Patents by Inventor Nobuya Ohyama

Nobuya Ohyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5384432
    Abstract: A tape lead wire includes a polymer resin film and conductor films. The conductor films are directly deposited on the surface of the polymer resin film without using any bonding layer. The total thickness of the tape lead wire can be made smaller than that of a conventional lead wire. The tape lead wire has a high flexibility, can be easily bent, can extremely reduce the bending spring rigidity and is suitable for a magnetic head having a reduced size and load, which is imposed by a head supporting device on the magnetic head, and lowered flying height and peripheral speed.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: January 24, 1995
    Assignee: TDK Corporation
    Inventors: Tetsuya Noro, Masahiko Itoh, Nobuya Ohyama, Hiroshi Kanai, Masaharu Ishizuka
  • Patent number: 5236735
    Abstract: A method of producing a thin film magnetic head comprises forming a thin film magnetic circuit including a magnetic film and a conductive coil film on a substrate, and heating the thin film magnetic circuit at a temperature in a range of from 270.degree. C. to 400.degree. C. before forming a protective layer covering the thin film magnetic circuit.
    Type: Grant
    Filed: June 13, 1991
    Date of Patent: August 17, 1993
    Assignee: TDK Corporation
    Inventors: Makoto Yoshida, Yuzuru Iwai, Noboru Yamanaka, Jun Shouzi, Tsutomu Koyanagi, Mikio Matsuzaki, Nobuya Ohyama, Yoshiaki Tanaka