Patents by Inventor Nobuo Uotani
Nobuo Uotani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090093118Abstract: In order to polish a wiring metal, a polishing composition ensuring that etching and erosion are suppressed and the residual wiring metal on the portion other than wiring is decreased, is provided, in which a polishing composition comprising (A) an azole group-containing compound having 3 or more azole groups within the molecule and a molecular weight of 300 to 15,000, (B) an oxidant, and (C) one, two or more acids selected from the group consisting of an amino acid, an organic acid and an inorganic acid is provided.Type: ApplicationFiled: April 14, 2006Publication date: April 9, 2009Applicant: SHOWA DENKO K.K.Inventors: Nobuo Uotani, Hiroshi Takahashi, Takashi Sato, Hajime Sato
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Publication number: 20070128872Abstract: As a polishing composition which allows high-speed polishing while dishing and erosion are prevented and the flatness of metal film is maintained, there is provided a polishing composition for polishing a metal film provided on a substrate having trenches such that the metal film fills the trenches, so as to provide a planarized surface, wherein the composition comprises water, a phosphate ester having a C?6 carbon atom alkyl group in its molecule, and an etchant for the metal, and has a pH of 5 to 11.Type: ApplicationFiled: November 15, 2004Publication date: June 7, 2007Inventors: Yuji Itoh, Ayako Nishioka, Nobuo Uotani
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Publication number: 20070082456Abstract: To provide a polishing composition which allows high-speed polishing while etching and erosion are prevented and the flatness of metal film is maintained, there is provided a a polishing composition, comprising (A) a compound having three or more azole moieties, (B) an oxidizing agent, and (C) one or more species selected from among an amino acid, an organic acid, and an inorganic acid.Type: ApplicationFiled: November 15, 2004Publication date: April 12, 2007Inventors: Nobuo Uotani, Hiroshi Takahashi, Takashi Sato, Hajime Sato
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Patent number: 7018455Abstract: An ink composition, a recording medium or printed matter containing a compound expressed by General Formula 1 The compound has a weight reduction after 1 hour at 60°C. of no more than 1%. This makes it possible to provide the ink composition, a recording medium, printed matter, and an ink jet recording method wherein a light resistance of the printed matter is excellent, there is no ink clogging, and a high-quality image with almost no yellowing of the printed matter can be obtained.Type: GrantFiled: March 21, 2002Date of Patent: March 28, 2006Assignee: Seiko Epson CorporationInventors: Kazuhiko Kitamura, Yasuhiro Oki, Tetsuya Aoyama, Kyoichi Oka, Nobuo Uotani, Hiroshi Takahashi, Yuji Ito
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Patent number: 6989054Abstract: A titanium dioxide slurry for ink jet ink, which comprises water and surface-treated titanium dioxide particles dispersed in the water, the surface treatment being a treatment with an inorganic phosphoric acid compound. Also disclosed is an ink comprising the titanium dioxide slurry.Type: GrantFiled: March 12, 2002Date of Patent: January 24, 2006Assignee: Seiko Epson CorporationInventors: Seiichi Tanabe, Kiyohiko Takemoto, Seiji Mochizuki, Yasunori Yamazaki, Toshimasa Mori, Kasumi Nakamura, Nobuo Uotani, Toshio Koshikawa, Katsura Ito
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Patent number: 6952025Abstract: A small-sized semiconductor light-emitting device of high emission directivity and high output is provided. A portion of a light extraction section of a semiconductor light-emitting device including a pn-junction portion is covered with a light-shielding substance of low conductivity. The electrical resistance of the light-shielding substance is 106 ?m or higher, and the substance contains powder of at least one species selected from metals and pigments. The powder of metal contains at least one species selected from among Al, Cu, Ag, Au, Pt, Ti, Ni, Sn, Pb, Mg, Zn, Fe, Co, and Cr. The powder is a plate-like powder having a thickness falling within a range of 0.001-10 ?m and a length falling within a range of 0.01-100 ?m.Type: GrantFiled: June 5, 2001Date of Patent: October 4, 2005Assignee: Showa Denko K.K.Inventors: Takayuki Kamemura, Kazuhiro Mitani, Teruyuki Kobayashi, Nobuo Uotani, Kasumi Nakamura, Yuji Itoh
