Patents by Inventor Nobuyuki KANZAWA

Nobuyuki KANZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mounting jig for semiconductor device
    Patent number: 10405434
    Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: September 3, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Rikihiro Maruyama, Kenshi Kai, Nobuyuki Kanzawa, Mitsutoshi Sawano
  • Mounting jig for semiconductor device
    Patent number: 9877397
    Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig positioning an insulated circuit board by housing the insulated circuit board at a predetermined position, a tubular contact element positioning jig having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: January 23, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Rikihiro Maruyama, Kenshi Kai, Nobuyuki Kanzawa, Mitsutoshi Sawano
  • MOUNTING JIG FOR SEMICONDUCTOR DEVICE
    Publication number: 20170339794
    Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.
    Type: Application
    Filed: August 8, 2017
    Publication date: November 23, 2017
    Inventors: Rikihiro MARUYAMA, Kenshi KAI, Nobuyuki KANZAWA, Mitsutoshi SAWANO
  • MOUNTING JIG FOR SEMICONDUCTOR DEVICE
    Publication number: 20160050764
    Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig positioning an insulated circuit board by housing the insulated circuit board at a predetermined position, a tubular contact element positioning jig having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig.
    Type: Application
    Filed: October 27, 2015
    Publication date: February 18, 2016
    Inventors: Rikihiro MARUYAMA, Kenshi KAI, Nobuyuki KANZAWA, Mitsutoshi SAWANO
  • Manufacturing method of semiconductor device and mounting jig
    Patent number: 9204559
    Abstract: A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: December 1, 2015
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Rikihiro Maruyama, Kenshi Kai, Nobuyuki Kanzawa, Mitsutoshi Sawano
  • MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND MOUNTING JIG
    Publication number: 20140317896
    Abstract: A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.
    Type: Application
    Filed: March 11, 2014
    Publication date: October 30, 2014
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Rikihiro MARUYAMA, Kenshi KAI, Nobuyuki KANZAWA, Mitsutoshi SAWANO