Patents by Inventor Nobutaka Shimizu
Nobutaka Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240119823Abstract: The present invention suppresses the unnecessary detection of an occurrence of a person being left behind in a vehicle. A vehicle occupant detection device (100) comprises: a distance detection unit (101) that detects the relative distance between a vehicle (200) and a first occupant; an occupant detection unit (102) that detects the presence/absence of a second occupant in the vehicle (200); and an execution timing controller (103) that, according to the detected relative distance, controls the execution timing of the detection operation by the occupant detection unit (102).Type: ApplicationFiled: November 24, 2021Publication date: April 11, 2024Applicant: Mitsumi Electric Co., Ltd.Inventors: Nobutaka SHIMIZU, Akihiko KOJIMA
-
Patent number: 11794555Abstract: A vehicle air-conditioning apparatus heat pump system configured so that an excessive increase in the temperature (superheat degree) of refrigerant discharged from a compressor can be prevented in air-heating operation. The heat pump system (HP) includes a compressor (C) and an indoor heat exchanger (HXC2) on a refrigerant circuit (RC). A first branched flow path (BC1) on which a first expansion mechanism (EX1) with an adjustable opening degree and a first heat absorption heat exchanger (HXA1) are arranged in series and a second branched flow path (BC2) on which a second expansion mechanism (EX2) with an adjustable opening degree and a second heat absorption heat exchanger (HXA2) are arranged in series, where the first branched flow path (BC1) and the second branched flow path (BC2) are arranged in parallel on the refrigerant circuit extending from the indoor heat exchanger to the compressor.Type: GrantFiled: August 23, 2019Date of Patent: October 24, 2023Assignee: SANDEN CORPORATIONInventor: Nobutaka Shimizu
-
Publication number: 20210197648Abstract: Provided is a vehicle air-conditioning apparatus heat pump system configured so that an excessive increase in the temperature (superheat degree) of refrigerant discharged from a compressor can be prevented in air-heating operation. The heat pump system (HP) includes a compressor (C) and an indoor heat exchanger (HXC2) on a refrigerant circuit (RC). A first branched flow path (BC1) on which a first expansion mechanism (EX1) of which opening degree is adjustable and a first heat absorption heat exchanger (HXA1) are arranged in series and a second branched flow path (BC2) on which a second expansion mechanism (EX2) of which opening degree is adjustable and a second heat absorption heat exchanger (HXA2) are arranged in series are arranged in parallel on the refrigerant circuit extending from the indoor heat exchanger to the compressor.Type: ApplicationFiled: August 23, 2019Publication date: July 1, 2021Inventor: Nobutaka SHIMIZU
-
Patent number: 10598565Abstract: A deformation mode analysis method for a member of a structure is a method of analyzing a deformation mode of each member by performing structural analysis or a structural test on a structure including a single member or a plurality of members. In this method, the deformation mode of the structure is analyzed by separating the structure into a plurality of regions and calculating deformations for every separated region.Type: GrantFiled: September 17, 2015Date of Patent: March 24, 2020Assignee: NIPPON STEEL CORPORATIONInventors: Nobutaka Shimizu, Takeshi Kawachi
-
Patent number: 10556397Abstract: An exterior panel includes: a metal sheet having a curved portion; a resin structure which includes a plurality of tubular bodies having the same length in a central axis direction, top surfaces covering respective one end portions of the tubular bodies, and base portions connecting respective the other end portions of the tubular bodies and is formed with the top surfaces being brought into close contact with and joined to the curved portion of the metal sheet; and a sheet member made of a resin or paper joined to the base portions of the resin structure, in which a relationship between a tensile elastic modulus E (N/mm2) and the thickness t (mm) of the sheet member satisfies Formula (1). 4.Type: GrantFiled: December 12, 2017Date of Patent: February 11, 2020Assignee: NIPPON STEEL CORPORATIONInventors: Satoshi Shirakami, Yoshiaki Nakazawa, Nobutaka Shimizu
-
Patent number: 10549033Abstract: [Problem] Provided is an infusion pump in which a forward rotation and a reverse rotation of a rotor of a drive motor can be detected so as to be able to safely deliver drug to a patient. An infusion pump 1 includes a drive motor 61, a liquid delivering drive unit 60 that delivers drug inside an infusion tube by Dressing an infusion tube 200 on account of a rotor of the drive motor 61 in forward rotation, a rotational direction detection device 700 that generates detection information 780 regarding a rotational direction for judging whether the rotor of the drive motor 61 is in the forward rotation or reverse rotation, and a control unit 100 that judges whether a rotor 161A of the drive motor 61 is in the forward rotation or the reverse rotation based on the detection information 780 regarding the rotational direction obtained from the rotational direction detection device 700.Type: GrantFiled: March 20, 2015Date of Patent: February 4, 2020Assignee: TERUMO KABUSHIKI KAISHAInventor: Nobutaka Shimizu
-
Publication number: 20190337259Abstract: An exterior panel includes: a metal sheet having a curved portion; a resin structure which includes a plurality of tubular bodies having the same length in a central axis direction, top surfaces covering respective one end portions of the tubular bodies, and base portions connecting respective the other end portions of the tubular bodies and is formed with the top surfaces being brought into close contact with and joined to the curved portion of the metal sheet; and a sheet member made of a resin or paper joined to the base portions of the resin structure, in which a relationship between a tensile elastic modulus E (N/mm2) and the thickness t (mm) of the sheet member satisfies Formula (1). 4.Type: ApplicationFiled: December 12, 2017Publication date: November 7, 2019Applicant: NIPPON STEEL CORPORATIONInventors: Satoshi SHIRAKAMI, Yoshiaki NAKAZAWA, Nobutaka SHIMIZU
