Patents by Inventor Noburu Moriuchi

Noburu Moriuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method
    Patent number: 5959011
    Abstract: A method for removing a resist pattern formed on a semiconductor wafer, and a curable pressure-sensitive adhesive, adhesive sheets and an apparatus used for the method. The resist-removing method comprising adhering an adhesive tape on an upper surface of a resist pattern formed on an article and peeling off the resist pattern together with the adhesive tape; the curable pressure-sensitive adhesive constituting the adhesive tape, comprising a pressure-sensitive adhesive polymer containing a non-volatile compound having at least one unsaturated double bond in the molecule and having a good affinity with a resist material to be removed; the adhesive sheet comprising a film substrate having formed thereon the curable pressure-sensitive adhesive; and the resist-removing apparatus comprising a means for press-adhering the adhesive tape, a tape-peeling means, and a substrate-washing means.
    Type: Grant
    Filed: November 18, 1996
    Date of Patent: September 28, 1999
    Assignees: Nitto Denko Corporation, Hitachi, Ltd.
    Inventors: Fumio Mizuno, Noburu Moriuchi, Seiichiro Shirai, Yutaka Moroishi, Makoto Sunakawa, Michirou Kawanishi