Abstract: A method of heat-treating a substrate to be loaded/unloaded to and from a substrate heating device for a prescribed time period cycle including the steps of transferring the substrate from a substrate conveying robot to a substrate transferring and receiving device, holding the received substrate in a position where it is subjected to only a limited influence of heating by a hot plate for a first time period prior to transferring the substrate to the hot plate, heating the substrate by the hot plate for a second time period, and removing the substrate from the hot plate by the substrate conveying robot after the second time period elapses. Preferably, the sum of the first time period and the second time period approximately equals the cycle time period.

Abstract: A periphery exposing apparatus for exposing a periphery of a wafer having a curved circumferential peripheral portion and a linear portion comprises a spin chuck for rotatably supporting the wafer, a light source disposed above the spin chuck for exposing the wafer periphery, and a detector for detecting the line or portion. When the linear portion is being exposed, the light source is moved along the linear portion, rather than circularly around the periphery.

Abstract: An improved processing apparatus for a substrate surface, which provides uniform and smooth air flows A within the processing chamber 26, by which an even thin film of a processing solution can be formed on the substrate surface. Undersirable surplus processing solution is collected primarily in a first chamber 13. A second chamber 15 is provided which is separate from the first chamber and pneumatically communicated therewith through a slit 16.