Abstract: A surface machining method for obtaining a planar material of a uniform thickness is provided. This method includes mounting a planar material on a surface plate, setting the coordinate axis in the plane direction of the planar material to X, Y, and setting the coordinate axis in the height direction to Z, virtualizing an XY plane including an origin of the Z direction measured as a distance Z(m,n) from the coordinates (Xm, Yn) of a virtual plane ABCD to the plate thickness center plane S composed of midpoints of segments connecting an upper surface and a lower surface of the planar material, measuring the distance in the Z direction of the plate thickness center plane from the origin in an arbitrary XY plane position, and tilting and cutting the planar material so that the difference between maximum and minimum value of the obtained height data will be minimum.

Abstract: Provided is a surface treatment method for performing machining such as cutting work, grinding, and electrical discharging to a plate-like material with two- or three-dimensional deformation to realize a uniform thickness. This method includes the steps of mounting the plate-like material on a surface plate, setting a coordinate axis in a plane direction of the plate-like material to be X, Y and setting a coordinate axis in a height direction of the plate-like material to be Z, virtualizing a surface containing an origin of the measured Z direction, measuring a height Z1-n from the origin in an arbitrary plane position, and inclining and cutting the plate-like material so that an absolute value of a difference between a maximum value Zmax and a minimum value Zmin of the obtained height data will be minimum.

Abstract: Provided is a surface machining method for performing machining such as cutting, grinding, electrical discharging or the like to obtain a planar material of a uniform thickness.

Abstract: Provided is a surface treatment method for performing machining such as cutting work, grinding, and electrical discharging to a plate-like material with two- or three-dimensional deformation to realize a uniform thickness. This method includes the steps of mounting the plate-like material on a surface plate, setting a coordinate axis in a plane direction of the plate-like material to be X, Y and setting a coordinate axis in a height direction of the plate-like material to be Z, virtualizing a surface containing an origin of the measured Z direction, measuring a height Z1-n from the origin in an arbitrary plane position, and inclining and cutting the plate-like material so that an absolute value of a difference between a maximum value Zmax and a minimum value Zmin of the obtained height data will be minimum.