Abstract: The electronic device housing employs unique temperature management functions. Thermally sensitive electronic components are thermally isolated from the environment and from temperature generating components provided within the housing through the use of an insulative case material. Furthermore, heat generating components are connected to the outside environment with a conductive thermal path which is isolated from the remaining components provided within the case, thereby efficiently transferring undesired heat to the environment without allowing the heat to substantially affect remaining components in the housing. The electronic device housing includes a case and a cover formed by molding using a synthetic resin, and a metallic layer formed on the surface of the case which cooperates with the cover to provide an electromagnetic shield for the case.

Abstract: A device mounting appliance comprising a device and a mounting appliance, the device mounting appliance including at least three combined leg-lugs formed on a mounting surface of the device; recesses formed in the combined leg-lugs, respectively; a fixing lug formed on the mounting surface of the device so as to be positioned within a polygon formed by connecting the combined leg-lugs; a movable lever attached to the mounting appliance, the lever having a hook portion and a wobbling preventing projection and being urged in one direction by a spring; and a guide provided on the mounting appliance and engaged with lugs of the appliance which are fitted into the recesses of the combined leg-lugs when the device on the mounting appliance is slid a predetermined distance, and also engaged with the combined leg-lugs upon such sliding of the device, wherein when the device on the mounting appliance is slid, the lever is once moved by the fixing lug of the device against the spring and then, at the end of the sliding