Patents by Inventor Nobushige Moriwaki
Nobushige Moriwaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6661641Abstract: In a terminal member, a protuberance is formed so as to protrude toward an external electrode, and thereby, a bonding portion where the terminal member is bonded to the external electrode, the bonding portion being formed with solder, is extended substantially linearly across a part of the external electrode. Preferably, the direction in which the bonding portion is elongated linearly is in parallel to that in which internal electrodes are extended. Further, it is preferable that the bonding portion is as wide as possible, and the center of the bonding portion in the width direction is as near to the center of the end-face of the capacitor body as possible.Type: GrantFiled: July 26, 2002Date of Patent: December 9, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobushige Moriwaki, Yasuhiko Kubota, Kazuhiro Yoshida, Kenichi Watanabe, Shigeki Nishiyama
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Patent number: 6583981Abstract: A ceramic condenser module includes at least one first multi-layered ceramic condenser and at least one second multi-layered ceramic condenser, which are mounted to a front surface and a back surface of a substrate, respectively. When a total surface area of the outside surfaces of the mounted first and second multi-layered ceramic condensers excluding surfaces thereof opposing the substrate is defined as S2, and a total equal to S2 and a surface area of the outside surface of the substrate excluding the area covered by the first and second multi-layered ceramic condensers is defined as S1, S1 is equal to or greater than about 1.3 times S2. With this arrangement, the ceramic condenser module is suitable for use with large amounts of current, has excellent heat-dissipation effect, is much smaller and much less expensive.Type: GrantFiled: November 27, 2001Date of Patent: June 24, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobushige Moriwaki, Masahiro Nishio, Kazuhiro Yoshida, Kazuyuki Kubota, Shigeki Nishiyama
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Patent number: 6574089Abstract: In a terminal member, a protuberance is formed so as to protrude toward an external electrode, and thereby, a bonding portion where the terminal member is bonded to the external electrode, the bonding portion being formed with solder, is extended substantially linearly across a part of the external electrode. Preferably, the direction in which the bonding portion is elongated linearly is in parallel to that in which internal electrodes are extended. Further, it is preferable that the bonding portion is as wide as possible, and the center of the bonding portion in the width direction is as near to the center of the end-face of the capacitor body as possible.Type: GrantFiled: December 15, 1999Date of Patent: June 3, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobushige Moriwaki, Yasuhiko Kubota, Kazuhiro Yoshida, Kenichi Watanabe, Shigeki Nishiyama
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Patent number: 6574116Abstract: An inverter capacitor module includes a plurality of substrates having a plurality of ceramic capacitors provided on the top surfaces thereof, and first and second feeding unit lands having conductive films provided on both surfaces thereof and arranged to feed the plurality of ceramic capacitors, the first and second feeding unit lands on both surfaces thereof being electrically connected to each other, a conductive spacer inserted between the plurality of substrates for establishing one of an electrical connection between the first feeding unit lands of an underlying substrate and its overlying substrate and an electrical connection between the second feeding unit lands of an underlying substrate and its overlying substrate, a fixing member arranged to fix the plurality of substrates laminated via the conductive spacer, and a switching module fixed below the bottom substrate among the plurality of substrates that are laminated.Type: GrantFiled: May 25, 2001Date of Patent: June 3, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobushige Moriwaki, Shigeki Nishiyama, Kazuhiro Yoshida, Masahiro Nishio, Kazuyuki Kubota
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Patent number: 6570774Abstract: The present invention provides a small-sized capacitor module for use in an inverter, which is capable of suppressing the occurrence of unwanted inductance components in an electric connection path and which is suitable for a large current use. The present capacitor module is constituted by: mounting a plurality of ceramic capacitors 3 having first and second terminals 3a and 3b on the first surface 1 of a substrate 2; forming a first conductor 12 on the first surface of the substrate 2; forming a second conductor 14 on the second surface of the substrate 2; electrically connecting first and second terminals 3a and 3b to the first conductor 12 and the second conductor 14, respectively; forming, on the substrate 2, first and second terminal mounting portions where the respective first and second terminals of a switching module are mounted; and electrically connecting the first and second terminal mounting portions to the first and second conductors 12 and 14, respectively.Type: GrantFiled: March 16, 2000Date of Patent: May 27, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobushige Moriwaki, Shigeki Nishiyama
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Patent number: 6518632Abstract: A ceramic electronic part wherein widths of portions of external terminals that are joined to end surfaces of a ceramic electronic part element are made equal to or less than widths of internal electrodes disposed in the ceramic electronic part element. The joining portions of the external terminals are joined to the end surfaces of the ceramic electronic part element so as to be positioned within areas of the end surfaces of the ceramic electronic part element where the internal electrodes are exposed when viewed in a plane. The ceramic electronic part with the external terminal is a highly reliable one and makes it possible to prevent cracking of a ceramic part element even when the ceramic electronic part is large.Type: GrantFiled: January 28, 2000Date of Patent: February 11, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Kazuhiro Yoshida, Nobushige Moriwaki, Yasuhiko Kubota
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Patent number: 6515844Abstract: An electronic part in which an external terminal made of a metallic plate provided with at least one slit is on an electronic part element via a conductive joint member.Type: GrantFiled: April 22, 1999Date of Patent: February 4, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobushige Moriwaki, Kazuhiro Yoshida, Kenichi Watanabe, Akio Shobu, Mitsuru Nagashima, Yukio Tanaka
