Patents by Inventor Nobutaka Itoh

Nobutaka Itoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140239488
    Abstract: An electronic component unit includes a semiconductor package mounted on a front surface of a substrate, a heat sink including a pushing plate installed on the semiconductor package, a reinforcing plate disposed on a back surface of the substrate, and a plurality of fasteners that connect corner portions of the pushing plate and the reinforcing plate to each other, wherein the semiconductor package is pressed and fixed on the substrate by fastening the plurality of fasteners, and the reinforcing plate includes a base plate portion including a connection portion to which each of the plurality of fasteners is connected, and a pressing plate portion which is disposed at a planar central side of the base plate portion, and separably laminated on the base plate portion to press the back surface of the substrate.
    Type: Application
    Filed: February 3, 2014
    Publication date: August 28, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Yoko KOBAYASHI, Tsuyoshi SO, Nobutaka ITOH, Yoshiteru OCHI, Katsuhiko NAKATA
  • Patent number: 8744810
    Abstract: A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: June 3, 2014
    Assignee: Fujitsu Limited
    Inventors: Nobutaka Itoh, Makoto Sakairi, Mami Nakadate, Yoshiteru Ochi, Akiyoshi Saitou
  • Patent number: 8533184
    Abstract: A numerical analysis data creating method creates numerical analysis data that are obtained by analyzing an analyzing target. The method judges whether or not to create the numerical analysis data of the analyzing target using data that have been stored in a database part, searches the database part based on information related to the analyzing target and displaying a search result if the numerical analysis data of the analyzing target are to be created using the stored data, and creates and stores in the database part the numerical analysis data of the analyzing target by modifying usable data if necessary, when the usable data exist in the search result. The data that have been stored in the database part include numerical analysis data, analysis model data, material characteristic data and attribute data with respect to targets that have been analyzed.
    Type: Grant
    Filed: August 16, 2006
    Date of Patent: September 10, 2013
    Assignee: Fujitsu Limited
    Inventors: Yoko Kobayashi, Nobutaka Itoh
  • Patent number: 8482291
    Abstract: A substrate includes a first plate member; a plurality of first electrodes provided on the major surface of the first plate member, the first electrodes including at least one electrode for circuit connection and at least one monitor electrode separate from the electrode for circuit connection; a second plate member; a plurality of second electrodes provided on the major surface of the second plate member; a plurality of solder members provided between the first electrodes and the second electrodes for electrical connection therebetween, repeatedly; and a detector for detecting an electrical disconnection between at least one of the monitor electrode and the second electrode.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: July 9, 2013
    Assignee: Fujitsu Limited
    Inventors: Nobutaka Itoh, Makoto Sakairi, Mami Nakadate
  • Patent number: 8378220
    Abstract: An electronic device includes, a circuit board including a through hole, a member including a screw hole, a screw including a screw body having an outer diameter smaller than an inner diameter of the through hole and a screw head having an outer diameter larger than the inner diameter of the through hole, wherein the screw body penetrates through the through hole to engage with the screw hole and the screw head is disposed on an opposite side of the circuit board to the member, and a first washer provided between the screw head and the circuit board, the first washer including a first washer body and a plurality of first washer legs extending from the first washer body toward the circuit board, the first washer legs being in contact with the circuit board and having a characteristic of reducing stress on the circuit board upon being heated.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: February 19, 2013
    Assignee: Fujitsu Limited
    Inventors: Yoshiteru Ochi, Nobutaka Itoh, Makoto Sakairi
  • Patent number: 8260571
    Abstract: An analysis apparatus includes an assignor assigning a physical property value corresponding to the kind of a material to each of regions formed by dividing a structural data representing a structure of a multilayer substrate, a determiner determining whether or not the each of the region belongs to a predetermined region in a layer of a predetermined kind, and a physical property value changer changing the physical property value of the region belonging to a predetermined region in a layer of a predetermined kind.
