Patents by Inventor Nobutaka KIDERA
Nobutaka KIDERA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11912617Abstract: A silica glass for a radio-frequency device has an OH group concentration being less than or equal to 300 wtppm; an FQ value being higher than or equal to 90,000 GHz at a frequency of higher than or equal to 25 GHz and lower than or equal to 30 GHz; and a slope being greater than or equal to 1,000 in a case where the FQ value is approximated as a linear function of the frequency in a frequency band of higher than or equal to 20 GHz and lower than or equal to 100 GHz.Type: GrantFiled: April 28, 2020Date of Patent: February 27, 2024Assignee: AGC Inc.Inventors: Nobutaka Kidera, Kazuya Sasaki, Yasutomi Iwahashi
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Patent number: 11708294Abstract: A glass substrate for a high-frequency device, which contains SiO2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na2O/(Na2O+K2O) in the range of 0.01-0.99, and the glass substrate having a total content of alkaline earth metal oxides in the range of 0.1-13% in terms of mole percent on the basis of oxides, wherein at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.Type: GrantFiled: December 19, 2019Date of Patent: July 25, 2023Assignee: AGC Inc.Inventors: Kazutaka Ono, Shuhei Nomura, Nobutaka Kidera, Nobuhiko Takeshita
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Patent number: 11697272Abstract: A laminated glass according to the present invention includes a first glass plate, a second glass plate, and an interlayer film. The interlayer film includes a laminated region including a first layer that is in contact with the first glass plate, a second layer that is in contact with the second glass plate, and a third layer disposed between the first layer and the second layer. When the relative dielectric constant of the first glass plate is denoted by ?g1, the relative dielectric constant of the second glass plate is denoted by ?g2, the relative dielectric constant of the first layer is denoted by ?m1, the relative dielectric constant of the second layer is denoted by ?m2, and the relative dielectric constant of the third layer is denoted by ?m3, relationships ?m1<?g1, ?m1<?g2, ?m2<?g1, ?m2<?g2, ?m3>?m1, ?m3>?m2 are established.Type: GrantFiled: May 17, 2022Date of Patent: July 11, 2023Assignee: AGC INC.Inventors: Shunsuke Sadakane, Shoichi Takeuchi, Hideo Tsuboi, Kazuhiko Niwano, Nobutaka Kidera, Ryota Okuda
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Publication number: 20220363038Abstract: A laminated glass according to an embodiment of the present invention includes a first glass plate, a second glass plate, and an interlayer film held between the first glass plate and the second glass plate. When a relative dielectric constant of the first glass plate is represented by ?g1; a relative dielectric constant of the second glass plate is represented by ?g2; a relative dielectric constant of a first interlayer film provided in a first region of the interlayer film is represented by ?m1; a reflection coefficient at an interface between the first glass plate and the first interlayer film is represented by ?1; and a reflection coefficient at an interface between the second glass plate and the first interlayer film is represented by ?2, the reflection coefficients ?1 and ?2 satisfy relations 0.0??1?0.2 and 0.0??2?0.2.Type: ApplicationFiled: July 26, 2022Publication date: November 17, 2022Applicant: AGC Inc.Inventors: Nobutaka KIDERA, Kazuhiko NIWANO, Shoichi TAKEUCHI, Tetsuo ABE, Yutaka KUROIWA
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Publication number: 20220274380Abstract: A laminated glass according to the present invention includes a first glass plate, a second glass plate, and an interlayer film. The interlayer film includes a laminated region including a first layer that is in contact with the first glass plate, a second layer that is in contact with the second glass plate, and a third layer disposed between the first layer and the second layer. When the relative dielectric constant of the first glass plate is denoted by ?g1, the relative dielectric constant of the second glass plate is denoted by ?g2, the relative dielectric constant of the first layer is denoted by ?m1, the relative dielectric constant of the second layer is denoted by ?m2, and the relative dielectric constant of the third layer is denoted by ?m3, relationships ?m1<?g1, ?m1<?g2, ?m2<?g1, ?m2<?g2, ?m3>?m1, ?m3>?m2 are established.Type: ApplicationFiled: May 17, 2022Publication date: September 1, 2022Applicant: AGC Inc.Inventors: Shunsuke SADAKANE, Shoichi TAKEUCHI, Hideo TSUBOI, Kazuhiko NIWANO, Nobutaka KIDERA, Ryota OKUDA
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Patent number: 11370200Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of a second surface 10b thereof is measured by an atomic force microscope.Type: GrantFiled: October 23, 2019Date of Patent: June 28, 2022Assignee: AGC Inc.Inventors: Tomoya Hosoda, Tatsuya Terada, Atsumi Yamabe, Nobutaka Kidera, Wataru Kasai
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Patent number: 11362405Abstract: A filter includes a waveguide formed in a dielectric surrounded by a conductor wall. The conductor wall includes at least one control wall protruding toward an inner side of the waveguide. The at least one control wall includes an end portion in a protruding direction of the at least one control wall and a central portion in the protruding direction. The end portion includes a wall portion of which wall thickness is different from the central portion.Type: GrantFiled: June 25, 2020Date of Patent: June 14, 2022Assignee: AGC Inc.Inventor: Nobutaka Kidera
