Abstract: When an abnormality occurs in a refrigeration cycle, the inverter motor provided in the air conditioner is stopped reliably and contacts of the main relay are prevented from degradation and fusion. A power circuit 1 of the air conditioner includes a rectifier circuit RC, a capacitor C (smoothing unit), a main relay 10 provided on a current path between the rectifier circuit RC and the capacitor C, an inverter circuit 30, a microcomputer 100, and a delay circuit 40. The microcomputer 100 has an inverter circuit control unit 110, a main relay opening/closing control unit 120, a waveform forced cut-off unit 130, and a cut-off signal output unit 140.

Abstract: A substrate treatment apparatus includes a substrate holding mechanism for holding a substrate, a brush made of an elastically deformable material and having a cleaning surface formed in a shape tapered toward one side in a perpendicular direction perpendicular to one surface of the substrate held by the substrate holding mechanism and inclined with respect to the perpendicular direction, a brush moving mechanism for moving the brush with respect to the substrate held by the substrate holding mechanism, and a control unit for controlling the brush moving mechanism so that the cleaning surface is pushed to a peripheral area on the one surface and a peripheral end face of the substrate held by the substrate holding mechanism.

Abstract: A substrate treatment apparatus including a substrate holding mechanism for holding a substrate; a first brush made of an elastically deformable material and having a cleaning surface inclined with respect to a perpendicular direction perpendicular to one surface of the substrate held by the substrate holding mechanism; a first brush moving mechanism for moving the first brush with respect to the substrate held by the substrate holding mechanism; a controller for controlling the first brush moving mechanism so that the cleaning surface is made to contact with a peripheral area on the one surface and a peripheral end face of the substrate held by the substrate holding mechanism; and a first pushing pressure holding mechanism for holding a pushing pressure of the first brush in the perpendicular direction to the peripheral area on the one surface of the substrate at a preset pushing pressure.

Abstract: A substrate treatment apparatus includes a substrate holding mechanism for holding a substrate, a brush made of an elastically deformable material and having a cleaning surface formed in a shape tapered toward one side in a perpendicular direction perpendicular to one surface of the substrate held by the substrate holding mechanism and inclined with respect to the perpendicular direction, a brush moving mechanism for moving the brush with respect to the substrate held by the substrate holding mechanism, and a control unit for controlling the brush moving mechanism so that the cleaning surface is pushed to a peripheral area on the one surface and a peripheral end face of the substrate held by the substrate holding mechanism.

Abstract: A substrate treatment apparatus of the present invention includes a substrate holding mechanism for holding a substrate, a brush made of an elastically deformable material and having a cleaning surface intersecting a parallel direction along one surface of the substrate held by the substrate holding mechanism, a brush moving mechanism for moving the brush with respect to the substrate held by the substrate holding mechanism, a control unit for controlling the brush moving mechanism so that the cleaning surface is made to contact with the peripheral end face of the substrate held by the substrate holding mechanism, and a pushing pressure holding mechanism for holding the pushing pressure of the brush to the peripheral end face of the substrate in the parallel direction at a preset pushing pressure.

Abstract: A substrate treatment apparatus including a substrate holding mechanism for holding a substrate; a first brush made of an elastically deformable material and having a cleaning surface inclined with respect to a perpendicular direction perpendicular to one surface of the substrate held by the substrate holding mechanism; a first brush moving mechanism for moving the first brush with respect to the substrate held by the substrate holding mechanism; a controller for controlling the first brush moving mechanism so that the cleaning surface is made to contact with a peripheral area on the one surface and a peripheral end face of the substrate held by the substrate holding mechanism; and a first pushing pressure holding mechanism for holding a pushing pressure of the first brush in the perpendicular direction to the peripheral area on the one surface of the substrate at a preset pushing pressure.

Abstract: A substrate processing apparatus that removes an unwanted material on a surface of a peripheral portion of a substrate through etching by supplying etching liquid to the surface of the peripheral portion. The apparatus includes an etching liquid supplying mechanism that supplies the etching liquid to the peripheral portion of the substrate, and an annular member that has an inner periphery on or inside an outer periphery of the substrate and thereby defines a processing width to be processed by the etching liquid on the surface of the peripheral portion of the substrate. The annular member may be placed in close proximity to the surface of the peripheral portion of the substrate while securing a certain gap such that allows the annular member to come in contact with a liquid film of the etching liquid formed on the surface of the peripheral portion.

Abstract: A plurality of brush support arms, each having a distal end unit brush attached thereto, stand by in juxtaposition in a standby position. The brush support arm having a desired brush attached thereto is selected from the plurality of brush support arms. Then, the selected brush support arm is connected at its proximal end to a distal end of a swing arm. The brush support arm engaged with the swing arm is swung with the swing arm about a pivotal point at a proximal end of the swing arm. As a result, the brush attached to the distal end of the selected brush support arm is moved between the standby position and the center of a substrate, to clean the substrate with this brush. Upon completion of this substrate cleaning, the brush support arm is returned to the standby position. A different brush support arm is selected in the standby position for use in a subsequent cleaning operation, and the substrate is cleaned with the brush connected to this different brush support arm.

Abstract: A plurality of substrate holding members and a substrate pressing member are disposed on a rotation stage at a peripheral portion. The substrate pressing member includes a magnet and is pivotally supported by the rotation stage. A ring-shaped permanent magnet is located below the rotation stage and forms a ring around the rotation axis of the rotation stage. When a substrate mounted on the rotation stage is rotated and processed, the ring-shaped permanent magnet is positioned in the vicinity of the magnet of the substrate pressing member. This creates a magnetic force between the magnets, causing the substrate pressing member to pivot so that the substrate pressing member contacts the edge of the substrate with a predetermined amount of pressure.