Patents by Inventor Nobuyoshi Yamaoka
Nobuyoshi Yamaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100299099Abstract: An abnormality detection apparatus for detecting abnormality of air conditioning in a room which accommodates a plurality of computers having an air inlet and having an outlet, includes, a plurality of temperature detectors for detecting temperatures at each of the air inlets, a memory for storing a plurality of reference patterns, each of the reference patterns representing a set of temperatures at each of the air inlets and corresponding to one of a plurality of abnormal categories, a determining unit for determining one of the abnormal categories by comparing the detected temperatures by the temperature detectors with the reference patterns stored in the memory, an output unit for outputting information corresponding to the category of the air condition abnormality determined.Type: ApplicationFiled: May 19, 2010Publication date: November 25, 2010Applicant: FUJITSU LIMITEDInventors: Nobuyoshi YAMAOKA, Junichi ISHIMINE, Ikuro NAGAMATSU, Masahiro SUZUKI, Tadashi KATSUI, Yuji OHBA, Seiichi SAITO, Akira UEDA, Yasushi URAKI
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Publication number: 20100298990Abstract: An apparatus for controlling an open amount of a plurality of air transfer grilles which are installed in a room, includes a determining unit for determining first target amounts of blowing to each of the racks, for determining second target amounts of blowing from each of the air transfer grilles on the basis of the first target amounts so that each of air of the first target amounts are blown to each of the racks, and for determining open amounts for each of the air transfer grilles on the basis of the plurality of second target amounts so that each of the amounts of blowing from each of the grilles becomes each of the second target amounts, and a controller for controlling each of the open amounts of the air transfer grilles on the basis of the each of the determined open amounts.Type: ApplicationFiled: May 19, 2010Publication date: November 25, 2010Applicant: FUJITSU LIMITEDInventors: Ikuro NAGAMATSU, Junichi ISHIMINE, Seiichi SAITO, Masahiro SUZUKI, Tadashi KATSUI, Yuji OHBA, Nobuyoshi YAMAOKA, Akira UEDA, Yasushi URAKI
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Publication number: 20090219123Abstract: According to an aspect of an embodiment, a magnet unit for a magnetron sputtering system includes a base board, an inner magnet fixed to the base board and an outer magnet fixed to the base board. The outer magnet is fixed surround the inner magnet. At least one of a portion of the inner magnet or a portion of the outer magnet is displaceable on the base board.Type: ApplicationFiled: February 6, 2009Publication date: September 3, 2009Applicant: FUJITSU LIMITEDInventors: Akihiko Fujisaki, Atsushi Furuya, Nobuyoshi Yamaoka
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Publication number: 20090218218Abstract: A magnet unit for a magnetron sputtering system includes a base plate and a plurality of magnet parts each including a first magnet and a first supporting member. The first supporting member supports the first magnet and fixes the first magnet to the base plate. The magnet parts confine a plasma.Type: ApplicationFiled: February 25, 2009Publication date: September 3, 2009Applicant: FUJITSU LIMITEDInventors: Tomoko Kutsuzawa, Akihiko Fujisaki, Tetsuyuki Kubota, Atsushi Furuya, Nobuyoshi Yamaoka
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Publication number: 20090210741Abstract: An information processing apparatus includes a predicting unit to predict temperature of the apparatus when allowing one or more processing units mounted in the apparatus to execute a new program, a temperature determining unit to compare the predicted temperature with a predetermined reference value, a priority determining unit to compare priorities of the new program and an active program in execution if the temperature is equal to or greater than the predetermined reference value, and an operation clock setting unit to set an operation clock to the one or more processing units, the operation clock enabling the predicted temperature to less than the predetermined reference value even if one of the processing units is allowed to execute the new program, and to allow the one or more processing units to execute the new program if the priority of the new program is higher than the priority of the active program.Type: ApplicationFiled: February 12, 2009Publication date: August 20, 2009Applicant: FUJITSU LIMITEDInventor: Nobuyoshi YAMAOKA
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Publication number: 20080144212Abstract: A recording medium mounted on the rotary body in a recording medium drive. First and second fixing members sandwiches the recording medium around the rotary body. An elastic member is interposed at least between the first fixing member and the recording medium. The elastic member serves to enhance the friction between the first fixing member and the recording medium in the fixing mechanism. Even if an impact is applied to the recording medium, the recording medium is thus reliably prevented from shifting within a plane perpendicular to the central axis of the rotary body, namely from a lateral shift.Type: ApplicationFiled: February 22, 2008Publication date: June 19, 2008Applicant: FUJITSU LIMITEDInventors: Nobuyoshi Yamaoka, Misao Inoke
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Publication number: 20080098763Abstract: An air conditioning installation cools computer apparatuses by air-conditioning a room where the computer apparatuses are installed. The air conditioning installation includes:(a) an inlet duct for making air flow into the room; (b) an air-conditioner which sends air into the inlet duct, and (c) inlet fans for the respective computer apparatuses to be cooled. The inlet fans are disposed at positions corresponding to inlets of the computer apparatuses installed in the room, and send air flown through the inlet duct into the room such that the air flows toward the inlets of the computer apparatuses.Type: ApplicationFiled: October 10, 2007Publication date: May 1, 2008Applicant: FUJITSU LIMITEDInventor: Nobuyoshi Yamaoka
