Abstract: A light emitting element of one or more embodiments includes a first electrode, a second electrode oppositely to the first electrode, and an emission layer between the first electrode and the second electrode. The light emitting element of one or more embodiments includes a polycyclic compound represented by a specific chemical structure in the emission layer, thereby showing improved emission efficiency and life characteristics.

Abstract: A substrate with built-in component includes: a first wiring layer having at least one reference pattern; a first insulating layer formed on the first wiring layer; and an electronic component mounted, in a cavity formed in the first insulating layer, on the first wiring layer, wherein the at least one reference pattern includes at least one first portion crossing a side surface of the electronic component in plan view, and at least one second portion crossing a side surface of the cavity in plan view.

Abstract: A wiring substrate includes a pad including an opening formed to penetrate the pad, a first insulation layer having a cavity to which the pad is exposed, an electronic component mounted on the pad exposed in the cavity, and a second insulation layer formed on the first insulation layer with covering the electronic component. The opening is formed so as to penetrate the pad which is exposed in the cavity. The electronic component is mounted on the pad so that the opening is exposed. An outermost layer of the electronic component includes a concave portion having a predetermined volume distribution. A position and a size of the opening are determined based on the predetermined volume distribution. The second insulation layer is provided in the concave portion, in a gap between a side surface of the electronic component and an inner wall surface of the cavity, and in the opening.

Abstract: A substrate with built-in component includes: a first wiring layer having at least one reference pattern; a first insulating layer formed on the first wiring layer; and an electronic component mounted, in a cavity formed in the first insulating layer, on the first wiring layer, wherein the at least one reference pattern includes at least one first portion crossing a side surface of the electronic component in plan view, and at least one second portion crossing a side surface of the cavity in plan view.

Abstract: A wiring substrate includes a first insulating layer including a cavity, an electronic component in the cavity, and a second insulating layer on the first insulating layer. The second insulating layer covers the electronic component. A recess having a predetermined volume distribution is formed in an outermost layer of the electronic component that defines a surface of the electronic component facing away from the bottom of the cavity. The width of the gap between the side surface of the electronic component and the inner wall surface of the cavity in a plan view is determined based on the predetermined volume distribution. The second insulating layer is in the recess and the gap.

Abstract: A wiring substrate includes a pad including an opening formed to penetrate the pad, a first insulation layer having a cavity to which the pad is exposed, an electronic component mounted on the pad exposed in the cavity, and a second insulation layer formed on the first insulation layer with covering the electronic component. The opening is formed so as to penetrate the pad which is exposed in the cavity. The electronic component is mounted on the pad so that the opening is exposed. An outermost layer of the electronic component includes a concave portion having a predetermined volume distribution. A position and a size of the opening are determined based on the predetermined volume distribution. The second insulation layer is provided in the concave portion, in a gap between a side surface of the electronic component and an inner wall surface of the cavity, and in the opening.

Abstract: A wiring substrate includes a first insulating layer including a cavity, an electronic component in the cavity, and a second insulating layer on the first insulating layer. The second insulating layer covers the electronic component. A recess having a predetermined volume distribution is formed in an outermost layer of the electronic component that defines a surface of the electronic component facing away from the bottom of the cavity. The width of the gap between the side surface of the electronic component and the inner wall surface of the cavity in a plan view is determined based on the predetermined volume distribution. The second insulating layer is in the recess and the gap.