Abstract: An electronic component unit includes a semiconductor package mounted on a front surface of a substrate, a heat sink including a pushing plate installed on the semiconductor package, a reinforcing plate disposed on a back surface of the substrate, and a plurality of fasteners that connect corner portions of the pushing plate and the reinforcing plate to each other, wherein the semiconductor package is pressed and fixed on the substrate by fastening the plurality of fasteners, and the reinforcing plate includes a base plate portion including a connection portion to which each of the plurality of fasteners is connected, and a pressing plate portion which is disposed at a planar central side of the base plate portion, and separably laminated on the base plate portion to press the back surface of the substrate.

Abstract: A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.

Abstract: A numerical analysis data creating method creates numerical analysis data that are obtained by analyzing an analyzing target. The method judges whether or not to create the numerical analysis data of the analyzing target using data that have been stored in a database part, searches the database part based on information related to the analyzing target and displaying a search result if the numerical analysis data of the analyzing target are to be created using the stored data, and creates and stores in the database part the numerical analysis data of the analyzing target by modifying usable data if necessary, when the usable data exist in the search result. The data that have been stored in the database part include numerical analysis data, analysis model data, material characteristic data and attribute data with respect to targets that have been analyzed.

Abstract: A substrate includes a first plate member; a plurality of first electrodes provided on the major surface of the first plate member, the first electrodes including at least one electrode for circuit connection and at least one monitor electrode separate from the electrode for circuit connection; a second plate member; a plurality of second electrodes provided on the major surface of the second plate member; a plurality of solder members provided between the first electrodes and the second electrodes for electrical connection therebetween, repeatedly; and a detector for detecting an electrical disconnection between at least one of the monitor electrode and the second electrode.

Abstract: An electronic device includes, a circuit board including a through hole, a member including a screw hole, a screw including a screw body having an outer diameter smaller than an inner diameter of the through hole and a screw head having an outer diameter larger than the inner diameter of the through hole, wherein the screw body penetrates through the through hole to engage with the screw hole and the screw head is disposed on an opposite side of the circuit board to the member, and a first washer provided between the screw head and the circuit board, the first washer including a first washer body and a plurality of first washer legs extending from the first washer body toward the circuit board, the first washer legs being in contact with the circuit board and having a characteristic of reducing stress on the circuit board upon being heated.

Abstract: An analysis apparatus includes an assignor assigning a physical property value corresponding to the kind of a material to each of regions formed by dividing a structural data representing a structure of a multilayer substrate, a determiner determining whether or not the each of the region belongs to a predetermined region in a layer of a predetermined kind, and a physical property value changer changing the physical property value of the region belonging to a predetermined region in a layer of a predetermined kind.

Abstract: A connector includes a contact pin in which a free end projecting from a supporting member comes into contact with an electrode of a first object and a second object, and a bending part is provided onto a base end such that the connector has an inclination against the first object and the second object. The rigidity of the bending parts is selectively set to be high by selectively increasing a thickness of the bending part.

Abstract: A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.

Abstract: A first generation portion divides an object to be analyzed into a plurality of finite elements to generate element division data. A first calculation portion defines and calculates a plurality of meshes dividing the object to be analyzed into units larger than the finite elements. A second generation portion assumes that a friction layer which has a thickness of “0” and a friction coefficient between a conductive material and a composite material of a predetermined value less than 1 exists at the interface between the conductive material and the composite material, and the second generation portion generates mesh data. A second calculation portion uses various solvers to calculate the physical amounts produced in the object to be analyzed on the basis of the mesh data and outputs the analysis result. In other words, the second calculation portion performs a simulation of the behavior of the object to be analyzed.

Abstract: An electronic device includes, a circuit board including a through hole, a member including a screw hole, a screw including a screw body having an outer diameter smaller than an inner diameter of the through hole and a screw head having an outer diameter larger than the inner diameter of the through hole, wherein the screw body penetrates through the through hole to engage with the screw hole and the screw head is disposed on an opposite side of the circuit board to the member, and a first washer provided between the screw head and the circuit board, the first washer including a first washer body and a plurality of first washer legs extending from the first washer body toward the circuit board, the first washer legs being in contact with the circuit board and having a characteristic of reducing stress on the circuit board upon being heated.

