Abstract: A grip portion is formed by a pair of half-split grip portions and grips an end portion of a tubular cable cover exteriorly mounted on a cable when the half-split grip portions are joined. A clamp portion is formed by a pair of half-split clamp portions and clamps the cable exposed from the end portion when the half-split clamp portions are joined. A clamp protrusion is formed on an inner surface of the clamp portion and clamps the cable exposed from the end portion by pressing the cable in a radial direction.

Abstract: An optical semiconductor module having a large endothermic amount of an electronic cooling element can be provided, even if the area of the bottom plate of a package is the same. A package 11 includes two or more units of electronic cooling element 16 mounted therein. Each unit of the electronic cooling element is inserted through the space between inner juts 14a of ceramic feedthrough of the package 11 and a bottom plate 13, and is fixed to the bottom plate. The plural units of electronic cooling element are connected in series by one or more copper piece. The total area of junction between the two or more units of electronic cooling element and the bottom plate area of the package 11 occupies 75% or more of the area of the bottom plate. Thus, the ratio of the area of junction between the bottom plate and the electronic cooling element as a whole to the area of the bottom plate of the package can be increased.

Abstract: A grip portion is formed by a pair of half-split grip portions and grips an end portion of a tubular cable cover exteriorly mounted on a cable when the half-split grip portions are joined. A clamp portion is formed by a pair of half-split clamp portions and clamps the cable exposed from the end portion when the half-split clamp portions are joined. A clamp protrusion is formed on an inner surface of the clamp portion and clamps the cable exposed from the end portion by pressing the cable in a radial direction.

Abstract: A circuit board comprising a first metal layer formed in patterns on a ceramic substrate, a second metal layer formed in patterns on the first metal layer, and a third metal layer formed covering the top surface of the second metal layer and the majority of the side surface, wherein the first and partial second metal layers not covered by the third metal layer are reduced in width by etching. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon.

Abstract: An optical semiconductor module having a large endothermic amount of an electronic cooling element can be provided, even if the area of the bottom plate of a package is the same. A package 11 includes two or more units of electronic cooling element 16 mounted therein. Each unit of the electronic cooling element is inserted through the space between inner juts 14a of ceramic feedthrough of the package 11 and a bottom plate 13, and is fixed to the bottom plate. The plural units of electronic cooling element are connected in series by one or more copper piece. The total area of junction between the two or more units of electronic cooling element and the bottom plate area of the package 11 occupies 75% or more of the area of the bottom plate. Thus, the ratio of the area of junction between the bottom plate and the electronic cooling element as a whole to the area of the bottom plate of the package can be increased.

Abstract: A hermetically sealing package for an optical semiconductor equipped with a light transmitting window whose light transmitting surface is inclined at least six degrees from the vertical line of the package bottom plate and which is joined to a cylindrical component on the package side wall by the use of a solder brazing material, in which the window material is made of a light-transmitting ceramic (such as alumina or spinel) plate in a substantially regular hexagonal or disk form in which a metallized portion is formed around the periphery, leaving a circular light transmitting portion in the center of the plate; and an optical semiconductor module that makes use of the package. The hermetically sealing package and the optical semiconductor module are easy and inexpensive to manufacture, have high reliability, and do not deform the plane of polarization.

Abstract: The heater module (30) for heating an optical waveguide device (2) is provided with a ceramics heater (40) having a heating circuit (42) adapted to generate heat when energized and an AlN ceramics layer (44) stacked on the heating circuit.

Abstract: An optical semiconductor hermetic sealing package for accommodating an optical semiconductor element therein, comprising: a frame made of a metal, an insulator, or a composite of metal and insulator; a first bottom plate made of a metal fixed to the frame; a second bottom plate whose Young's modulus is larger than that of the first bottom plate and which is fixed to the surface of the first bottom plate on the opposite side to the frame; and a metal block plate that is fixed to the surface of flanges projecting on both sides of the first bottom plate, on the side of the second bottom plate. The optical semiconductor hermetic sealing package is capable of alleviating warping of the bottom plate and has an even more excellent heat radiating characteristic.

Abstract: A sealed airtight container wherein the width of the exposed electrode part provided in a ceramic terminal part is enlarged, and the exposed electrode part is connected to a wiring part and the width of the wiring part is equal to the enlarged width of the electrode part. A sealed airtight container for an optical-semiconductor with a small heat generation in the metallized wiring layer, small power consumption and large current carrying capacity, and an optical-semiconductor module with a stable optical output can be obtained.

Abstract: A hermetically sealing enclosure for housing photo-semiconductor devices that reduces the heat generated in the wiring strips at the ceramic terminal member, increases the allowable current of the wiring strips in comparison with the conventional enclosures while maintaining the low power consumption, and stabilizes the output of the device in the enclosure. A photo-semiconductor module incorporating the enclosure is also offered. The ceramic terminal member is provided with a first wiring layer that comprises a plurality of wiring strips and that penetrates through the ceramic terminal member; two second wiring layers each of which comprises at least one wiring strip, one of which is connected to the first wiring layer at the outside of the enclosure, and the other of which is connected to the first wiring layer at the inside; and at least one third wiring layer that comprises at least one wiring strip and that connects the two second wiring layers.

