Patents by Inventor Nobuyoshi Tsukaguchi
Nobuyoshi Tsukaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7159757Abstract: After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus lines of the alloy to bond the metal member directly to the ceramic substrate.Type: GrantFiled: September 23, 2003Date of Patent: January 9, 2007Assignee: Dowa Mining Co., Ltd.Inventors: Takayuki Takahashi, Nobuyoshi Tsukaguchi
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Patent number: 7128844Abstract: A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mixing ferric chloride with water without adding any acids is used for etching and removing an undesired portion of the metal layer 12 to form a metal circuit 12 on the at least one side of the ceramic substrate 10.Type: GrantFiled: May 27, 2004Date of Patent: October 31, 2006Assignee: Dowa Mining Co., Ltd.Inventors: Nobuyoshi Tsukaguchi, Michihiro Kosaka
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Patent number: 6936337Abstract: There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness which is more than 0.25 mm and which is less than 0.3 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 ?m.Type: GrantFiled: November 14, 2003Date of Patent: August 30, 2005Assignee: Dowa Mining Co., Ltd.Inventors: Nobuyoshi Tsukaguchi, Masami Kimura
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Publication number: 20050175773Abstract: In a method for producing a metal/ceramic bonding member wherein an electroless nickel alloy plating layer 18 is formed on a predetermined portion of the surface of an aluminum plate 12 which is bonded to at least one side of a ceramic substrate 10 and which is formed so as to have a predetermined circuit pattern, an alkali peeling type resist 16 having a predetermined shape is applied on the surface of the aluminum plate 12 before forming the electroless nickel alloy plating layer 18, and then, a portion of the surface of the aluminum plate 12, on which the resist 16 is not applied, is activated with an acidic zinc immersion solution containing a fluoride or silicofluoride. Then, after the electroless nickel alloy plating layer 18 is formed, the resist 16 is removed with an alkali.Type: ApplicationFiled: January 28, 2005Publication date: August 11, 2005Inventors: Nobuyoshi Tsukaguchi, Ken Iyoda
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Patent number: 6918529Abstract: After copper plates 14 are bonded to both sides of a ceramic substrate 10 via a brazing filler metal 12, UV curing alkali peeling type resists 16 are applied on predetermined portions of the surfaces of the copper plates 14 to etch undesired portions of the copper plates 14 to form a metal circuit portion. While the resists 16 are maintained, undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed (or undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed, and the side portion of the metal circuit portion is etched). Thereafter, the resists 16 are peeled off, and an Ni—P electroless plating 18 is carried out.Type: GrantFiled: September 25, 2002Date of Patent: July 19, 2005Assignee: Dowa Mining Co., Ltd.Inventors: Nobuyoshi Tsukaguchi, Masami Kimura
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Patent number: 6858151Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.Type: GrantFiled: September 25, 2002Date of Patent: February 22, 2005Assignee: Dowa Mining Co., Ltd.Inventors: Nobuyoshi Tsukaguchi, Takayuki Takahashi, Yukihiro Kitamura, Masami Kimura
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Publication number: 20040238483Abstract: A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mixing ferric chloride with water without adding any acids is used for etching and removing an undesired portion of the metal layer 12 to form a metal circuit 12 on the at least one side of the ceramic substrate 10.Type: ApplicationFiled: May 27, 2004Publication date: December 2, 2004Inventors: Nobuyoshi Tsukaguchi, Michihiro Kosaka
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Patent number: 6780520Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.Type: GrantFiled: January 27, 2003Date of Patent: August 24, 2004Assignee: Dowa Mining Co., Ltd.Inventors: Nobuyoshi Tsukaguchi, Takayuki Takahashi, Yukihiro Kitamura, Masami Kimura
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Publication number: 20040149689Abstract: There is provided a method for producing a metal/ceramic bonding substrate, the method being capable of improving the linearity of a pattern and preventing the occurrence of defective plating to improve the visual failure of plating and ensure the adhesion of plating.Type: ApplicationFiled: December 3, 2002Publication date: August 5, 2004Inventors: Xiao-Shan Ning, Nobuyoshi Tsukaguchi, Masami Kimura, Kazuhiko Namioka, Yukihiro Kitamura
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Publication number: 20040131832Abstract: There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness which is more than 0.25 mm and which is less than 0.3 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 &mgr;m.Type: ApplicationFiled: November 14, 2003Publication date: July 8, 2004Inventors: Nobuyoshi Tsukaguchi, Masami Kimura
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Publication number: 20040060968Abstract: After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus lines of the alloy to bond the metal member directly to the ceramic substrate.Type: ApplicationFiled: September 23, 2003Publication date: April 1, 2004Inventors: Takayuki Takahashi, Nobuyoshi Tsukaguchi
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Patent number: 6686030Abstract: There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness of 0.1 mm to 0.5 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 &mgr;m.Type: GrantFiled: September 25, 2002Date of Patent: February 3, 2004Assignee: Dowa Mining Co., Ltd.Inventors: Nobuyoshi Tsukaguchi, Masami Kimura
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Publication number: 20030232205Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.Type: ApplicationFiled: January 27, 2003Publication date: December 18, 2003Inventors: Nobuyoshi Tsukaguchi, Takayuki Takahashi, Yukihiro Kitamura, Masami Kimura
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Publication number: 20030232204Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.Type: ApplicationFiled: September 25, 2002Publication date: December 18, 2003Inventors: Nobuyoshi Tsukaguchi, Takayuki Takahashi, Yukihiro Kitamura, Masami Kimura
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Patent number: 6613450Abstract: There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 &mgr;m and which is 250 &mgr;m or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25% or more of the thickness of the metal plate.Type: GrantFiled: March 27, 2002Date of Patent: September 2, 2003Assignee: Dowa Mining Co., Ltd.Inventors: Nobuyoshi Tsukaguchi, Jyunji Nakamura, Masahiko Wada, Makoto Namioka, Masami Kimura
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Publication number: 20030068532Abstract: There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 &mgr;m and which is 250 &mgr;m or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25% or more of the thickness of the metal plate.Type: ApplicationFiled: March 27, 2002Publication date: April 10, 2003Inventors: Nobuyoshi Tsukaguchi, Jyunji Nakamura, Masahiko Wada, Makoto Namioka, Masami Kimura
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Publication number: 20030068537Abstract: There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness of 0.1 mm to 0.5 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 &mgr;m.Type: ApplicationFiled: September 25, 2002Publication date: April 10, 2003Inventors: Nobuyoshi Tsukaguchi, Masami Kimura
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Publication number: 20030066865Abstract: After copper plates 14 are bonded to both sides of a ceramic substrate 10 via a brazing filler metal 12, UV curing alkali peeling type resists 16 are applied on predetermined portions of the surfaces of the copper plates 14 to etch undesired portions of the copper plates 14 to form a metal circuit portion. While the resists 16 are maintained, undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed (or undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed, and the side portion of the metal circuit portion is etched). Thereafter, the resists 16 are peeled off, and an Ni—P electroless plating 18 is carried out.Type: ApplicationFiled: September 25, 2002Publication date: April 10, 2003Inventors: Nobuyoshi Tsukaguchi, Masami Kimura