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Patent number: 6844263Abstract: The present invention provides an LSI device polishing composition containing water, abrasive grains, an organic acid, and an oxidizing agent, and having a pH of 5.5-10.0 adjusted by an alkaline substance, the LSI device polishing composition being used for polishing a copper-containing metal wiring layer in which copper is deposited on an insulating film via barrier metal formed of Ta or TaN; and a method for producing LSI devices by use of the polishing composition. During polishing of a barrier metal such as Ta or TaN and a copper wiring layer, the rate of polishing Ta or TaN can be enhanced, to thereby prevent dishing and erosion.Type: GrantFiled: February 24, 2003Date of Patent: January 18, 2005Assignee: Showa Denko Kabushiki KaishaInventors: Yoshitomo Shimazu, Takanori Kido, Nobuo Uotani
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Photosensitive composition and production processes for photosensitive film and printed wiring board
Publication number: 20040265730Abstract: The object is to provide a photosensitive resin which is improved in the environmental problem or working environment problem, reduced in the load on a production apparatus and enhanced in the safety during transportation or storage while maintaining the resolution, etching resistance and low cost of conventional liquid photosensitive resin compositions. Another object is to provide a production process of a printed wiring board, where the non-uniformity of film thickness or liquid dripping at the time of coating a photosensitive resin on a printed board by a dipping method is reduced and high quality and excellent productivity are ensured. The objects were achieved by using a photosensitive resin composition comprising a specific compound having two or more polymerizable unsaturated bonds within one molecule, a photopolymerization initiator, water, and a thixotropic agent, and, if necessary, an amine.Type: ApplicationFiled: April 20, 2004Publication date: December 30, 2004Inventors: Hiroshi Takahashi, Nobuo Uotani, Toshio Koshikawa, Tsuyoshi Katoh, Kunio Matsuki -
Patent number: 6811597Abstract: An ink composition and/or a recording medium are made to contain a compound expressed by general formula (1) and a hydrazide compound. An ink composition thereby obtained does not clog and the ink composition and recording medium thus obtained can offer high quality images that hardly cause yellowing of the resulting recording with superior light resistance. Recording and an inkjet recording method pertaining thereto are also provided.Type: GrantFiled: March 21, 2002Date of Patent: November 2, 2004Assignee: Seiko Epson CorporationInventors: Yasuhiro Oki, Kazuhiko Kitamura, Tetsuya Aoyama, Kyoichi Oka, Nobuo Uotani, Hiroshi Takahashi, Yuji Ito
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Patent number: 6761759Abstract: The ink composition of the present invention contains a coloring agent, water, a water-soluble organic solvent which is a liquid at least at temperatures of 40° C. or less, and which has a solubility of 1 wt % or greater with respect to water at a temperature of 20° C., and a saturation vapor pressure of 1.7 Pa or less at a temperature of 20° C. (with said organic solvent being contained in the ink composition at the rate of 10 to 35 wt %), and one or more amidine type compounds. As a result, the present invention provides an ink composition, a recording medium, recorded matter and an ink jet recording method that make it possible to obtain images with a high image quality which are superior in terms of the gas resistance of the recorded matter.Type: GrantFiled: March 21, 2002Date of Patent: July 13, 2004Assignee: Seiko Epson CorporationInventors: Yasuhiro Oki, Kazuhiko Kitamura, Tetsuya Aoyama, Kyoichi Oka, Nobuo Uotani, Hiroshi Takahashi, Yuji Ito