Abstract: An optical module has a housing, and a junction having a light transmissive window structure, which is fixed to the housing, and which utilizes a sapphire plate. The following expressions (1) through (4) are established between an angle &phgr; formed by the C axis of the sapphire, and the plane of polarization of light, and an angle &thgr; formed by the C axis of the sapphire and the optical axis. &ohgr; is the principal refractive index of sapphire, &egr; is the secondary refractive index, &lgr; is the wavelength of transmitted light, and d is the thickness of the window plate.

Abstract: A circuit board comprising a patterned first metal layer 14 formed on a ceramic substrate 11, a patterned second metal layer 16 formed on the first metal layer, and a third metal layer 17 formed covering the entire upper surface and side surfaces of the second metal layer and a part of the upper surface of the first metal layer, wherein portions of the first metal layer not covered by the third metal layer are reduced in width by etching. The circuit board has thick-film fine wiring patterns with high bonding strength between the wiring patterns and the substrate and high reliability and enables realization of high-output modules which are small in size and high in performance, by mounting at least one high-output semiconductor element thereon.

Abstract: A thermoelectric device that realizes miniaturization and densification, an optical module incorporating the thermoelectric device, and their production method. N-type thermoelectric elements 51 and p-type thermoelectric elements 52 are arranged orthogonally and alternately, on the XY-plane, in a matrix consisting of at least four elements in total in a row and at least four elements in total in a column. All the thermoelectric elements 51 and 52 have a size of at most 250 &mgr;m in the X and Y directions. At most four thermoelectric elements nearest to an n-type thermoelectric element 51 are of p type, and at most four thermoelectric elements nearest to a p-type thermoelectric element 52 are of n type. The thermoelectric elements 51 and 52 are bonded through metallic bonding materials to electrodes 53 having the shape of a rectangle or a rounded rectangle formed on an insulating substrate 54.

Abstract: A method of manufacturing an optical semiconductor module, comprising joining an electronic cooling element to a bottom plate of an optical semiconductor package and mounting an optical semiconductor element on the electronic cooling element, wherein the electronic cooling element is soldered to the bottom plate of the optical semiconductor package in a hydrogen atmosphere. The soldering in a hydrogen atmosphere prevents oxidation of a low temperature solder provided on the uppermost surfaces of the electronic cooling element and conduction of the heat at the soldered joint portion between the electronic cooling element and the optical semiconductor element is improved.

Abstract: A circuit board comprising a first metal layer 14 formed in patterns on a ceramic substrate 11, and a second metal layer 16 formed in patterns at least 0.5 ∥m thick on the first metal layer, wherein the first metal layer is reduced in width by etching. Also, a third metal layer 13 may be formed in patterns on the same plane as the first metal layer. The outermost surface of the second metal layer 16 is a metal such as gold that will not be etched. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon.

Abstract: A circuit board comprising a first metal layer formed in patterns on a ceramic substrate, a second metal layer formed in patterns on the first metal layer, and a third metal layer formed covering the top surface of the second metal layer and the majority of the side surface, wherein the first and partial second metal layers not covered by the third metal layer are reduced in width by etching. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon.

Abstract: A hermetically sealing enclosure for housing photo-semiconductor devices that reduces the heat generated in the wiring strips at the ceramic terminal member, increases the allowable current of the wiring strips in comparison with the conventional enclosures while maintaining the low power consumption, and stabilizes the output of the device in the enclosure. A photo-semiconductor module incorporating the enclosure is also offered. The ceramic terminal member is provided with a first wiring layer that comprises a plurality of wiring strips and that penetrates through the ceramic terminal member; two second wiring layers each of which comprises at least one wiring strip, one of which is connected to the first wiring layer at the outside of the enclosure, and the other of which is connected to the first wiring layer at the inside; and at least one third wiring layer that comprises at least one wiring strip and that connects the two second wiring layers.

Abstract: A hermetically sealing package for an optical semiconductor equipped with a light transmitting window whose light transmitting surface is inclined at least six degrees from the vertical line of the package bottom plate and which is joined to a cylindrical component on the package side wall by the use of a solder brazing material, in which the window material is made of a light-transmitting ceramic (such as alumina or spinel) plate in a substantially regular hexagonal or disk form in which a metallized portion is formed around the periphery, leaving a circular light transmitting portion in the center of the plate; and an optical semiconductor module that makes use of the package. The hermetically sealing package and the optical semiconductor module are easy and inexpensive to manufacture, have high reliability, and do not deform the plane of polarization.

Abstract: An object of the present invention is to produce and provide a microbench for achieving a highspeed, low-cost semiconductor module having a high S/N ratio. A microbench for use in mounting an optical fiber, is characterized in that a substrate comprises a ceramics having a specific resistance 109 &OHgr;cm or larger and a dielectric constant of 15 or less, a groove for mounting an optical fiber is disposed on the surface thereof, a semiconductor device mounting portion onto which an optical semiconductor is mounted is provided at the end portion of this groove, and an alignment mark for semiconductor mounting is disposed in this semiconductor device mounting portion. The above-mentioned ceramics is either AlN, or a ceramics having AlN as its principal component.

Abstract: A surface temperature sensor head including a first layer made of a material of a heat conductivity higher than 100 W/mK, a second layer having a crossing tips of a thermocouple and a brazing material and a third layer made of a material of a heat conductivity higher than 100 W/mK, the brazing material unifying the crossing tips, the first layer and the third layer. The sensor head enables a temperature prober to measure temperatures of an object non-destructively with high spatial resolution.