Patents by Inventor Nobutake Tsuyuno

Nobutake Tsuyuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200388556
    Abstract: An object is to improve the productivity of a power semiconductor device. A power semiconductor device according to the invention includes a circuit portion having a conductor for transmitting a current and a power semiconductor element, a first base portion and a second base portion facing each other with the circuit portion interposed therebetween, and a transfer mold member which is in contact with the conductor and the power semiconductor element and is filled in a space between the first base portion and the second base portion. The first base portion includes a first flat portion that is connected to a peripheral edge of the first base portion, and a first bent portion that connects the first flat portion and another portion of the first base portion and is plastically deformed. The transfer mold member is integrally configured in contact with the first flat portion.
    Type: Application
    Filed: November 5, 2018
    Publication date: December 10, 2020
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventor: Nobutake TSUYUNO
  • Patent number: 10818573
    Abstract: An object of the present invention is to provide a structure, particularly, a power semiconductor module, which suppresses a bypass flow of a cooling medium and improves cooling efficiency. A structure according to the present invention includes a heat dissipation plate thermally connected to a heating element, and a resin region having a resin material that fixes the heating element and the heat dissipation plate, wherein the heat dissipation plate includes a fin portion including a plurality of fins protruding from a heat dissipation surface of the heat dissipation plate and formed to be exposed from the sealing resin material, and a wall portion formed to protrude from the heat dissipation surface to a same side as the fin and which separates the fin portion and the resin region.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: October 27, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Nobutake Tsuyuno, Takeshi Tokuyama, Eiichi Ide
  • Publication number: 20200294888
    Abstract: An object of the invention is to improve the reliability of a power semiconductor device. The power semiconductor device according to the invention includes a semiconductor element, a first terminal and a second terminal that transmit current to the semiconductor element, a first base and a second base that are disposed to face each other while interposing a part of the first terminal, a part of the second terminal, and the semiconductor element between the first base and the second base, and a sealing material that is provided in a space between the first base and the second base. The second terminal includes an intermediate portion formed in such a way that a distance from the first terminal increases along a direction away from the semiconductor element. The intermediate portion is provided between the first base and the second base and in the sealing material.
    Type: Application
    Filed: December 11, 2018
    Publication date: September 17, 2020
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Nobutake TSUYUNO, Hiroshi HOUZOUJI
  • Patent number: 10763190
    Abstract: Provided is a compact power conversion device which is excellent in liquid tightness and has high reliability of a terminal connection portion. A power conversion device according to the present invention includes: a case that houses a power semiconductor; a flow path forming body that forms a flow path with an outer surface of the case; a first fixing material in contact with a refrigerant flowing in the flow path; and a second fixing material that is in contact with the first fixing material and the flow path forming body and covers a direction of displacement of the case of the first fixing material caused by water pressure.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: September 1, 2020
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Nobutake Tsuyuno, Morio Kuwano, Takeshi Tokuyama
  • Publication number: 20200227333
    Abstract: An object of the present invention is to provide a power semiconductor device enabling maintenance in reliability and improvement in productivity. According to the present invention, provided are: a circuit body including a semiconductor element and a conductive portion; a first insulation and a second insulation opposed to each other, the circuit body being interposed between the first insulation and the second insulation; a first base and a second base opposed to each other, the circuit body, the first insulation, and the second insulation being interposed between the first base and the second base; a case having a first opening portion covered with the first base and a second opening portion covered with the second base; and a distance regulation portion provided in space between the first base and the second base, the distance regulation portion regulating a distance between the first base and the second base in contact with the first base and the second base.
    Type: Application
    Filed: May 22, 2018
    Publication date: July 16, 2020
    Inventors: Nobutake TSUYUNO, Hiromi SHIMAZU, Akihiro NAMBA, Akira MATSUSHITA, Hiroshi HOUZOUJI, Atsuo NISHIHARA, Toshiaki ISHII, Takashi HIRAO
  • Patent number: 10699917
    Abstract: An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted control device includes: a circuit board; a base member housing the circuit board; and resin filled between the circuit board and the base member. The base member has: a base portion fixing the circuit board; and a side wall opposed to the side surface side of the circuit board. The resin is provided at least between the circuit board and the base portion. The side wall has an opening at any position on the side of the base portion from a position opposed to the side surface side of the electronic circuit board.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: June 30, 2020
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Maki Ito, Toshiaki Ishii, Yoshio Kawai, Nobutake Tsuyuno, Yujiro Kaneko, Takayuki Fukuzawa, Masahiko Asano
  • Publication number: 20190157185
    Abstract: Provided is a compact power conversion device which is excellent in liquid tightness and has high reliability of a terminal connection portion. A power conversion device according to the present invention includes: a case that houses a power semiconductor; a flow path forming body that forms a flow path with an outer surface of the case; a first fixing material in contact with a refrigerant flowing in the flow path; and a second fixing material that is in contact with the first fixing material and the flow path forming body and covers a direction of displacement of the case of the first fixing material caused by water pressure.