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Patent number: 11041053Abstract: A resin powder having a high bulk density and an average particle size of at most 50 ?m from resin particles containing a fluorocopolymer as the main component and having a melting point of 260 to 320° C., where the fluorocopolymer contains a unit containing a carbonyl group-containing group, a unit based on tetrafluoroethylene, and a unit based on a perfluoro(alkyl vinyl ether) or a unit based on hexafluoropropylene. A method of producing the resin powder by subjecting resin particles (A) having an average particle size of at least 100 ?m to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component, which has a unit (1) based on a monomer containing at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene.Type: GrantFiled: December 10, 2019Date of Patent: June 22, 2021Assignee: AGC Inc.Inventors: Tomoya Hosoda, Eiichi Nishi, Toru Sasaki, Nobutaka Kidera
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Publication number: 20210163341Abstract: A glass substrate for a high-frequency device, which contains, in terms of mole percent on the basis of oxides: 40 to 75% of SiO2; 0 to 15% of Al2O3; 13 to 23% of B2O3; 2.5 to 11% of MgO; and 0 to 13% of CaO, and having a total content of alkali metal oxides in the range of 0.001-5%, where at least one main surface of the glass substrate has a surface roughness of 1.5 um or less in terms of arithmetic average roughness Ra. and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.Type: ApplicationFiled: February 12, 2021Publication date: June 3, 2021Applicant: AGC Inc.Inventors: Kazutaka ONO, Shuhei NOMURA, Nobutaka KIDERA, Nobuhiko TAKESHITA
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Patent number: 10974987Abstract: The present invention relates to a glass substrate for a high-frequency device, which includes SiO2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na2O/(Na2O+K2O) in the range of 0.01-0.99, and the glass substrate having a total content of Al2O3 and B2O3 in the range of 1-40% in terms of mole percent on the basis of oxides and having a molar ratio represented by Al2O3/(Al2O3+B2O3) in the range of 0-0.45, in which at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.Type: GrantFiled: March 12, 2019Date of Patent: April 13, 2021Assignee: AGC Inc.Inventors: Kazutaka Ono, Shuhei Nomura, Nobutaka Kidera, Nobuhiko Takeshita
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Publication number: 20200328489Abstract: A filter includes a waveguide formed in a dielectric surrounded by a conductor wall. The conductor wall includes at least one control wall protruding toward an inner side of the waveguide. The at least one control wall includes an end portion in a protruding direction of the at least one control wall and a central portion in the protruding direction. The end portion includes a wall portion of which wall thickness is different from the central portion.Type: ApplicationFiled: June 25, 2020Publication date: October 15, 2020Applicant: AGC Inc.Inventor: Nobutaka KIDERA
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Publication number: 20200255324Abstract: A silica glass for a radio-frequency device has an OH group concentration being less than or equal to 300 wtppm; an FQ value being higher than or equal to 90,000 GHz at a frequency of higher than or equal to 25 GHz and lower than or equal to 30 GHz; and a slope being greater than or equal to 1,000 in a case where the FQ value is approximated as a linear function of the frequency in a frequency band of higher than or equal to 20 GHz and lower than or equal to 100 GHz.Type: ApplicationFiled: April 28, 2020Publication date: August 13, 2020Applicant: AGC Inc.Inventors: Nobutaka KIDERA, Kazuya SASAKI, Yasutomi IWAHASHI
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Publication number: 20200123043Abstract: A glass substrate for a high-frequency device, which contains SiO2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na2O/(Na2O+K2O) in the range of 0.01-0.99, and the glass substrate having a total content of alkaline earth metal oxides in the range of 0.1-13% in terms of mole percent on the basis of oxides, wherein at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.Type: ApplicationFiled: December 19, 2019Publication date: April 23, 2020Applicant: AGC Inc.Inventors: Kazutaka ONO, Shuhei NOMURA, Nobutaka KIDERA, Nobuhiko TAKESHITA
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Publication number: 20200115509Abstract: To provide a method capable of producing, by means of mechanical pulverization, a resin powder having a high bulk density and an average particle size of at most 50 ?m from resin particles containing a fluorocopolymer as the main component and having a melting point of from 260 to 320° C., such as PFA. The method is to obtain a resin powder having an average particle size of from 0.02 to 50 ?m by subjecting resin particles (A) having an average particle size of at least 100 ?m to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component; and said fluorocopolymer (X1) has a unit (1) based on a monomer containing at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene, and has a melting point of from 260 to 320° C.Type: ApplicationFiled: December 10, 2019Publication date: April 16, 2020Applicant: AGC Inc.Inventors: Tomoya HOSODA, Eiichi NISHI, Toru SASAKI, Nobutaka KIDERA
