Abstract: A sub-fab area installation apparatus capable of reducing a power consumption used in manufacturing of semiconductors is disclosed. The sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chamber; a heating unit configured to heat a second circulation liquid used in the processing chamber; an abatement device configured to detoxify the processing gas discharged from the vacuum pump; and a cooling-liquid line configured to pass a cooling liquid therethrough. The cooling liquid is supplied from a cooling source. The cooling-liquid line includes: a first downstream line, a second downstream line, and a third downstream line configured to supply the cooling liquid that has passed through the abatement device, the vacuum pump, and the cooling unit to the heating unit.

Abstract: A sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chamber; a heating unit configured to heat a second circulation liquid used in the processing chamber; and a cooling-liquid line configured to pass a cooling liquid therethrough. The cooling liquid is supplied from a cooling source. The cooling-liquid line includes: a distribution line configured to supply the cooling liquid to the vacuum pump and the cooling unit; and a merging return line configured to merge the cooling liquid that has passed through the vacuum pump and the cooling unit and return the cooling liquid to the cooling source.

Abstract: A multi-refrigeration-cycle apparatus capable of reducing an installation area for equipment installed in a sub-fab and capable of shortening a pipe for delivering a cooling medium to a semiconductor-device manufacturing equipment is disclosed. The multi-refrigeration-cycle apparatus includes: a first refrigeration cycle having a first refrigerant for performing heat exchange with a cooling medium for cooling the semiconductor-device manufacturing equipment, the first refrigerant circulating in the first refrigeration cycle; and a second refrigeration cycle having a second refrigerant for performing heat exchange with the first refrigerant, the second refrigerant circulating in the second refrigeration cycle. At least a part of the first refrigeration cycle is arranged in a clean room where the semiconductor-device manufacturing equipment is installed, and the second refrigeration cycle is arranged in a sub-fab.