Abstract: An amplifier is equipped with an input terminal and an output terminal and has a transistor as an amplifying element, said amplifier comprising:a negative feedback circuit provided in said transistor; anda parallel circuit which includes an inductive element and a resistive element connected in series between the input terminal of said amplifier and an input terminal of said transistor, or between the output terminal of said amplifier and an output terminal of said transistor.

Abstract: In a hybrid integrated circuit module in which circuit components, including semiconductor devices and chip components, are integrated and which is bonded onto a heat-sinking substrate, a substrate for mounting chip components is made of a low thermal conductivity material and is bonded onto the heat-sinking substrate; a base plate for mounting semiconductor devices is made of a high thermal conductivity material and is bonded onto the heat-sinking substrate; a hollow cover covers a space above the base plate to make an enclosure between the base plate and the cover; a sealing means hermetically seals the enclosure; and a plurality of interconnection leads is formed through the cover to electrically connect a circuit on the base plate and a circuit on the substrate and for testing operating signals in the semiconductor devices.

Abstract: A high-power and high-frequency semiconductor device assembled on a base, comprising a semiconductor chip, capacitors for grounding high-frequency components, and capacitors for input impedance matching, the capacitors being arranged on a metal surface of the base.