Patents by Inventor Nobuyuk Ikeguchi

Nobuyuk Ikeguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the production of high-density printed wiring board
    Patent number: 7140103
    Abstract: Process for producing a high-density printed wiring board, comprising: providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 ?m or less, plating the surface by electroless copper plating to form a layer of 0.1 to 1 ?m thickness, forming an electrolytic copper plating layer of 0.5 to 3 ?m thickness using the electroless copper plating layer as electrode, forming a plating resist layer on a portion of the copper plating layer, forming a pattern copper plating layer of 6 to 30 ?m thickness on the copper surface in where the plating resist layer is not formed, by electrolytic plating, removing the plating resist layer, and etching the entire surface to remove the thin electrolytic copper layer, the electroless copper layer and ultrathin copper foil layer at least where the pattern copper plating layer is not formed.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: November 28, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Morio Gaku, Nobuyuk Ikeguchi, Katsuji Komatsu, Yasuo Tanaka, Keiichi Iwata, Ken-ichi Shimizu