    Type: Grant
    Filed: July 20, 2009
    Date of Patent: September 4, 2012
    Assignee: Fujitsu Limited
    Inventors: Tetsuyuki Kubota, Nobutaka Itoh
  • Patent number: 8083528
    Abstract: A connector includes a contact pin in which a free end projecting from a supporting member comes into contact with an electrode of a first object and a second object, and a bending part is provided onto a base end such that the connector has an inclination against the first object and the second object. The rigidity of the bending parts is selectively set to be high by selectively increasing a thickness of the bending part.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: December 27, 2011
    Assignee: Fujitsu Limited
    Inventors: Makoto Sakairi, Nobutaka Itoh, Yoshiteru Ochi, Yoko Kobayashi
  • Publication number: 20110208485
    Abstract: A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.
    Type: Application
    Filed: February 9, 2011
    Publication date: August 25, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Nobutaka ITOH, Makoto Sakairi, Mami Nakadate, Yoshiteru Ochi, Akiyoshi Saitou
  • Patent number: 7996196
    Abstract: A first generation portion divides an object to be analyzed into a plurality of finite elements to generate element division data. A first calculation portion defines and calculates a plurality of meshes dividing the object to be analyzed into units larger than the finite elements. A second generation portion assumes that a friction layer which has a thickness of “0” and a friction coefficient between a conductive material and a composite material of a predetermined value less than 1 exists at the interface between the conductive material and the composite material, and the second generation portion generates mesh data. A second calculation portion uses various solvers to calculate the physical amounts produced in the object to be analyzed on the basis of the mesh data and outputs the analysis result. In other words, the second calculation portion performs a simulation of the behavior of the object to be analyzed.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: August 9, 2011
    Assignee: Fujitsu Limited
    Inventors: Daisuke Mizutani, Nobutaka Itoh
  • Publication number: 20110085305
    Abstract: An electronic device includes, a circuit board including a through hole, a member including a screw hole, a screw including a screw body having an outer diameter smaller than an inner diameter of the through hole and a screw head having an outer diameter larger than the inner diameter of the through hole, wherein the screw body penetrates through the through hole to engage with the screw hole and the screw head is disposed on an opposite side of the circuit board to the member, and a first washer provided between the screw head and the circuit board, the first washer including a first washer body and a plurality of first washer legs extending from the first washer body toward the circuit board, the first washer legs being in contact with the circuit board and having a characteristic of reducing stress on the circuit board upon being heated.
    Type: Application
    Filed: September 22, 2010
    Publication date: April 14, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Yoshiteru OCHI, Nobutaka Itoh, Makoto Sakairi
  • Publication number: 20100289500
    Abstract: A substrate includes a first plate member; a plurality of first electrodes provided on the major surface of the first plate member, the first electrodes including at least one electrode for circuit connection and at least one monitor electrode separate from the electrode for circuit connection; a second plate member; a plurality of second electrodes provided on the major surface of the second plate member; a plurality of solder members provided between the first electrodes and the second electrodes for electrical connection therebetween, repeatedly; and a detector for detecting an electrical disconnection between at least one of the monitor electrode and the second electrode.
    Type: Application
    Filed: April 28, 2010
    Publication date: November 18, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Nobutaka Itoh, Makoto Sakairi, Mami Nakadate
  • Patent number: 7730444
    Abstract: A structural analysis method that saves analysis time without lowering the prediction accuracy is provided. The structural analysis method has dividing up the analysis target into a plurality of finite elements; defining a plurality of meshes that divide up the analysis target into units larger than the finite elements and calculating, for each mesh, the proportion of one material among the plurality of materials that occupy the finite element contained in the mesh; specifying a mesh in which the calculated proportion of the one material exceeds a predetermined threshold value and generating mesh data by substituting material information specifying materials other than the one material with material information of the materials of the finite elements contained in the specified mesh; and calculating the physical amount yielded in the analysis target on the basis of the generated mesh data.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: June 1, 2010
    Assignee: Fujitsu Limited
    Inventors: Nobutaka Itoh, Tetsuyuki Kubota, Mami Nakadate, Akira Tamura
  • Publication number: 20100023299
    Abstract: An analysis apparatus includes an assignor assigning a physical property value corresponding to the kind of a material to each of regions formed by dividing a structural data representing a structure of a multilayer substrate, a determiner determining whether or not the each of the region belongs to a predetermined region in a layer of a predetermined kind, and a physical property value changer changing the physical property value of the region belonging to a predetermined region in a layer of a predetermined kind.
