Patents by Inventor Nobuya Nakamura
Nobuya Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200115543Abstract: [Abstract] An epoxy resin composition having an excellent balance among the shrinkage rate during cure-molding, heat resistance of the cured product, and the thermoelastic modulus of the cured product, is provided. More specifically, provided is an epoxy resin composition including a naphthalene-type epoxy compound and a curing agent for an epoxy resin, the naphthalene-type epoxy compound having: a naphthalene ring; at least one group (A) which is directly bonded to the naphthalene ring and selected from the group consisting of an allyl group and a glycidyl group; and at least one group (B) which is directly bonded to the naphthalene ring and selected from the group consisting of an allyloxy group and a glycidyloxy group, with the proviso that the compound has at least one of the allyl group and the allyloxy group and at least one of the glycidyl group and the glycidyloxy group.Type: ApplicationFiled: November 28, 2017Publication date: April 16, 2020Inventors: Kazuhisa Yamoto, Nobuya Nakamura
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Publication number: 20200087444Abstract: It is an issue to provide an epoxy resin that has excellent fluidity and curability, that provides a cured product with favorable moisture resistance and mechanical strength, and that is suitable for use in a semiconductor sealing material, a circuit board, and the like, to provide a method for producing the epoxy resin, and to provide an epoxy resin composition containing the epoxy resin and a cured product of the epoxy resin composition. Specifically, an epoxy resin that is epoxy resin (A) primarily containing epoxidized dihydroxybenzene in which an alkyl group having a carbon number of 1 to 8 may be included as a substituent on an aromatic ring, wherein the area ratio of the maximum peak in GPC measurement is 90% or more, a method for producing the epoxy resin, an epoxy resin composition containing the epoxy resin, and a cured product of the epoxy resin composition are provided.Type: ApplicationFiled: March 13, 2018Publication date: March 19, 2020Inventors: Kazuhisa Yamoto, Gensuke Akimoto, Nobuya Nakamura
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Patent number: 9580634Abstract: Provided are a phenolic-hydroxyl containing resin, an epoxy resin, and a curable resin composition containing either resin that have high flowability and exhibit high heat resistance and flame retardancy after curing, a cured composition formed therefrom, and a sealant. A phenolic-hydroxyl containing resin is prepared by reacting a polycondensate of a phenolic compound (a) and formaldehyde with an aralkylating agent. The phenolic-hydroxyl containing resin contains as essential components a monoaralkylated derivative (x1) of the phenolic compound (a) having one aralkyl group on an aromatic nucleus thereof and a diaralkylated derivative (x2) of the phenolic compound (a) having two aralkyl groups on an aromatic nucleus thereof. An epoxy resin is prepared by converting the phenolic-hydroxyl containing resin into a polyglycidyl ether.Type: GrantFiled: November 6, 2013Date of Patent: February 28, 2017Assignee: DIC CorporationInventors: Norio Nagae, Yousuke Hirota, Yutaka Satou, Nobuya Nakamura
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Publication number: 20150291861Abstract: Provided are a phenolic-hydroxyl containing resin, an epoxy resin, and a curable resin composition containing either resin that have high flowability and exhibit high heat resistance and flame retardancy after curing, a cured composition formed therefrom, and a sealant. A phenolic-hydroxyl containing resin is prepared by reacting a polycondensate of a phenolic compound (a) and formaldehyde with an aralkylating agent. The phenolic-hydroxyl containing resin contains as essential components a monoaralkylated derivative (x1) of the phenolic compound (a) having one aralkyl group on an aromatic nucleus thereof and a diaralkylated derivative (x2) of the phenolic compound (a) having two aralkyl groups on an aromatic nucleus thereof. An epoxy resin is prepared by converting the phenolic-hydroxyl containing resin into a polyglycidyl ether.Type: ApplicationFiled: November 6, 2013Publication date: October 15, 2015Inventors: Norio Nagae, Yousuke Hirota, Yutaka Satou, Nobuya Nakamura
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Publication number: 20130184377Abstract: The present invention provides a heat-curable resin composition having excellent fluidity and realizing moisture-resistance reliability suitable for recent electronic component-related materials and high flame retardancy in a halogen-free state for harmony with the environment, a cured product thereof, a semiconductor encapsulating material using the composition, and a phenol resin and epoxy resin which give these performances. The heat-curable resin composition includes, as essential components, an epoxy resin (A) and a phenol resin (B), the phenol resin (B) having a phenol resin structure having, as a basic skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded to each other through an alkylidene group or a methylene group having an aromatic hydrocarbon structure, and an aromatic nucleus of the phenol resin structure has a naphthylmethyl group or an anthrylmethyl group.Type: ApplicationFiled: July 19, 2011Publication date: July 18, 2013Applicant: DIC CORPORATIONInventors: Ichirou Ogura, Yousuke Hirota, Yoshiyuki Takahashi, Norio Nagae, Nobuya Nakamura
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Patent number: 7569654Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.Type: GrantFiled: June 19, 2006Date of Patent: August 4, 2009Assignee: DIC CorporationInventors: Ichiro Ogura, Nobuya Nakamura, Tomoyuki Imada
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Patent number: 7456247Abstract: A phenolic resin, which is the reaction product of a difunctional phenol compound and a divinyl ether having a cycloalkane structure, is provided. The phenolic resin is used to form a difunctional epoxy resin. The resulting epoxy resin features relatively increased molecular weight, and it is used to impart flexibility or improved dielectric properties. It also provides improved moisture and water resistance when used to produce a cured epoxy resin article.Type: GrantFiled: June 19, 2006Date of Patent: November 25, 2008Assignee: Dainippon Ink and Chemicals, Inc.Inventors: Ichiro Ogura, Nobuya Nakamura, Tomoyuki Imada
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Patent number: 7365147Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.Type: GrantFiled: June 19, 2006Date of Patent: April 29, 2008Assignee: Dainippon Ink and Chemicals, Inc.Inventors: Ichiro Ogura, Nobuya Nakamura, Tomoyuki Imada
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Publication number: 20060247392Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.Type: ApplicationFiled: June 19, 2006Publication date: November 2, 2006Applicant: DAINIPPON INK AND CHEMICALS, INC.Inventors: Ichiro Ogura, Nobuya Nakamura, Tomoyuki Imada
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Publication number: 20060241274Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.Type: ApplicationFiled: June 19, 2006Publication date: October 26, 2006Applicant: DAINIPPON INK AND CHEMICALS, INC.Inventors: Ichiro Ogura, Nobuya Nakamura, Tomoyuki Imada
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Publication number: 20060235183Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.Type: ApplicationFiled: June 19, 2006Publication date: October 19, 2006Applicant: DAINIPPON INK AND CHEMICALS, INC.Inventors: Ichiro Ogura, Nobuya Nakamura, Tomoyuki Imada
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Patent number: 7087702Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.Type: GrantFiled: October 14, 2003Date of Patent: August 8, 2006Assignee: Dainippon Ink and Chemicals, Inc.Inventors: Ichiro Ogura, Nobuya Nakamura, Tomoyuki Imada
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Publication number: 20040087740Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.Type: ApplicationFiled: October 14, 2003Publication date: May 6, 2004Applicant: DAINIPPON INK AND CHEMICALS, INC.Inventors: Ichiro Ogura, Nobuya Nakamura, Tomoyuki Imada