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Publication number: 20040085421Abstract: An ink composition and/or a recording medium are made to contain a compound expressed by general formula (1) and a hydrazide compound. An ink composition thereby obtained does not clog and the ink composition and recording medium thus obtained can offer high quality images that hardly cause yellowing of the resulting recording with superior light resistance. Recording and an inkjet recording method pertaining thereto are also provided.Type: ApplicationFiled: June 24, 2003Publication date: May 6, 2004Applicant: SEIKO EPSON CORPORATIONInventors: Yasuhiro Oki, Kazuhiko Kitamura, Tetsuya Aoyama, Kyoichi Oka, Nobuo Uotani, Hiroshi Takahashi, Yuji Ito
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Publication number: 20040011249Abstract: An ink composition and/or a recording medium are made to contain a compound expressed by general formula (1) and a hydrazide compound. An ink composition thereby obtained does not clog and the ink composition and recording medium thus obtained can offer high quality images that hardly cause yellowing of the resulting recording with superior light resistance. Recording and an inkjet recording method pertaining thereto are also provided.Type: ApplicationFiled: June 24, 2003Publication date: January 22, 2004Applicant: SEIKO EPSON CORPORATIONInventors: Yasuhiro Oki, Kazuhiko Kitamura, Tetsuya Aoyama, Kyoichi Oka, Nobuo Uotani, Hiroshi Takahashi, Yuji Ito
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Patent number: 6676735Abstract: An aqueous ink comprising at least a colorant, a water-soluble organic solvent and a compound represented by general formula (I) shown below, wherein said water-soluble organic solvent stays liquid at a temperature of not higher than 40° C., exhibits a water solubility of not lower than 1% by weight at a temperature of 20° C. and a saturated vapor pressure of not higher than 1.7 Pa at a temperature of 20° C. and is contained in an amount of from 5 to 35% by weight: wherein Y represents a nonmetallic atom group required to form a 5- to 7-membered ring with C and N; X represents a hydrogen atom, oxyradical group, hydroxyl group, alkyl group, alkenyl group, alkinyl group, aryl group, acyl group, sulfonyl group, sulfinyl group, alkoxy group, aryloxy group or acyloxy group; and R1 to R4 may be the same or different and each represent a hydrogen atom or alkyl group, with the proviso that any two of R1 to R4 and Y may be connected to each other to form a 5- to 7-membered ring.Type: GrantFiled: June 21, 2001Date of Patent: January 13, 2004Assignee: Seiko Epson CorporationInventors: Yasuhiro Oki, Kazuhiko Kitamura, Tetsuya Aoyama, Nobuo Uotani, Hiroshi Takahashi, Yuji Ito
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Publication number: 20030153188Abstract: The present invention provides an LSI device polishing composition containing water, abrasive grains, an organic acid, and an oxidizing agent, and having a pH of 5.5-10.0 adjusted by an alkaline substance, the LSI device polishing composition being used for polishing a copper-containing metal wiring layer in which copper is deposited on an insulating film via barrier metal formed of Ta or TaN; and a method for producing LSI devices by use of the polishing composition. During polishing of a barrier metal such as Ta or TaN and a copper wiring layer, the rate of polishing Ta or TaN can be enhanced, to thereby prevent dishing and erosion.Type: ApplicationFiled: February 24, 2003Publication date: August 14, 2003Applicant: SHOWA DENKO K.K.Inventors: Yoshitomo Shimazu, Takanori Kido, Nobuo Uotani
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Publication number: 20030125418Abstract: The present invention provides particulate alumina having a mean particle size corresponding to a volume-cumulative (50%) mean particle size (D50) of 1.5 to 4 &mgr;m and a ratio (D90/D1O) of D90 to D10 of 2.5 or less. The alumina contains secondary particles having a particle size of at least 10 &mgr;m in an amount of 0.1 mass % or less; secondary particles having a particle size of 0.5 &mgr;m or less in an amount of 5 mass % or less; and an &agr;-phase as a predominant phase.fluoride. The present invention also provides a method for producing the particulate alumina.Type: ApplicationFiled: October 10, 2002Publication date: July 3, 2003Applicant: SHOW A DENKO K.K.Inventors: Susumu Shibusawa, Hidetoshi Okamoto, Hiroshi Takahashi, Nobuo Uotani, Koichiro Take