-
Publication number: 20190185063Abstract: A work vehicle includes a cab, a body frame and a restrictor. The body flame includes a base component, and a support frame provided on an upper side of the base component. The support frame supports the cab. The restrictor is provided to a floor frame of the cab. The restrictor is disposed between the base component and the floor frame. The restrictor includes a retaining member disposed on a lower side of the support frame, and an impact absorber disposed on a cab side of the retaining member.Type: ApplicationFiled: August 10, 2017Publication date: June 20, 2019Inventors: Makoto SASAKI, Masashi KATOH, Takahiro NOGUCHI, Kazuaki ADACHI, Yoshiaki NAKAZAWA, Nobutaka SHIMIZU, Masahiro NAKATA
-
Patent number: 10030388Abstract: A panel comprises a reinforcing unit including a plurality of first rectangular regions and a plurality of second rectangular regions. The first and second rectangular regions are in rows and columns, the first and second rectangular regions in each row being arranged alternately and the first and second rectangular regions in each column being arranged alternately. Each of the first rectangular regions includes a fully-covering first protrusion protruding in a first direction perpendicular to an imaginary reference plane and having a flat top surface. Each of the second rectangular regions includes a partially-covering second protrusion protruding in a second direction opposite to the first direction and having a flat top surface. A partially-covering reinforcing protrusion extends between opposite sides and protrudes in the first direction and having a flat top surface. The top surface of the reinforcing protrusion forms one face together with the top surface of the first protrusion.Type: GrantFiled: November 25, 2014Date of Patent: July 24, 2018Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATIONInventors: Toru Yonebayashi, Yoshiaki Nakazawa, Nobutaka Shimizu
-
Patent number: 10022494Abstract: Provided is an infusion pump in which one or more occlusion sensors includes a Hall element detecting a variation in magnetic flux, of one or more magnets, generated with movement of a plunger caused by a variation of an infusion tube in a radial direction that results from an occlusion of the infusion tube, and changing the variation of an infusion tube in the radial direction into an output voltage. When increasing a movement distance of the plunger to a plurality of predetermined positions D1 to D4, a control unit obtains linearity of output voltages PV1 to PV4 of the Hall element with respect to movement distances to a plurality of positions D1 to D4 by applying a plurality of predetermined impression voltages BE1 to BE16 to the Hall element to select from the plurality of impression voltages applied for each of the movement distances to the plurality of positions.Type: GrantFiled: March 20, 2015Date of Patent: July 17, 2018Assignee: TERUMO KABUSHIKI KAISHAInventor: Nobutaka Shimizu
-
Patent number: 10008432Abstract: A semiconductor device includes a substrate and a semiconductor element mounted on the top surface of the substrate. On the top surface of the substrate, one or more pads are disposed outside the mounted semiconductor element when seen in a plan view. Then, a protrusion is disposed on each of the pads. A heat sink is disposed above the semiconductor element and the protrusions, and then bonded to the substrate by an adhesive provided between the heat sink and the substrate. The adhesive is provided in such a manner as to be in contact with the protrusions on the substrate.Type: GrantFiled: July 21, 2016Date of Patent: June 26, 2018Assignee: SOCIONEXT INC.Inventors: Takumi Ihara, Nobutaka Shimizu, Masamitsu Ikumo
-
Publication number: 20170293366Abstract: A deformation mode analysis method for a member of a structure is a method of analyzing a deformation mode of each member by performing structural analysis or a structural test on a structure including a single member or a plurality of members. In this method, the deformation mode of the structure is analyzed by separating the structure into a plurality of regions and calculating deformations for every separated region.Type: ApplicationFiled: September 17, 2015Publication date: October 12, 2017Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATIONInventors: Nobutaka SHIMIZU, Takeshi KAWACHI
-
Patent number: 9721866Abstract: A method for manufacturing a semiconductor device is provided, the method including: mounting a first element on a wiring substrate, placing a first heat sink on the first element with a metal material interposed between the first heat sink and the first element, attaching the first heat sink to the first element via the metal material by heating and melting the metal material, and mounting a second element on the wiring substrate after the steps of attaching the first heat sink to the first element.Type: GrantFiled: November 18, 2015Date of Patent: August 1, 2017Assignee: SOCIONEXT INC.Inventors: Takeshi Imamura, Nobutaka Shimizu, Yasunori Fujimoto
-
