Abstract: A pin switch board matrix is described including a laminated board with two insulative substrates each, provided with a plurality of parallel conductive X-patterns and Y-patterns, made of resilient metal wires, respectively. The laminated board has a plurality of through holes, each penetrating the two substrates, at positions corresponding to intersections of the respective X and Y-conductive patterns. When a short plug is inserted into a selected through hole, the X and Y-patterns corresponding to the selected via the short plug. The substrates have a plurality of parallel guide grooves for receiving the wire patterns.