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Publication number: 20030070582Abstract: A compound expressed by General Formula 1, whose weight reduction after 1 hour at 60° C. is no more than 1%, is contained in an ink composition and/or a recording medium. This makes it possible to provide an ink composition, a recording medium, printed matter, and an ink jet recording method with which the light resistance of the printed matter is excellent, there is no ink clogging, and a high-quality image with almost no yellowing of the printed matter can be obtained.Type: ApplicationFiled: March 21, 2002Publication date: April 17, 2003Applicant: SEIKO EPSON CORPORATIONInventors: Kazuhiko Kitamura, Yasuhiro Oki, Tetsuya Aoyama, Kyoichi Oka, Nobuo Uotani, Hiroshi Takahashi, Yuji Ito
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Patent number: 6547843Abstract: The present invention provides an LSI device polishing composition containing water, abrasive grains, an organic acid, and an oxidizing agent, and having a pH of 5.5-10.0 adjusted by an alkaline substance, the LSI device polishing composition being used for polishing a copper-containing metal wiring layer in which copper is deposited on an insulating film via barrier metal formed of Ta or TaN; and a method for producing LSI devices by use of the polishing composition. During polishing of a barrier metal such as Ta or TaN and a copper wiring layer, the rate of polishing Ta or TaN can be enhanced, to thereby prevent dishing and erosion.Type: GrantFiled: July 2, 2001Date of Patent: April 15, 2003Assignee: Showa Denko K.K.Inventors: Yoshitomo Shimazu, Takanori Kido, Nobuo Uotani
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Publication number: 20030052952Abstract: A titanium dioxide slurry for ink jet ink, which comprises water and surface-treated titanium dioxide particles dispersed in the water, the surface treatment being a treatment with an inorganic phosphoric acid compound. Also disclosed is an ink comprising the titanium dioxide slurry.Type: ApplicationFiled: March 12, 2002Publication date: March 20, 2003Applicant: SEIKO EPSON CORPORATIONInventors: Seiichi Tanabe, Kiyohiko Takemoto, Seiji Mochizuki, Yasunori Yamazaki, Toshimasa Mori, Kasumi Nakamura, Nobuo Uotani, Toshio Koshikawa, Katsura Ito
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Publication number: 20030010253Abstract: The ink composition of the present invention contains a coloring agent, water, a water-soluble organic solvent which is a liquid at least at temperatures of 40° C. or less, and which has a solubility of 1 wt % or greater with respect to water at a temperature of 20° C., and a saturation vapor pressure of 1.7 Pa or less at a temperature of 20° C. (with said organic solvent being contained in the ink composition at the rate of 10 to 35 wt %), and one or more amidine type compounds. As a result, the present invention provides an ink composition, a recording medium, recorded matter and an ink jet recording method that make it possible to obtain images with a high image quality which are superior in terms of the gas resistance of the recorded matter.Type: ApplicationFiled: March 21, 2002Publication date: January 16, 2003Applicant: SEIKO EPSON CORPORATIONInventors: Yasuhiro Oki, Kazuhiko Kitamura, Tetsuya Aoyama, Kyoichi Oka, Nobuo Uotani, Hiroshi Takahashi, Yuji Ito
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Publication number: 20030007890Abstract: By forming a detection-membrane with a light reflective layer in which the detection-membrane is a multilayer construction with a protective layer, a detection-membrane can be provided which is able to be used favorably within an optical sensor, will suffer no reduction in mechanical strength as a result of external factors such as physical pressure, high temperature, high humidity or the like, and will cause no deterioration in the characteristics of an optical sensor, and an optical sensor which utilizes such a detection-membrane can also be provided.Type: ApplicationFiled: April 4, 2001Publication date: January 9, 2003Inventors: Kazuhiro Mitani, Teruyuki Kobayashi, Takayuki Kamemura, Nobuo Uotani, Yuji Itoh