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Publication number: 20200048420Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of a second surface 10b thereof is measured by an atomic force microscope.Type: ApplicationFiled: October 23, 2019Publication date: February 13, 2020Applicant: AGC Inc.Inventors: Tomoya HOSODA, Tatsuya TERADA, Atsumi YAMABE, Nobutaka KIDERA, Wataru KASAI
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Publication number: 20190210911Abstract: The present invention relates to a glass substrate for a high-frequency device, which includes SiO2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na2O/(Na2O+K2O) in the range of 0.01-0.99, and the glass substrate having a total content of Al2O3 and B2O3 in the range of 1-40% in terms of mole percent on the basis of oxides and having a molar ratio represented by Al2O3/(Al2O3+B2O3) in the range of 0-0.45, in which at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.Type: ApplicationFiled: March 12, 2019Publication date: July 11, 2019Applicant: AGC Inc.Inventors: Kazutaka ONO, Shuhei Nomura, Nobutaka Kidera, Nobuhiko Takeshita
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Patent number: 10271428Abstract: To produce a wiring substrate having excellent electrical characteristics with conduction failure in a hole formed in a layer made of a fluororesin material sufficiently suppressed without conducting an etching treatment using metal sodium. A process for producing a wiring substrate, which comprises forming a hole in a laminate comprising a first conductor layer, a layer (A) which is made of a fluororesin material containing a melt-moldable fluororesin having specific functional groups and a reinforcing fiber substrate and which has a dielectric constant from 2.0 to 3.5, a second conductor layer, an adhesive layer and a layer (B) made of a cured product of a thermosetting resin laminated in this order, applying, to an inner wall surface of the hole, either one or both of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming a plating layer.Type: GrantFiled: March 20, 2018Date of Patent: April 23, 2019Assignee: AGC Inc.Inventors: Tomoya Hosoda, Toru Sasaki, Nobutaka Kidera, Tatsuya Terada
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Publication number: 20180213641Abstract: To produce a wiring substrate having excellent electrical characteristics with conduction failure in a hole formed in a layer made of a fluororesin material sufficiently suppressed without conducting an etching treatment using metal sodium. A process for producing a wiring substrate 1, which comprises forming a hole 20 in a laminate comprising a first conductor layer 12, a layer (A) 10 which is made of a fluororesin material containing a melt-moldable fluororesin (a) having specific functional groups and a reinforcing fiber substrate and which has a dielectric constant of from 2.0 to 3.Type: ApplicationFiled: March 20, 2018Publication date: July 26, 2018Applicant: Asahi Glass Company, LimitedInventors: Tomoya HOSODA, Toru Sasaki, Nobutaka Kidera, Tatsuya Terada
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Publication number: 20180213637Abstract: To provide a process for producing a wiring substrate with conduction failure in a hole formed in an electrical insulator layer suppressed even without conducting an etching treatment using metal sodium, and with unexpected deformation such as warpage suppressed even when the electrical insulator layer contains no woven fabric or non-woven fabric comprising reinforcing fibers. A process for producing a wiring substrate 1, which comprises forming a hole 20 in a laminate comprising a first conductor layer 12, an electrical insulator layer 10 which contains a specific fluororesin layer (A) 16 and a heat resistant resin layer (B) 18, contains no reinforcing fiber to substrate, and has a dielectric constant of from 2.0 to 3.5 and a linear expansion coefficient of from 0 to 35 ppm/° C.Type: ApplicationFiled: March 20, 2018Publication date: July 26, 2018Applicant: Asahi Glass Company, LimitedInventors: Tomoya HOSODA, Toru SASAKI, Nobutaka KIDERA, Tatsuya TERADA
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Publication number: 20170130009Abstract: To provide a method capable of producing, by means of mechanical pulverization, a resin powder having a high bulk density and an average particle size of at most 50 ?m from resin particles containing a fluorocopolymer as the main component and having a melting point of from 260 to 320° C., such as PFA. The method is to obtain a resin powder having an average particle size of from 0.02 to 50 ?m by subjecting resin particles (A) having an average particle size of at least 100 ?m to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component; and said fluorocopolymer (X1) has a unit (1) based on a monomer containing at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene, and has a melting point of from 260 to 320° C.Type: ApplicationFiled: January 24, 2017Publication date: May 11, 2017Applicant: ASAHI GLASS COMPANY, LIMITEDInventors: Tomoya HOSODA, Eiichi NISHI, Toru SASAKI, Nobutaka KIDERA