Abstract: A gate array integrated circuit on a single chip has a standardized memory cell array, in a matrix, and a plurality of basic cells constituting a gate array unit. The integrated circuit is standardized as to its interconnections except for the basic cells constituting the gate array and other components, such as input/output buffers associated with an application specific wiring of the basic cells of the gate array. Connection between the gate array unit and the memory cell array is through a data register and switching circuit that can buffer data and arrange for the transfer of data at a selected data width up to the number of bits in a word line of the memory cell array, to provide for sufficient independence of the memory cell array and all of its necessary circuitry from the specific application wiring of the gate array unit, so that the memory cell array may be standardized.

Abstract: An SRAM including a memory cell having a high-resistance load element. The load element is formed from a polysilicon film, and an impurity is introduced into at least a part of the polysilicon film for the purpose of increasing the threshold voltage of a parasitic MISFET formed using the load element as its channel region. Alternatively, the deposition of the polysilicon film is carried out at a relatively high temperature, thereby preventing any increase in the current flowing through the load element, and thus reducing the power dissipation in the SRAM.

Abstract: An SRAM including a memory cell having a high-resistance load element. The load element is formed from a polysilicon film, and an impurity is introduced into a least a part of the polysilicon film for the purpose of increasing the threshold voltage of a parasitic MISFET formed using the load element as its channel region. Alternatively, the deposition of the polysilicon film is carried out at a relatively high temperature, thereby preventing any increase in the current flowing through the load element, and thus reducing the power dissipation in the SRAM.

Abstract: A semiconductor memory is disclosed which comprises a memory array, an address counter designating the address of the memory array, a shift register to which the data signals read out from the memory array are preset, and a control circuit. When all the data preset to the shift register is shifted out to an external terminal, the control circuit updates the address counter. The data produced from the new address of the memory array is again preset to the shift register. The same operation is thereafter repeated, thereby producing serial data signals at the external terminal. The semiconductor memory having such a construction can read out continuous data signals without any need for external address signals.

Abstract: A method of making a static random-access memory device or SRAM including a memory cell having a high-resistance load element. The load element is formed from a polysilicon film, and an impurity is introduced into at least a part of the polysilicon film for the purpose of increasing the threshold voltage of a parasitic MISFET formed using the load element as its channel region. Alternatively, the deposition of the polysilicon film is carried out at a relatively high temperature, thereby preventing any increase in the current flowing through the load element, and thus reducing the power dissipation in the SRAM.

Abstract: Herein disclosed is a semiconductor memory device which is composed of a peripheral circuit unit equipped with a gate protection circuit having a protection resistor and a memory cell unit so that it can be used as an MISFET type static RAM and which is characterized in that the protection resistor is made of a polycrystalline silicon film having substantially the same resistivity as that of an overlying polycrystalline silicon film formed to merge into the load resistor of the memory cell unit.

Abstract: The dynamic RAM has a refresh circuit with two operation modes. In the first operation mode, a variety of signals necessary for the refresh operation are formed in the dynamic RAM. Accordingly, the refresh operation of the dynamic RAM is performed completely automatically. As long as the refresh operation is being carried out, a busy signal is produced from the dynamic RAM to prevent an erroneous writing operation or reading operation. In the second operation mode, the refresh operation of the dynamic RAM is performed in synchronism with a starting signal supplied from an external unit. The busy signal produced by the dynamic RAM that is working under the first operation mode can be used as a starting signal for the dynamic RAM that is working under the second operation mode. Therefore, the refresh operation is effected in synchronism for the dynamic RAM's that constitute the memory system, and the through-put of the memory system is enhanced.

Abstract: Herein disclosed is a semiconductor memory device which is composed of a peripheral circuit unit equipped with a gate protection circuit having a protection resistor and a memory cell unit so that it can be used as an MISFET type static RAM and which is characterized in that the protection resistor is made of a polycrystalline silicon film having substantially the same resistivity as that of an overlying polycrystalline silicon film formed to merge into the load resistor of the memory cell unit.

Abstract: In a static type RAM, a sense amplifier includes first and second dissymmetric type differential amplifier circuits each of which has a pair of differential transistors and an active load circuit such as a current mirror circuit connected to the drains of the differential transistors. One of balanced signals delivered from a memory cell is supplied to the non-inverting input terminal of the first dissymmetric type differential amplifier circuit and the inverting input terminal of the second dissymmetric type differential amplifier circuit. The other of said balanced signals is applied to the remaining input terminals of the first and second dissymmetric type differential amplifier circuits. As a result, notwithstanding that balanced signals cannot be delivered from each dissymmetric type differential amplifier circuit, amplified balanced signals can be obtained.

Abstract: In a MOS static RAM, data lines disposed in a memory array and common data lines to be coupled with the data lines through a data line selection circuit are supplied with bias voltages of a level lower than a power source voltage level through bias MOSFETs. Normally, where the stand-by period of the RAM is long, the bias voltages of the data lines and the common data lines are abnormally raised by the leakage currents or tailing currents of the bias MOSFETs. As a result, the data read-out speed of the RAM is lowered. Such abnormal potential increases of the data lines and the common data lines are prevented by connecting resistance elements of comparatively high resistances (such as made of polycrystalline silicon layers), between the respective data lines and common data lines and the ground point of the circuitry.

Abstract: The address decoder for one axis comprises NAND circuits while the address decoder for the other axis comprises NOR circuits. A semiconductor memory circuit device comprises at least first and second decoder circuits. The first decoder circuit is so constructed as to receive at least partial address signals among address signals of a plurality of bits and to provide decoded signals of the partial address signals as intermediate signals. The second decoder circuit is so constructed as to receive the intermediate signals, to thereby provide signals for selecting from among a plurality of memory circuits a memory circuit determined by the address signals of the plurality of bits. Thus, the semiconductor memory circuit device is allowed to operate at a high speed. A semiconductor substrate on which the semiconductor memory circuit device is formed can also be made comparatively small.

Abstract: Digit lines, connected to the input and output terminals of a memory cell composed of MISFETs, are coupled to common data lines through a switching circuit which is controlled by a decoder circuit. There is also connected with the digit lines a load which is composed of a plurality of enhancement mode MISFETs connected in series in the diode form. The high level of the signals at the digit lines is lowered by the action of the load means. In response to the reduction in the potentials at the digit lines, the switching means is rendered conductive at an early rise time of control signals. As a result, the operating speed of the memory circuit can be increased.

Abstract: In a static type RAM, a sense amplifier includes first and second dissymmetric type differential amplifier circuits each of which has a pair of differential transistors and an active load circuit such as a current mirror circuit connected to the drains of the differential transistors. One of balanced signals delivered from a memory cell is supplied to the non-inverting input terminal of the first dissymmetric type differential amplifier circuit and the inverting input terminal of the second dissymmetric type differential amplifier circuit. The other of said balanced signals is applied to the remaining input terminals of the first and second dissymmetric type differential amplifier circuits. As a result, notwithstanding that balanced signals cannot be delivered from each dissymmetric type differential amplifier circuit, amplified balanced signals can be obtained.