Abstract: Provided is a method for producing an electronic material filler having excellent performance. The method includes a burning step of putting a particle raw material in flame obtained by burning combustible carbon-free gas containing no carbon to form a particle material to be contained in the electronic material filler. By adopting, as combustible gas, combustible gas containing no carbon, conductive particles formed of carbon are not generated in principle. Therefore, a step of removing the conductive particles formed of carbon by sieving or the like is not required. Particularly, carbon derived from hydrocarbon gas is adhered to and formed on, for example, the surface of the particle material or is formed in the particle material. Therefore, the carbon may not be completely removed by sieving or the like. However, the production method of the present invention prevents the carbon from being mixed in principle.

Abstract: A filler for resinous composition is contained and used in resinous composition, and includes: a crystalline siliceous particulate material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA and type MFI, and/or type MWW; and a surface treatment agent including an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material; the filler including the surface treatment agent in an amount falling in a range allowing the filler to exhibit a negative thermal expansion coefficient.

Abstract: A modified metal oxide particle material includes: a metal oxide particle material having, on a surface thereof, a functional group other than a phenyl group; and a modifying material formed of a silicon-containing compound having a phenyl group. The modifying material is adhered to the surface of the metal oxide particle material. When the modified metal oxide particle material is washed with methyl ethyl ketone, a ratio (C/H) of a carbon content C (% by mass) to a surface area H (m2) per 1 g is 0.05 or less, after the washing. The ratio (C/H) is reduced by 0.1 or more, and the modifying material is removed by 50% or more by mass, after the washing compared with before the washing.

Abstract: A particle material that has high dispersibility in a dispersion medium such as toluene having high hydrophobicity, and a slurry composition in which the particle material is used, are provided for solving the problem. A surface-modified particle material of the present invention includes: a particle material formed of an inorganic material; and a surface treatment agent formed of a silane compound having a first functional group that has any of C, N, and O atoms away over five or more atoms from Si to which an alkoxide is bound, the surface treatment agent allowing surface treatment of the particle material in such an amount that a degree of hydrophobicity becomes not less than 30%. Dispersibility is enhanced also in a dispersion medium having high hydrophobicity in a case where a functional group having a predetermined structure is introduced so as to impart predetermined or higher hydrophobicity.

Abstract: A filler for resinous composition is contained and used in resinous composition constituting electronic packaging material for electronic device, and includes: a filler ingredient including a crystalline siliceous material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA, type MFI and type CHA, and/or type MWW, wherein: the filler ingredient is free of any activity when evaluated by an “NH3-TPD” method; and includes the crystalline siliceous material in an amount falling in a range allowing the filler ingredient to exhibit a negative thermal expansion coefficient. The filler ingredient may further be free of a surface in which silver, copper, zinc, mercury, tin, lead, bismuth, cadmium, chromium, cobalt and nickel are exposed.

Abstract: A production method for an electronic material filler includes: a preparation step of preparing a silica particle material produced by a dry method; and a first surface treatment step of performing surface treatment on the silica particle material with a silane compound having a vinyl group, a phenyl group, a phenylamino group, an alkyl group having four or more carbon atoms, a methacryl group, or an epoxy group, to obtain a first surface treatment-processed particle material. After the silica particle material is produced by the dry method, the silica particle material is not brought into contact with liquid water, and has a particle diameter of 100 nm to 600 nm or a specific surface area of 5 m2/g to 35 m2/g.

Abstract: A particulate material with a composition expressed by MaAlbXc in which “M” includes one or more elements selected from the group consisting of Ti, V, Cr, Zr, Nb, Mo, Hf and Ta and “X” includes C or one or more chemical structures selected from the group consisting of C(1.0?x)Nx (where “x” is 0<“x”?1.0), wherein: “a” is two or three; “b” is more than 0.02; and “c” is from 0.8 to 1.2 when “a” is two; or “c” is from 1.8 to 2.6 when “a” is 3. The particulate material has thicknesses whose average value is from 3.5 nm or more to 20 nm or less, and sizes, [{(longer sides)+(shorter sides)}/2], whose average value is from 50 nm or more to 300 nm or less.

Abstract: A particulate material with a composition expressed by Ti2Alx(C(1-y)Ny)z (where “x” is more than 0.02, “y” is 0<“y”<1.0, and “z” is from 0.8 to 1.20), the particulate material comprising layers including gap layers providing an interlayer distance of from 0.59 nm to 0.70 nm within a crystal lattice; and/or with another composition expressed by Ti3Alx(C(1-y)Ny)z (where “x” is more than 0.02, “y” is 0<“y”<1.0, and “z” is from 1.80 to 2.60), the particulate material comprising layers including gap layers providing an interlayer distance of from 0.44 nm to 0.55 nm within a crystal lattice.

Abstract: A filler for resinous composition is contained and used in resinous composition constituting electronic packaging material for electronic device, and includes: a filler ingredient including a crystalline siliceous material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA, type MFI and type CHA, and/or type MWW, wherein: the filler ingredient is free of any activity when evaluated by an “NH3-TPD” method; and includes the crystalline siliceous material in an amount falling in a range allowing the filler ingredient to exhibit a negative thermal expansion coefficient. The filler ingredient may further be free of a surface in which silver, copper, zinc, mercury, tin, lead, bismuth, cadmium, chromium, cobalt and nickel are exposed.

