Patents by Inventor Nobutaka Imai

Nobutaka Imai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6730869
    Abstract: A first conductive member and a second conductive member are disposed on a first face of a circuit board. A click spring is disposed on the first conductive member and deformed so as to establish an electrical contact between the first conductive member and the second conductive member, when a depressing force is applied thereto. An insulating film is disposed above the click spring. A spacer is interposed between the insulating film and the circuit board such that a first face thereof opposes to a first face of the insulating film and a second face thereof opposes to the first face of the circuit board. An adhesive layer is interposed between the first face of the circuit board and the second face of the spacer. The first adhesive layer has a viscosity such an extent that the spacer and the circuit board are detached from each other without damage.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: May 4, 2004
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Shuji Teruyama, Hiroshi Hirahata, Nobutaka Imai
  • Publication number: 20030079979
    Abstract: A first conductive member and a second conductive member are disposed on a first face of a circuit board. A click spring is disposed on the first conductive member and deformed so as to establish an electrical contact between the first conductive member and the second conductive member, when a depressing force is applied thereto. An insulating film is disposed above the click spring. A spacer is interposed between the insulating film and the circuit board such that a first face thereof opposes to a first face of the insulating film and a second face thereof opposes to the first face of the circuit board. An adhesive layer is interposed between the first face of the circuit board and the second face of the spacer. The first adhesive layer has a viscosity such an extent that the spacer and the circuit board are detached from each other without damage.
    Type: Application
    Filed: October 24, 2002
    Publication date: May 1, 2003
    Inventors: Shuji Teruyama, Hiroshi Hirahata, Nobutaka Imai
  • Publication number: 20030042121
    Abstract: In a push switch, a hemispherical click spring is always connected to a first contact electrically. When a key top is depressed, the click spring is brought into contact with a second contact so that the first contact and the second contact are electrically connected. A bottom portion of the key top is bonded to a center portion of an upper face of the click spring with an adhesive agent.
    Type: Application
    Filed: August 15, 2002
    Publication date: March 6, 2003
    Inventors: Hiroshi Hirahata, Shuji Teruyama, Nobutaka Imai