Patents by Inventor Nobuyoshi SHIMBORI

Nobuyoshi SHIMBORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMBER FOR ELECTRIC CONDUCTION, METHOD FOR MANUFACTURING MEMBER FOR ELECTRIC CONDUCTION, POWER CONVERSION DEVICE, MOTOR, SECONDARY BATTERY MODULE, AND SECONDARY BATTERY PACK
    Publication number: 20230145824
    Abstract: A member for electric conduction, comprising a metal member and a resin member that is joined to at least a part of a surface of the metal member, the metal member having a roughness index, which is obtained by dividing a true surface area (m2) measured by a krypton adsorption method by a geometric surface area (m2), of 4.0 or more.
    Type: Application
    Filed: January 29, 2021
    Publication date: May 11, 2023
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kazuki KIMURA, Tomoki TORII, Takahiro TOMINAGA, Kai MORIMOTO, Shinji NAKAJIMA, Isao WASHIO, Nobuyoshi SHIMBORI, Junya SHIMAZAKI, Jingjun ZHANG, Akinori AMANO, Haruka DOI
  • HOUSING, STRUCTURAL BODY, AND METHOD OF MANUFACTURING HOUSING
    Publication number: 20230051560
    Abstract: A cooling type housing (100) for housing a heating element (50) inside, including: an assembled metal housing (10); and a cooling flow path (30) provided at least on one surface (10A) of the metal housing (10), in which a heat medium flows, in which the cooling flow path (30) constitutes at least a part of the one surface (10A) of the metal housing (10).
    Type: Application
    Filed: January 14, 2021
    Publication date: February 16, 2023
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kazuki KIMURA, Nobuyoshi SHIMBORI, Mizue KURIYAGAWA
  • Electronic device housing, method for manufacturing electronic device housing, development plan-shaped metal resin joint plate, and electronic apparatus
    Patent number: 10827658
    Abstract: An electronic device housing of the present invention is a housing for internally accommodating an electronic device and is provided with a metal bottom plate, and metal side plates folded and integrally connected to the bottom plate, in which, in a metal member (M) formed of at least the bottom plate and the side plate, a thermoplastic resin member is joined to a portion of the surface of the plate-shaped metal member (M), the metal member (M) is reinforced by a thermoplastic resin member, and the thermoplastic resin member is joined to both surfaces of the plate-shaped metal member (M).
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: November 3, 2020
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Shinya Naito, Nobuyoshi Shimbori
  • ELECTRONIC DEVICE HOUSING, METHOD FOR MANUFACTURING ELECTRONIC DEVICE HOUSING, DEVELOPMENT PLAN-SHAPED METAL RESIN JOINT PLATE, AND ELECTRONIC APPARATUS
    Publication number: 20190191598
    Abstract: An electronic device housing of the present invention is a housing for internally accommodating an electronic device and is provided with a metal bottom plate, and metal side plates folded and integrally connected to the bottom plate, in which, in a metal member (M) formed of at least the bottom plate and the side plate, a thermoplastic resin member is joined to a portion of the surface of the plate-shaped metal member (M), the metal member (M) is reinforced by a thermoplastic resin member, and the thermoplastic resin member is joined to both surfaces of the plate-shaped metal member (M).
    Type: Application
    Filed: August 23, 2017
    Publication date: June 20, 2019
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Shinya NAITO, Nobuyoshi SHIMBORI