    Type: Application
    Filed: May 11, 2016
    Publication date: May 23, 2019
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Nobutake TSUYUNO, Morio KUWANO, Takeshi TOKUYAMA
  • Publication number: 20190080931
    Abstract: An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted control device includes: a circuit board; a base member housing the circuit board; and resin filled between the circuit board and the base member. The base member has: a base portion fixing the circuit board; and a side wall opposed to the side surface side of the circuit board. The resin is provided at least between the circuit board and the base portion. The side wall has an opening at any position on the side of the base portion from a position opposed to the side surface side of the electronic circuit board.
    Type: Application
    Filed: February 1, 2017
    Publication date: March 14, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Maki ITO, Toshiaki ISHII, Yoshio KAWAI, Nobutake TSUYUNO, Yujiro KANEKO, Takayuki FUKUZAWA, Masahiko ASANO
  • Patent number: 10190563
    Abstract: An internal combustion engine ignition coil according to the present invention includes: a central iron core; a primary coil disposed on an outer circumference of the central iron core; a secondary coil disposed on an outer circumference of the primary coil; a side iron core disposed on an outer circumference of the secondary coil; and an insulating material sealing the central iron core, the primary coil, and the secondary coil on an inner side of the side iron core. A first layered silicate having a particle diameter less than a winding diameter of the secondary coil is present at a higher concentration in a vicinity of the secondary coil than that in a vicinity of the side iron core in the insulating material. A second layered silicate having a particle diameter greater than the winding diameter of the secondary coil is present at a higher concentration than that of the first layered silicate between the outer circumference side of the secondary coil and the side iron core.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: January 29, 2019
    Assignee: Hitachi Automotive Systems Hanshin, Ltd.
    Inventors: Masayuki Kamikawa, Nobutake Tsuyuno, Toshiaki Ishii, Yoichi Anzo
  • Patent number: 10194563
    Abstract: An object of the present invention is to provide a power conversion device that suppresses a bypass flow and has superior heat dissipation performance. The power conversion device according to the present invention includes a power semiconductor module 300 and a flow channel formation body 1000 on which the power semiconductor module 300 is disposed. The power semiconductor module 300 has a high thermal conductor 920 which is disposed at a position between a semiconductor chip and the flow channel formation body 1000 and a sealing material that seals a power semiconductor element and the high thermal conductor 920. The high thermal conductor 920 has a fin protruding to the flow channel formation body 1000 at the side of the flow channel formation body 1000 and a part of the sealing material surrounding the fin and a leading edge of the fin are on almost the same plane.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: January 29, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD
    Inventors: Nobutake Tsuyuno, Eiichi Ide, Takeshi Tokuyama
  • Patent number: 10186473
    Abstract: An object of the present invention is to provide a power module capable of realizing a superior heat radiation property while satisfying a high insulation property. A power module according to the present invention includes: a conductor plate to which a switching element is connected; a heat radiation plate which is disposed to face the conductor plate; an insulating member which is disposed between the conductor plate and the heat radiation plate; and a conductive intermediate conductor which is disposed in the insulating member in a state of being electrically insulated from the conductor plate and the heat radiation plate, wherein the intermediate conductor has a communication region which communicates between the insulating member disposed on the side of the conductor plate with respect to the intermediate conductor and the insulating member disposed on the side of the heat radiation plate with respect to the intermediate conductor.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: January 22, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Fusao Hojo, Nobutake Tsuyuno, Toshiaki Ishii, Junpei Kusukawa, Akira Matsushita
  • Patent number: 10177084
    Abstract: An object of the invention is to manufacture a semiconductor module small. A metal wire (212) connecting a control electrode (101) and a control terminal (21) rises to form a first angle (?1) from the control electrode (101) toward a first conductive portion (202), gradually goes in substantially parallel to the first conductive portion (202) as the metal wire approaches the first conductive portion (202), and is connected to the control terminal (21) to form a second angle (?2) smaller than the first angle (?1).
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: January 8, 2019
    Assignee: HITACHI, LTD.
