Abstract: A semiconductor device includes a pad group including pads provided on a semiconductor substrate and arranged in a row to form a pad row as a whole. The pad group includes at least one first pad provided with a first via-connection part electrically connected therewith and extending in a first direction perpendicular to a row direction of the pad row, and at least one second pad provided with a second via-connection part electrically connected therewith and extending in a second direction opposite to the first direction. The at least one second pad is formed at a position moved in the first direction from the row direction of the pad row passing through a center of the at least one first pad.

Abstract: A semiconductor device includes a pad group including pads provided on a semiconductor substrate and arranged in a row to form a pad row as a whole. The pad group includes at least one first pad provided with a first via-connection part electrically connected therewith and extending in a first direction perpendicular to a row direction of the pad row, and at least one second pad provided with a second via-connection part electrically connected therewith and extending in a second direction opposite to the first direction. The at least one second pad is formed at a position moved in the first direction from the row direction of the pad row passing through a center of the at least one first pad.

Abstract: A semiconductor device comprises: a pad group including a plurality of pads provided on a semiconductor substrate and arranged in a row to form a pad row as a whole. The pad group includes: at least one first pad provided with a first via-connection part electrically connected therewith and extended in a first direction perpendicular to a row direction of the pad row; and at least one second pad provided with a second via-connection part electrically connected therewith and extended in a second direction opposite to the first direction. The at least one second pad is formed at a position moved in the first direction from the row direction of the pad row passing through a center of the at least one first pad.

Abstract: A semiconductor device comprises: a pad group including a plurality of pads provided on a semiconductor substrate and arranged in a row to form a pad row as a whole. The pad group includes: at least one first pad provided with a first via-connection part electrically connected therewith and extended in a first direction perpendicular to a row direction of the pad row; and at least one second pad provided with a second via-connection part electrically connected therewith and extended in a second direction opposite to the first direction. The at least one second pad is formed at a position moved in the first direction from the row direction of the pad row passing through a center of the at least one first pad.

Abstract: An excess region on a chip plane is eliminated to reduce a chip size. A plurality of data pads, which input/output data, are arranged near one side of an outer periphery of a substrate in parallel with the aforementioned one side, and a plurality of data pads, which input/output data, are arranged on an inner side of the plurality of data pads in parallel with the plurality of data pads. NMOSs, which output data, are arranged between the data pads, and PMOSs, which output data, are arranged at positions where they face the NMOSs near the data pads.

Abstract: A semiconductor memory device having a memory cell array, an input buffer, an output buffer, and an input-output control circuit that receives a write control signal and controls the input and output buffers. The output buffer generates a commencement signal indicating commencement of output. A mask generating circuit generates a mask signal with delayed active-to-inactive transitions from the commencement signal. A masking circuit passes the write control signal to the input-output control circuit while the mask signal is inactive, and holds the write control signal in the write-disabling state while the mask signal is active. The mask signal prevents unintended writing of data in the memory cell array when the write control signal is contaminated by noise from the output buffer.

Abstract: A semiconductor memory device having a memory cell array, an input buffer, an output buffer, and an input-output control circuit that receives a write control signal and controls the input and output buffers. The output buffer generates a commencement signal indicating commencement of output. A mask generating circuit generates a mask signal with delayed active-to-inactive transitions from the commencement signal. A masking circuit passes the write control signal to the input-output control circuit while the mask signal is inactive, and holds the write control signal in the write-disabling state while the mask signal is active. The mask signal prevents unintended writing of data in the memory cell array when the write control signal is contaminated by noise from the output buffer.

Abstract: An excess region on a chip plane is eliminated to reduce a chip size. A plurality of data pads, which input/output data, are arranged near one side of an outer periphery of a substrate in parallel with the aforementioned one side, and a plurality of data pads, which input/output data, are arranged on an inner side of the plurality of data pads in parallel with the plurality of data pads. NMOSs, which output data, are arranged between the data pads, and PMOSs, which output data, are arranged at positions where they face the NMOSs near the data pads.

Abstract: A semiconductor memory device having a memory cell array, an input buffer, an output buffer, and an input-output control circuit that receives a write control signal and controls the input and output buffers. The output buffer generates a commencement signal indicating commencement of output. A mask generating circuit generates a mask signal with delayed active-to-inactive transitions from the commencement signal. A masking circuit passes the write control signal to the input-output control circuit while the mask signal is inactive, and holds the write control signal in the write-disabling state while the mask signal is active. The mask signal prevents unintended writing of data in the memory cell array when the write control signal is contaminated by noise from the output buffer.

Abstract: A semiconductor memory device has an array of memory cells, an array of sense amplifiers selected at least two at a time by column lines, data bus lines that receive data read from the memory cell array by the selected sense amplifiers, a decision circuit that compares data read by two of the selected sense amplifiers, and an input-output buffer. Normally, the input-output buffer receives and outputs data from one or more of the data bus lines. In a test output mode, the input-output buffer receives and outputs comparison result data from the decision circuit. In a semiconductor memory device with multiple memory cell arrays, this arrangement enables data read from different memory cells in the same memory cell array to be compared, so that redundancy repair can be carried out efficiently.

Abstract: A semiconductor memory device has an array of memory cells, an array of sense amplifiers selected at least two at a time by column lines, data bus lines that receive data read from the memory cell array by the selected sense amplifiers, a decision circuit that compares data read by two of the selected sense amplifiers, and an input-output buffer. Normally, the input-output buffer receives and outputs data from one or more of the data bus lines. In a test output mode, the input-output buffer receives and outputs comparison result data from the decision circuit. In a semiconductor memory device with multiple memory cell arrays, this arrangement enables data read from different memory cells in the same memory cell array to be compared, so that redundancy repair can be carried out efficiently.

Abstract: A semiconductor device includes an internal source voltage generating circuit (debooster circuit) provided between an external source voltage EVCC and a ground voltage VSS and for generating an internal source voltage IVCC necessary to drive each of internal circuits in the semiconductor device, a booster circuit provided between the internal source voltage IVCC and the ground voltage VSS, for generating a boosted voltage VBST higher than the internal source voltage IVCC, and a capacitor provided between the boosted voltage VBST and the ground voltage, for stabilizing the boosted voltage VBST. The capacitor comprises a P type semiconductor substrate to which the ground voltage is applied, and an N type well region having therein a P type well region with a memory cell formed therein and to which the internal source voltage IVCC is applied.