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Publication number: 20030011959Abstract: In a terminal member, a protuberance is formed so as to protrude toward an external electrode, and thereby, a bonding portion where the terminal member is bonded to the external electrode, the bonding portion being formed with solder, is extended substantially linearly across a part of the external electrode. Preferably, the direction in which the bonding portion is elongated linearly is in parallel to that in which internal electrodes are extended. Further, it is preferable that the bonding portion is as wide as possible, and the center of the bonding portion in the width direction is as near to the center of the end-face of the capacitor body as possible.Type: ApplicationFiled: July 26, 2002Publication date: January 16, 2003Applicant: Murata Manufacturing Co., Ltd.Inventors: Nobushige Moriwaki, Yasuhiko Kubota, Kazuhiro Yoshida, Kenichi Watanabe, Shigeki Nishiyama
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Patent number: 6473292Abstract: Both of the longitudinal dimension L and the widthwise dimension W of a capacitor body are at least four times the thickness-wise dimension T, respectively. Preferably, the widthwise dimension W of the capacitor body 2 is greater than the longitudinal dimension L.Type: GrantFiled: December 20, 1999Date of Patent: October 29, 2002Assignee: Murata Manufacturing Co., Ltd.Inventors: Kazuhiro Yoshida, Shigeki Nishiyama, Nobushige Moriwaki, Takeshi Azumi, Yasuhiko Kubota, Yoshihiro Omura, Kazuyuki Kubota
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Publication number: 20020084091Abstract: A ceramic condenser module includes at least one first multi-layered ceramic condenser and at least one second multi-layered ceramic condenser, which are mounted to a front surface and a back surface of a substrate, respectively. When a total surface area of the outside surfaces of the mounted first and second multi-layered ceramic condensers excluding surfaces thereof opposing the substrate is defined as S2, and a total equal to S2 and a surface area of the outside surface of the substrate excluding the area covered by the first and second multi-layered ceramic condensers is defined as S1, S1 is equal to or greater than about 1.3 times S2. With this arrangement, the ceramic condenser module is suitable for use with large amounts of current, has excellent heat-dissipation effect, is much smaller and much less expensive.Type: ApplicationFiled: November 27, 2001Publication date: July 4, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Nobushige Moriwaki, Masahiro Nishio, Kazuhiro Yoshida, Kazuyuki Kubota, Shigeki Nishiyama
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Publication number: 20020048142Abstract: A first metallic terminal plate is joined to a first side-face of an electronic chip formed by lamination of lamination-capacitors as plural electronic elements, and a second terminal plate to the second side-face of the chip. The first and second metallic terminal plates comprises first terminal plate portions joined to the first and second side-faces, respectively, and the second terminal plate portions bent along the lower edges of the first terminal plate portions toward the opposed side-faces, respectively and elongated from the range under the electronic chip to be out of the range in the width direction.Type: ApplicationFiled: July 8, 1999Publication date: April 25, 2002Inventors: NOBUSHIGE MORIWAKI, KAZUHIRO YOSHIDA, KENICHI WATANABE, AKIO SHOBU, OSAMU YAMAOKA, YUKIO TANAKA
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Patent number: 6362948Abstract: A first metallic terminal plate is joined to a first side-face of an electronic chip formed by lamination of lamination-capacitors as plural electronic elements, and a second terminal plate to the second side-face of the chip. The first and second metallic terminal plates comprises first terminal plate portions joined to the first and second side-faces, respectively, and the second terminal plate portions bent along the lower edges of the first terminal plate portions toward the opposed side-faces, respectively and elongated from the range under the electronic chip to be out of the range in the width direction.Type: GrantFiled: July 8, 1999Date of Patent: March 26, 2002Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobushige Moriwaki, Kazuhiro Yoshida, Kenichi Watanabe, Akio Shobu, Osamu Yamaoka, Yukio Tanaka
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Publication number: 20010055194Abstract: An inverter capacitor module includes a plurality of substrates having a plurality of ceramic capacitors provided on the top surfaces thereof, and first and second feeding unit lands having conductive films provided on both surfaces thereof and arranged to feed the plurality of ceramic capacitors, the first and second feeding unit lands on both surfaces thereof being electrically connected to each other, a conductive spacer inserted between the plurality of substrates for establishing one of an electrical connection between the first feeding unit lands of an underlying substrate and its overlying substrate and an electrical connection between the second feeding unit lands of an underlying substrate and its overlying substrate, a fixing member arranged to fix the plurality of substrates laminated via the conductive spacer, and a switching module fixed below the bottom substrate among the plurality of substrates that are laminated.Type: ApplicationFiled: May 25, 2001Publication date: December 27, 2001Applicant: Murata Manufacturing Co., LtdInventors: Nobushige Moriwaki, Shigeki Nishiyama, Kazuhiro Yoshida, Masahiro Nishio, Kazuyuki Kubota
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Patent number: 6288887Abstract: A ceramic electronic component satisfies a condition expressed by H1≧0.03L, wherein H1is the distance between the surface of a substrate on which the ceramic electronic component is mounted and a point P at which outer terminals connecting the ceramic electronic component to the substrate first contacts the side surfaces of the ceramic electronic component and L is the length of the ceramic electronic component. The ceramic electronic component also satisfies a condition expressed by H2≧2t wherein H2is the distance from a lower surface of the ceramic electronic element 4 to the surface of the substrate 7 and t is the thickness of the outer terminals.Type: GrantFiled: February 9, 2000Date of Patent: September 11, 2001Assignee: Murata Manufacturing Co., Ltd.Inventors: Kazuhiro Yoshida, Nobushige Moriwaki, Yasuhiko Kubota
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Patent number: 6259593Abstract: A coating layer composed of a solder containing tin as the major component and a metal such as copper or silver which is the same as that contained in a external electrode in an amount greater than the eutectic concentration, is formed on the external electrode. The solder can suppress the solid-phase diffusion without formation of the barrier layer.Type: GrantFiled: December 14, 1999Date of Patent: July 10, 2001Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobushige Moriwaki, Shigeki Nishiyama