Abstract: An apparatus for making a semiconductor device comprises a flexible mat, support shafts for supporting the flexible mat in a substantially horizontal position, a pressing plate having a generally convex body and supported for movement up and down, and a drive mechanism for driving one of the pressing plate and the wafer relative to the other of the pressing plate and the wafer so as to move up and down. The wafer having the first and second surfaces opposite to each other with the chips formed on the first surface thereof is placed on the mat with the chips confronting the flexible mat. The convex body of the pressing plate is pressed against the second surface of the wafer to separate the chips on the wafer individually.