Abstract: A production method for an electronic material filler includes: a preparation step of preparing a silica particle material produced by a dry method; and a first surface treatment step of performing surface treatment on the silica particle material with a silane compound having a vinyl group, a phenyl group, a phenylamino group, an alkyl group having four or more carbon atoms, a methacryl group, or an epoxy group, to obtain a first surface treatment-processed particle material. After the silica particle material is produced by the dry method, the silica particle material is not brought into contact with liquid water, and has a particle diameter of 100 nm to 600 nm or a specific surface area of 5 m2/g to 35 m2/g.

Abstract: A filler for resinous composition is contained and used in resinous composition, and includes: a crystalline siliceous particulate material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA and type MFI, and/or type MWW; and a surface treatment agent including an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material; the filler including the surface treatment agent in an amount falling in a range allowing the filler to exhibit a negative thermal expansion coefficient.

Abstract: A particulate material with a composition expressed by Ti2Alx (C(1-y)Ny)z (where “x” is more than 0.02, “y” is 0<“y”<1.0, and “z” is from 0.8 to 1.20), the particulate material comprising layers including gap layers providing an interlayer distance of from 0.59 nm to 0.70 nm within a crystal lattice; and/or with another composition expressed by Ti3Alx(C(1-y)Ny)z (where “x” is more than 0.02, “y” is 0<“y”<1.0, and “z” is from 1.80 to 2.60), the particulate material comprising layers including gap layers providing an interlayer distance of from 0.44 nm to 0.55 nm within a crystal lattice.

Abstract: A particulate material with a composition expressed by MaAlbXc in which “M” includes one or more elements selected from the group consisting of Ti, V, Cr, Zr, Nb, Mo, Hf and Ta and “X” includes C or one or more chemical structures selected from the group consisting of C(1.0?x)Nx (where “x” is 0<“x”?1.0), wherein: “a” is two or three; “b” is more than 0.02; and “c” is from 0.8 to 1.2 when “a” is two; or “c” is from 1.8 to 2.6 when “a” is 3. The particulate material has thicknesses whose average value is from 3.5 nm or more to 20 nm or less, and sizes, [{(longer sides)+(shorter sides)}/2], whose average value is from 50 nm or more to 300 nm or less.

Abstract: A production method for an electronic material filler includes: a preparation step of preparing a silica particle material produced by a dry method; and a first surface treatment step of performing surface treatment on the silica particle material with a silane compound having a vinyl group, a phenyl group, a phenylamino group, an alkyl group having four or more carbon atoms, a methacryl group, or an epoxy group, to obtain a first surface treatment-processed particle material. After the silica particle material is produced by the dry method, the silica particle material is not brought into contact with liquid water, and has a particle diameter of 100 nm to 600 nm or a specific surface area of 5 m2/g to 35 m2/g.

Abstract: A production method for an electronic material filler includes: a preparation step of preparing a silica particle material produced by a dry method; and a first surface treatment step of performing surface treatment on the silica particle material with a silane compound having a vinyl group, a phenyl group, a phenylamino group, an alkyl group having four or more carbon atoms, a methacryl group, or an epoxy group, to obtain a first surface treatment-processed particle material. After the silica particle material is produced by the dry method, the silica particle material is not brought into contact with liquid water, and has a particle diameter of 100 nm to 600 nm or a specific surface area of 5 m2/g to 35 m2/g.

Abstract: A composite material includes a resinous particulate material, and an inorganic particulate material having a particle diameter being smaller than that of the resinous particulate material, fused welded onto a surface of the resinous particulate material, formed of an inorganic oxide, and including OH groups generated by fuse welding in the surface. The composite particulate material exhibits a degree of sphericity of 0.8 or more, and a has volumetric average particle diameter of from 0.1 to 100 ?m.

Abstract: A composite material includes a resinous particulate material, and an inorganic particulate material having a particle diameter being smaller than that of the resinous particulate material, fused welded onto a surface of the resinous particulate material, formed of an inorganic oxide, and including OH groups generated by fuse welding in the surface. The composite particulate material exhibits a degree of sphericity of 0.8 or more, and a has volumetric average particle diameter of from 0.1 to 100 ?m.

Abstract: A filler for resinous composition is contained and used in resinous composition, and includes: a crystalline siliceous particulate material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA and type MFI, and type MWW; and a surface treatment agent including an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material; the filler including the surface treatment agent in an amount falling in a range allowing the filler to exhibit a negative thermal expansion coefficient.

Abstract: A crystalline silica particulate material contains zinc (Zn) in an amount of 1 ppm or more, exhibits a volume average particle diameter of 200 ?m or less, and is composed mainly of crystalline silica.

Abstract: A crystalline silica particulate material contains zinc (Zn) in an amount of 1 ppm or more, exhibits a volume average particle diameter of 200 ?m or less, and is composed mainly of crystalline silica.