Abstract: A vibration-sensing gyro composed of a light alloy such as duralumin includes a base and a first pair of tines projecting parallel to each other from the base. Piezoelectric elements are mounted on the root of the side faces of the first pair of tines to excite the first pair of tines along an X axis. The vibrations of the first pair of tines along the X axis are then propagated to a second pair of tines to vibrate the second pair of tines along the X axis. Piezoelectric elements are mounted on the root of the upper and the lower faces of the second pair of tines to detect vibrations of the second pair of tines along an Y axis. When the second pair of tines receives the Coriolis force based on an angular velocity .omega. around a Z axis and vibrates along the Y axis, the vibrations along the Y axis are detected as electric signals (alternating current voltages) by piezoelectric effects of the piezoelectric elements.

Abstract: The invention provides a vibration-sensing gyro, where resonance frequencies of tines are adjusted adequately in a simple manner. A vibration-sensing gyro (10) of the invention is made of a light alloy plate like duralumin and includes a first tine (14) and a second tine (16) disposed parallel to each other and projecting from a base (12). When the first tine (14) has a length l1, a width w1 along the X axis, and a thickness t1 and the second tine (16) has a length l2, a width w2 along the X axis, and a thickness t2 (=t1), the first tine (14) and the second tine (16) hold the relationship of l2/.sqroot.t2=l1/.sqroot.w1. In other words, the tines (14,16) and the base (12) are manufactured to satisfy this relationship. Such definition of the dimensions makes a resonance frequency fx1 of the first tine along the X axis coincide with a resonance frequency fy 2 of the second tine 16 along the Y axis.

Abstract: Disclosed is a semiconductor device such as a DIP (Dual In-line Package) or PGA (Pin Grid Alley), which has a plurality of leads protruding only from one surface of a flat package. A single independent lead protrudes from the surface of the package at the position which is aligned with a guide hole formed in the package. The independent lead has a bore which penetrates through the lead lengthwise and connects to the guide hole. A wiring member of an electronic part or the like placed in the bore via the guide hole is soldered to the inner wall of the independent terminal.