layers/films have high transparency over the visible light spectrum.

Abstract: Copolymers and compositions thereof useful for forming self-imageable films encompassing such copolymers are disclosed. Such copolymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such and maleic anhydride-type repeating units have been ring-opened. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.

Abstract: Copolymers and compositions thereof useful for forming self-imageable films encompassing such copolymers are disclosed. Such copolymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such and maleic anhydride-type repeating units have been ring-opened. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.

Abstract: Copolymers and compositions thereof useful for forming self-imageable films encompassing such copolymers are disclosed. Such copolymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such and maleic anhydride-type repeating units have been ring-opened. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.

Abstract: Embodiments in accordance with the present invention provide polymers for forming layers/films useful in the manufacture of a variety of types of optoelectronic displays. Such embodiments also provide compositions of such polymers for forming such layers/films where the formed layers/films have high transparency over the visible light spectrum.