Abstract: A scan type exposure for transferring a pattern onto a substrate by scan exposure. The apparatus includes a stage for moving the substrate in a Y direction corresponding to a scan direction, and in an X direction intersecting the scan direction, an alignment scope for performing measurement for alignment of the substrate, at a position spaced, in the Y direction, from a position where the exposure of the substrate is to be carried out, an X measuring device for performing yaw measurement of said stage by use of an X reflection surface provided on said stage along the Y direction, a Y measuring device for performing yaw measurement of the stage by use of a Y reflection surface provided on the stage along the X direction, and a controller being operable to select yaw measurement information of the X measuring device for an alignment operation including the alignment measurement using the alignment scope, and being operable to select yaw measurement information of the Y measuring device for the scan exposure.

Abstract: A photolithographic apparatus in which a light source exposes a substrate for patterning includes an enclosure having a controllable internal ambient for transferring the substrate in and out of the apparatus, a gate valve through which the substrate is transferred into or out of the enclosure, and a gas ejection unit for ejecting a gas into a region in close proximity to the gate valve, and in a direction substantially perpendicular to the direction of movement of the substrate as it is transferred into or out of the enclosure. A gas curtain is formed by the gas ejected by the gas ejection unit, such that an opening of the gate valve is shielded by the gas curtain, thereby suppressing intrusion or leakage of an ambient gas which can occur when the substrate is transferred in or out of the apparatus.

Abstract: A reference plate used with an exposure apparatus that emits an exposure beam to irradiate a reference mark pattern with observation light, to detect the reflected light, and to obtain a position of the reference mark pattern. A respective reference plate is fixed on a mask stage and a wafer stage of the exposure apparatus for exposing a wafer on the wafer stage to a mask pattern on the mask stage, and a surface of the reference mark pattern, which is an observation light irradiation surface side of the exposure apparatus, is not directly exposed to the surrounding atmosphere.

Abstract: A scan type exposure apparatus in which a pattern formed on an original is transferred a substrate while relatively moving the original and the substrate relative to a projection optical system, wherein a stage is servo controlled on the basis of measurement of X and Y coordinates (x,y) and yawing component &thgr;, and wherein yawing measuring systems provided in relation to X and Y directions are selectively used in accordance with the state of operation of the apparatus so that the yawing component measurement direction is laid on preferable one of the X and Y directions.

Abstract: A driving apparatus for moving an object has a stage which moves the object mounted thereon, a base member supporting the stage, a reaction force reception structure for receiving a reaction force generated upon driving the stage, a damp member for damping transmission of vibration with a predetermined frequency range from the reaction force reception structure to a floor and an actuator for generating a force between the base member and the reaction force reception structure.

Abstract: A reference plate for irradiating a reference mark pattern with observation light, detecting the reflected light, and obtaining the position of the reference mark pattern has a position where the reference mark pattern is not directly exposed to the observation light.

Abstract: This invention is to reduce the influence of vibration or swing due to movement of stages, and minimize the influence on other apparatuses set on the same floor by decreasing the influence of a reaction force according to acceleration/deceleration of the stages on the floor. A driving apparatus includes a movable stage on which an object to be exposed is mounted, a stage base member supporting the stage, and a reaction force reception structure which is different from the stage base member and receives a reaction force generated upon driving the stage. Transmission of vibration with a predetermined frequency or more is damped between the reaction force reception structure and a floor. The apparatus also has an elastic support elastically supporting the reaction force reception structure with respect to the floor or base frame, and a force actuator such as a linear motor for generating a force between the stage base member and the reaction force reception structure.

Abstract: An apparatus includes an enclosure having a controllable internal ambient, a gate valve through which a substrate is transferred into or out of the enclosure, and a gas ejection unit for ejecting a gas into a region in close proximity to the gate valve, and in a direction substantially perpendicular to the direction of movement of the substrate as it is transferred into or out of the enclosure. A gas curtain is formed by the gas ejected by the gas ejection unit, such that an opening of the gate valve is shielded by the gas curtain, thereby suppressing intrusion or leakage of an ambient gas which can occur when the substrate is transferred tin or out of the apparatus.

Abstract: A wafer chuck for releasably holding a wafer, includes a base member having an upper surface for carrying and holding thereon the wafer, a lift mechanism operative on the wafer when it rests on the base member to move the wafer relative to the base member in a direction away from the base member, the lift mechanism having an operative member extending substantially in a direction to a radially inward position from a radially outward position of the base member, the operative member having an end portion movable, relative to the base member, between a first position at which it is retracted from the upper surface of the base member and a second position at which it is protrudent from the upper surface of the base member so as to engage with the wafer to move the same relative to the base member, and driving means for moving, relative to the base member, the end portion of the operative member between the first and second positions.