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Patent number: 7016158Abstract: A head slider is related to an actuator block. A flexible printed circuit board is received on the surface of the actuator block. A head IC is mounted on the surface of the flexible printed circuit board. A heat conductive member is mounted on the head IC. The heat resistance of the heat conductive member is set smaller than that of the flexible printed circuit board. A larger amount of heat can be transmitted from the head IC to the actuator block. The actuator block is made of a metal material such as aluminum. The heat resistance of the actuator block is apparently smaller than that of the flexible printed circuit board. A larger amount of heat can be radiated from the actuator block as compared with the flexible printed circuit board. The head IC is thus reliably prevented from a rise in the temperature.Type: GrantFiled: January 24, 2003Date of Patent: March 21, 2006Assignee: Fujitsu LimitedInventors: Nobuyoshi Yamaoka, Akira Ueda, Toshiyuki Nakada, Masao Kondo, Keishi Shimizu
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Publication number: 20050122618Abstract: A recording medium mounted on the rotary body in a recording medium drive. First and second fixing members sandwiches the recording medium around the rotary body. An elastic member is interposed at least between the first fixing member and the recording medium. The elastic member serves to enhance the friction between the first fixing member and the recording medium in the fixing mechanism. Even if an impact is applied to the recording medium, the recording medium is thus reliably prevented from shifting within a plane perpendicular to the central axis of the rotary body, namely from a lateral shift.Type: ApplicationFiled: January 18, 2005Publication date: June 9, 2005Applicant: FUJITSU LIMITEDInventors: Nobuyoshi Yamaoka, Misao Inoke
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Patent number: 6882506Abstract: A suspension is made of a suspension body of a stainless plate, a resin protective layer on one surface of the suspension body, a circuit pattern including read wiring and write wiring on the protective layer, and a metal layer provided on the other surface of the suspension body. In this arrangement, heat deformation of the suspension is alleviated when a write current is applied.Type: GrantFiled: July 17, 2002Date of Patent: April 19, 2005Assignee: Fujitsu LimitedInventors: Nobuyoshi Yamaoka, Kenichiro Aoki
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Publication number: 20040021988Abstract: A head slider is related to an actuator block. A flexible printed circuit board is received on the surface of the actuator block. A head IC is mounted on the surface of the flexible printed circuit board. A heat conductive member is mounted on the head IC. The heat resistance of the heat conductive member is set smaller than that of the flexible printed circuit board. A larger amount of heat can be transmitted from the head IC to the actuator block. The actuator block is made of a metal material such as aluminum. The heat resistance of the actuator block is apparently smaller than that of the flexible printed circuit board. A larger amount of heat can be radiated from the actuator block as compared with the flexible printed circuit board. The head IC is thus reliably prevented from a rise in the temperature.Type: ApplicationFiled: January 24, 2003Publication date: February 5, 2004Applicant: FUJITSU LIMITEDInventors: Nobuyoshi Yamaoka, Akira Ueda, Toshiyuki Nakada, Masao Kondo, Keishi Shimizu
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Patent number: 6619531Abstract: A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor element on the substrate. For the carrying direction in the reflow furnace using a carrying belt, temperature analysis for time duration is performed for the solder bumps at both the front and rear, and then the condition of the reflow furnace is determined so as to close at both the times for reaching the solder melting temperature and the times for maintaining the solder melting temperature.Type: GrantFiled: February 18, 2000Date of Patent: September 16, 2003Assignee: Fujitsu LimitedInventor: Nobuyoshi Yamaoka
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Patent number: 6619953Abstract: The present invention relates to a reflow furnace for heating a carried circuit module to perform reflow soldering. The reflow furnace has a nozzle 60 for performing an operation of spraying the inert gas on a soldering portion for the circuit module carried into the furnace while the nozzle is moved, maintaining high mounting reliability and high productivity, even if apertures of the carrying inlet and the carrying outlet are large.Type: GrantFiled: January 17, 2002Date of Patent: September 16, 2003Assignee: Fujitsu LimitedInventors: Nobuyoshi Yamaoka, Kouichi Shimizu
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Publication number: 20030147178Abstract: A suspension is made of a suspension body of a stainless plate, a resin protective layer on one surface of the suspension body, a circuit pattern including read wiring and write wiring on the protective layer, and a metal layer provided on the other surface of the suspension body. In this arrangement, heat deformation of the suspension is alleviated when a write current is applied.Type: ApplicationFiled: July 17, 2002Publication date: August 7, 2003Applicant: FUJITSU LIMITEDInventors: Nobuyoshi Yamaoka, Kenichiro Aoki
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Publication number: 20020061490Abstract: The present invention relates to a reflow furnace for heating a carried circuit module to perform reflow soldering. The reflow furnace has a nozzle 60 for performing an operation of spraying the inert gas on a soldering portion for the circuit module carried into the furnace while the nozzle is moved, maintaining high mounting reliability and high productivity, even if apertures of the carrying inlet and the carrying outlet are large.Type: ApplicationFiled: January 17, 2002Publication date: May 23, 2002Applicant: FUJITSU LIMITEDInventors: Nobuyoshi Yamaoka, Kouichi Shimizu
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Patent number: 6206265Abstract: A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor element on the substrate. For the carrying direction in the reflow furnace using a carrying belt, temperature analysis for time duration is performed for the solder bumps at both the front and rear, and then the condition of the reflow furnace is determined so as to close at both the times for reaching the solder melting temperature and the times for maintaining the solder melting temperature.Type: GrantFiled: March 18, 1998Date of Patent: March 27, 2001Assignee: Fujitsu LimitedInventor: Nobuyoshi Yamaoka