    Inventors: Nobutake Tsuyuno, Eiichi Ide
  • Patent number: 10128164
    Abstract: An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: November 13, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroyuki Temmei, Mina Amo, Nobutake Tsuyuno, Takeshi Tokuyama, Toshiaki Ishii, Toshiya Satoh
  • Publication number: 20180254235
    Abstract: An object of the present invention is to provide a structure, particularly, a power semiconductor module, which suppresses a bypass flow of a cooling medium and improves cooling efficiency. A structure according to the present invention includes a heat dissipation plate thermally connected to a heating element, and a resin region having a resin material that fixes the heating element and the heat dissipation plate, wherein the heat dissipation plate includes a fin portion including a plurality of fins protruding from a heat dissipation surface of the heat dissipation plate and formed to be exposed from the sealing resin material, and a wall portion formed to protrude from the heat dissipation surface to a same side as the fin and which separates the fin portion and the resin region.
    Type: Application
    Filed: August 26, 2015
    Publication date: September 6, 2018
    Inventors: Nobutake TSUYUNO, Takeshi TOKUYAMA, Eiichi IDE
  • Patent number: 10068880
    Abstract: It is an object of the present invention to provide a power module which can withstand a high voltage with a thin insulating layer.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: September 4, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Nobutake Tsuyuno, Junpei Kusukawa, Takeshi Tokuyama, Tokihito Suwa
  • Publication number: 20180218963
    Abstract: An object of the present invention is to provide a power module capable of realizing a superior heat radiation property while satisfying a high insulation property. A power module according to the present invention includes: a conductor plate to which a switching element is connected; a heat radiation plate which is disposed to face the conductor plate; an insulating member which is disposed between the conductor plate and the heat radiation plate; and a conductive intermediate conductor which is disposed in the insulating member in a state of being electrically insulated from the conductor plate and the heat radiation plate, wherein the intermediate conductor has a communication region which communicates between the insulating member disposed on the side of the conductor plate with respect to the intermediate conductor and the insulating member disposed on the side of the heat radiation plate with respect to the intermediate conductor.
    Type: Application
    Filed: July 11, 2016
    Publication date: August 2, 2018
    Inventors: Fusao HOJO, Nobutake TSUYUNO, Toshiaki ISHII, Junpei KUSUKAWA, Akira MATSUSHITA
  • Publication number: 20180211938
    Abstract: It is an object of the present invention to provide a power module which can withstand a high voltage with a thin insulating layer.
    Type: Application
    Filed: June 8, 2015
    Publication date: July 26, 2018
    Inventors: Nobutake TSUYUNO, Junpei KUSUKAWA, Takeshi TOKUYAMA, Tokihito SUWA
  • Publication number: 20180190425
    Abstract: An ignition coil for an internal combustion engine includes an iron core, a primary coil disposed around the iron core, a secondary coil disposed around the primary coil, and an insulating portion sealing the iron core, the primary coil, and the secondary coil. The insulating portion includes a resin and a linear aliphatic group-containing organic substance, and has a sea-island structure in which the organic substance is dispersed in a matrix of the resin.
    Type: Application
    Filed: December 14, 2017
    Publication date: July 5, 2018
    Inventors: Masayuki KAMIKAWA, Yu Yasuda, Nobutake Tsuyuno, Toshiaki Ishii
  • Patent number: 9852962
    Abstract: A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating member provided on the electronic component in a thermally conductive manner, and an insulating material that surrounds the electronic component in such a manner that one surface of the heat dissipating member is exposed; and a waterproof film that is formed at least on whole surfaces in regions of the electronic component module that are to be immersed in a coolant.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: December 26, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroyuki Temmei, Mina Amo, Nobutake Tsuyuno, Eiichi Ide, Takeshi Tokuyama, Toshiya Satoh, Toshiaki Ishii, Kazuaki Naoe
  • Publication number: 20170365536
    Abstract: An electronic device includes electronic components and an epoxy resin portion which seals the electronic components. The electronic device is disposed in a refrigerant which cools the electronic components. A first layer having a three-dimensional crosslinking structure is formed on a surface or inside of the epoxy resin portion. The first layer is formed such that a length calculated by cube root of an average free volume in the three-dimensional crosslinking structure of the first layer is shorter than a length of the longest side of molecules forming the refrigerant.
    Type: Application
    Filed: January 8, 2016
    Publication date: December 21, 2017
    Inventors: Mina AMO, Nobutake TSUYUNO, Takeshi TOKUYAMA, Toshiya SATOH