Patents by Inventor Nobuyoshi Tukaguchi

Nobuyoshi Tukaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040069528
    Abstract: A paste of brazing material of Ag—Cu—Ti—TiO2 system is printed to both sides of an AlN substrate; a copper sheet is then placed on both sides and heated in vacuum to be joined to the substrate. A resist having a desired-circuit pattern is coated on the surface of each copper sheet and etching is performed. A solution containing a mixture of EDTA, ammonia and aqueous hydrogen peroxide is then applied to dissolve away the unwanted brazing material and the like from between the circuit patterns without corroding the ceramic substrate and the metal sheet.
    Type: Application
    Filed: October 9, 2002
    Publication date: April 15, 2004
    Applicant: DOWA MINING CO., LTD.
    Inventors: Masami Sakuraba, Masami Kimura, Takashi Ono, Noriyuki Ishii, Nobuyoshi Tukaguchi