    Type: Application
    Filed: July 20, 2009
    Publication date: January 28, 2010
    Applicant: Fujitsu Limited
    Inventors: Tetsuyuki KUBOTA, Nobutaka ITOH
  • Publication number: 20090325401
    Abstract: A connector includes a contact pin in which a free end projecting from a supporting member comes into contact with an electrode of a first object and a second object, and a bending part is provided onto a base end such that the connector has an inclination against the first object and the second object. The rigidity of the bending parts is selectively set to be high by selectively increasing a thickness of the bending part.
    Type: Application
    Filed: September 3, 2009
    Publication date: December 31, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Makoto Sakairi, Nobutaka Itoh, Yoshiteru Ochi, Yoko Kobayashi
  • Publication number: 20090326883
    Abstract: A first generation portion divides an object to be analyzed into a plurality of finite elements to generate element division data. A first calculation portion defines and calculates a plurality of meshes dividing the object to be analyzed into units larger than the finite elements. A second generation portion assumes that a friction layer which has a thickness of “0” and a friction coefficient between a conductive material and a composite material of a predetermined value less than 1 exists at the interface between the conductive material and the composite material, and the second generation portion generates mesh data. A second calculation portion uses various solvers to calculate the physical amounts produced in the object to be analyzed on the basis of the mesh data and outputs the analysis result. In other words, the second calculation portion performs a simulation of the behavior of the object to be analyzed. The simulation is performed within an arbitrary temperature range set by a user.
    Type: Application
    Filed: September 3, 2009
    Publication date: December 31, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Daisuke Mizutani, Nobutaka Itoh
  • Publication number: 20090324095
    Abstract: An analysis-model-producing apparatus for producing an analysis model from a shape model, comprising means for specifying a deletion method for deleting, from geometric shape data constituting the shape model, geometric shape data that is unnecessary to production of an analysis model, and means for deleting unnecessary data, using the specified deletion method.
    Type: Application
    Filed: September 9, 2009
    Publication date: December 31, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Makoto Sakairi, Nobutaka Itoh, Yoshiteru Ochi, Yoko Kobayashi
  • Publication number: 20090240648
    Abstract: An evaluation method including associating the function blocks of the same kind in the first data and the second data is provided. The evaluation method includes specifying a specified function block from the function blocks, creating third data based on the first data and the specified function block of the second data, executing numeric analysis on the third data, comparing a numeric analysis data of the first data with a numeric analysis data of the third data and storing or displaying a comparison result.
    Type: Application
    Filed: March 12, 2009
    Publication date: September 24, 2009
    Applicant: FUJITSU LIMITED
    Inventor: Nobutaka ITOH
  • Patent number: 7502714
    Abstract: The present invention relates to optimization analysis achieving a target value and provides a device, method and program ensuring improved analysis efficiency and analysis accuracy. The device includes an analysis unit (CPU 14), an evaluation unit (CPU 14) and a condition modification unit (CPU 14). The analysis unit executes an analysis with analysis conditions imparted thereto. The evaluation unit evaluates the analysis results. The condition modification unit modifies the analysis conditions imparted to the analysis unit, based on the evaluation results. An optimum solution is thus derived by performing one or more analyses through the modification of the given analysis conditions.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: March 10, 2009
    Assignee: Fujitsu Limited
    Inventors: Mami Nakadate, Nobutaka Itoh
  • Patent number: 7498522
    Abstract: A printed circuit board includes a product portion and a backing plate. Upper and lower surfaces of the backing plate are coated with solder masks with different material characteristics.
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: March 3, 2009
    Assignee: Fujitsu Limited
    Inventor: Nobutaka Itoh
  • Patent number: 7476814
    Abstract: A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts piercing the insulation layers. In the multilayer interconnection board, 0<L2?(L1/3) is set, where L1 denotes the distance between center positions of a pair of neighboring via forming parts formed in the same insulation layer and L2 denotes the shortest separation distance between the pair of the via forming parts.
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: January 13, 2009
    Assignee: Fujitsu Limited
    Inventors: Yoshiteru Ochi, Nobutaka Itoh