Abstract: A substrate includes a first plate member; a plurality of first electrodes provided on the major surface of the first plate member, the first electrodes including at least one electrode for circuit connection and at least one monitor electrode separate from the electrode for circuit connection; a second plate member; a plurality of second electrodes provided on the major surface of the second plate member; a plurality of solder members provided between the first electrodes and the second electrodes for electrical connection therebetween, repeatedly; and a detector for detecting an electrical disconnection between at least one of the monitor electrode and the second electrode.

Abstract: A structural analysis method that saves analysis time without lowering the prediction accuracy is provided. The structural analysis method has dividing up the analysis target into a plurality of finite elements; defining a plurality of meshes that divide up the analysis target into units larger than the finite elements and calculating, for each mesh, the proportion of one material among the plurality of materials that occupy the finite element contained in the mesh; specifying a mesh in which the calculated proportion of the one material exceeds a predetermined threshold value and generating mesh data by substituting material information specifying materials other than the one material with material information of the materials of the finite elements contained in the specified mesh; and calculating the physical amount yielded in the analysis target on the basis of the generated mesh data.

Abstract: An analysis apparatus includes an assignor assigning a physical property value corresponding to the kind of a material to each of regions formed by dividing a structural data representing a structure of a multilayer substrate, a determiner determining whether or not the each of the region belongs to a predetermined region in a layer of a predetermined kind, and a physical property value changer changing the physical property value of the region belonging to a predetermined region in a layer of a predetermined kind.

Abstract: A connector includes a contact pin in which a free end projecting from a supporting member comes into contact with an electrode of a first object and a second object, and a bending part is provided onto a base end such that the connector has an inclination against the first object and the second object. The rigidity of the bending parts is selectively set to be high by selectively increasing a thickness of the bending part.

Abstract: An analysis-model-producing apparatus for producing an analysis model from a shape model, comprising means for specifying a deletion method for deleting, from geometric shape data constituting the shape model, geometric shape data that is unnecessary to production of an analysis model, and means for deleting unnecessary data, using the specified deletion method.

Abstract: A first generation portion divides an object to be analyzed into a plurality of finite elements to generate element division data. A first calculation portion defines and calculates a plurality of meshes dividing the object to be analyzed into units larger than the finite elements. A second generation portion assumes that a friction layer which has a thickness of “0” and a friction coefficient between a conductive material and a composite material of a predetermined value less than 1 exists at the interface between the conductive material and the composite material, and the second generation portion generates mesh data. A second calculation portion uses various solvers to calculate the physical amounts produced in the object to be analyzed on the basis of the mesh data and outputs the analysis result. In other words, the second calculation portion performs a simulation of the behavior of the object to be analyzed. The simulation is performed within an arbitrary temperature range set by a user.

Abstract: An evaluation method including associating the function blocks of the same kind in the first data and the second data is provided. The evaluation method includes specifying a specified function block from the function blocks, creating third data based on the first data and the specified function block of the second data, executing numeric analysis on the third data, comparing a numeric analysis data of the first data with a numeric analysis data of the third data and storing or displaying a comparison result.

Abstract: The present invention relates to optimization analysis achieving a target value and provides a device, method and program ensuring improved analysis efficiency and analysis accuracy. The device includes an analysis unit (CPU 14), an evaluation unit (CPU 14) and a condition modification unit (CPU 14). The analysis unit executes an analysis with analysis conditions imparted thereto. The evaluation unit evaluates the analysis results. The condition modification unit modifies the analysis conditions imparted to the analysis unit, based on the evaluation results. An optimum solution is thus derived by performing one or more analyses through the modification of the given analysis conditions.

Abstract: A printed circuit board includes a product portion and a backing plate. Upper and lower surfaces of the backing plate are coated with solder masks with different material characteristics.

Abstract: A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts piercing the insulation layers. In the multilayer interconnection board, 0<L2?(L1/3) is set, where L1 denotes the distance between center positions of a pair of neighboring via forming parts formed in the same insulation layer and L2 denotes the shortest separation distance between the pair of the via forming parts.