Patent number: 9716049Abstract: A semiconductor device includes: a substrate; a semiconductor element disposed on the substrate; a plurality of electrodes disposed on the substrate separately from one another and arranged so as to surround the semiconductor element in a plan view; a lid that cover the semiconductor element, the lid including an inner portion and a periphery portion that is outer than the inner portion in a plan view, the lid including a plurality of first protruding members that is provided separately from one another, the first protruding members being disposed in the inner portion; and conductive members disposed between the plurality of electrodes and the plurality of protruding members disposed in positions opposed to the plurality of electrodes respectively, the conductive members being joined to the plurality of electrodes and the plurality of protruding members respectively.Type: GrantFiled: July 30, 2015Date of Patent: July 25, 2017Assignee: SOCIONEXT INC.Inventors: Kazuyuki Urago, Nobutaka Shimizu
-
Publication number: 20170047266Abstract: A semiconductor device includes a substrate and a semiconductor element mounted on the top surface of the substrate. On the top surface of the substrate, one or more pads are disposed outside the mounted semiconductor element when seen in a plan view. Then, a protrusion is disposed on each of the pads. A heat sink is disposed above the semiconductor element and the protrusions, and then bonded to the substrate by an adhesive provided between the heat sink and the substrate. The adhesive is provided in such a manner as to be in contact with the protrusions on the substrate.Type: ApplicationFiled: July 21, 2016Publication date: February 16, 2017Inventors: Takumi Ihara, Nobutaka Shimizu, Masamitsu Ikumo
-
Publication number: 20160273222Abstract: A panel comprises a reinforcing unit including a plurality of first rectangular regions and a plurality of second rectangular regions. The first and second rectangular regions are in rows and columns, the first and second rectangular regions in each row being arranged alternately and the first and second rectangular regions in each column being arranged alternately. Each of the first rectangular regions includes a fully-covering first protrusion protruding in a first direction perpendicular to an imaginary reference plane and having a flat top surface. Each of the second rectangular regions includes a partially-covering second protrusion protruding in a second direction opposite to the first direction and having a flat top surface. A partially-covering reinforcing protrusion extends between opposite sides and protrudes in the first direction and having a flat top surface. The top surface of the reinforcing protrusion forms one face together with the top surface of the first protrusion.Type: ApplicationFiled: November 25, 2014Publication date: September 22, 2016Inventors: Toru YONEBAYASHI, Yoshiaki NAKAZAWA, Nobutaka SHIMIZU
-
Publication number: 20160071782Abstract: A method for manufacturing a semiconductor device is provided, the method including: mounting a first element on a wiring substrate, placing a first heat sink on the first element with a metal material interposed between the first heat sink and the first element, attaching the first heat sink to the first element via the metal material by heating and melting the metal material, and mounting a second element on the wiring substrate after the steps of attaching the first heat sink to the first element.Type: ApplicationFiled: November 18, 2015Publication date: March 10, 2016Inventors: Takeshi Imamura, Nobutaka Shimizu, Yasunori Fujimoto
-
Publication number: 20160035637Abstract: A semiconductor device includes: a substrate; a semiconductor element disposed on the substrate; a plurality of electrodes disposed on the substrate separately from one another and arranged so as to surround the semiconductor element in a plan view; a lid that cover the semiconductor element, the lid including an inner portion and a periphery portion that is outer than the inner portion in a plan view, the lid including a plurality of first protruding members that is provided separately from one another, the first protruding members being disposed in the inner portion; and conductive members disposed between the plurality of electrodes and the plurality of protruding members disposed in positions opposed to the plurality of electrodes respectively, the conductive members being joined to the plurality of electrodes and the plurality of protruding members respectively.Type: ApplicationFiled: July 30, 2015Publication date: February 4, 2016Inventors: Kazuyuki URAGO, Nobutaka Shimizu
-
Patent number: 9224711Abstract: A method for manufacturing a semiconductor device is provided, the method including: mounting a first element on a wiring substrate, placing a first heat sink on the first element with a metal material interposed between the first heat sink and the first element, attaching the first heat sink to the first element via the metal material by heating and melting the metal material, and mounting a second element on the wiring substrate after the steps of attaching the first heat sink to the first element.Type: GrantFiled: December 19, 2013Date of Patent: December 29, 2015Assignee: SOCIONEXT INC.Inventors: Takeshi Imamura, Nobutaka Shimizu, Yasunori Fujimoto
-
Publication number: 20150314066Abstract: Provided is an infusion pump in which one or more occlusion sensors includes a Hall element detecting a variation in magnetic flux, of one or more magnets, generated with movement of a plunger caused by a variation of an infusion tube in a radial direction that results from an occlusion of the infusion tube, and changing the variation of an infusion tube in the radial direction into an output voltage. When increasing a movement distance of the plunger to a plurality of predetermined positions D1 to D4, a control unit obtains linearity of output voltages PV1 to PV4 of the Hall element with respect to movement distances to a plurality of positions D1 to D4 by applying a plurality of predetermined impression voltages BE1 to BE16 to the Hall element to select from the plurality of impression voltages applied for each of the movement distances to the plurality of positions.Type: ApplicationFiled: March 20, 2015Publication date: November 5, 2015Inventor: Nobutaka SHIMIZU