Abstract: A film having a dielectric dissipation factor at a frequency of 1 kHz and 160° C. of 0.02% or lower and a dielectric breakdown strength at 160° C. of 400 V/?m or higher. Also disclosed is a film including at least one fluoropolymer selected from a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer and a tetrafluoroethylene/hexafluoropropylene copolymer, the fluoropolymer having a crystallinity of 65% or higher.

Abstract: A fluororesin film including a fluorine-containing composition, wherein the oxygen element percentage as measured when heat treatment is performed at 180° C. for 3 minutes and then the state of one or both surfaces of the film is observed by scanning X-ray photoelectron spectroscopy (XPS/ESCA) is 1.35 atom % or more, and an absolute value of the rate of dimensional change in MD and TD before and after heat treatment as measured when the film is heat-treated at 180° C. for 10 minutes and then cooled to room temperature is 2% or less. Also disclosed is a copper-clad laminate, including copper foil and the fluororesin film; a substrate for circuit, including the copper-clad laminate; and a method for producing the copper-clad laminate.

Abstract: The invention provides a film having a high relative permittivity, a high volume resistivity, and a high breakdown strength. The film has a relative permittivity of 9 or higher at a frequency of 1 kHz and 30° C., a volume resistivity of 5E+15 ?·cm or higher at 30° C., and a breakdown strength of 500 V/?m or higher.

Abstract: A fluororesin film contains a fluororesin. The fluororesin contains two fluororesin species having different composition ratios of polymerized units. The fluororesin film has on at least one surface thereof a ten-point average roughness of 0.100 to 1.200 ?m and an arithmetic average roughness of 0.010 to 0.050 ?m, and the fluororesin film has a breakdown strength of 400 V/?m or higher.

Abstract: A fluororesin film containing a fluororesin. The fluororesin film has on at least one surface thereof a ten-point average roughness of 0.100 to 1.200 ?m and an arithmetic average roughness of 0.010 to 0.050 ?m. Further, the fluororesin film has a breakdown strength of 400 V/?m or higher.

Abstract: A radio wave absorbing material including a fluoropolymer. The fluoropolymer contains a vinylidene fluoride unit, and the radio wave absorbing material absorbs a radio wave having a frequency in a range of 1 MHz to 100 MHz.

Abstract: A film having a dielectric dissipation factor at a frequency of 1 kHz and 160° C. of 0.02% or lower and a dielectric breakdown strength at 160° C. of 400 V/?m or higher. Also disclosed is a film including at least one fluoropolymer selected from a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer and a tetrafluoroethylene/hexafluoropropylene copolymer, the fluoropolymer having a crystallinity of 65% or higher.

Abstract: The present invention provides a film having excellent heat resistance and a small difference between the permittivity at low temperatures and the permittivity at high temperatures. The present invention provides a film having a relative permittivity of 8 or more at a frequency of 1 kHz at 30° C., wherein the rate of change is ?8 to +8% as calculated from a relative permittivity A at a frequency of 1 kHz at 30° C. and a relative permittivity B at a frequency of 1 kHz at 150° C. according to the following formula: Rate of change(%)=(B?A)/A×100.

Abstract: The invention provides a film having a high relative permittivity, a high volume resistivity, and a high breakdown strength. The film has a relative permittivity of 9 or higher at a frequency of 1 kHz and 30° C., a volume resistivity of 5E+15 ?·cm or higher at 30° C., and a breakdown strength of 500 V/?m or higher.

Abstract: A fluororesin film containing a fluororesin. The fluororesin film has on at least one surface thereof a ten-point average roughness of 0.100 to 1.200 ?m and an arithmetic average roughness of 0.010 to 0.050 ?m. Further, the fluororesin film has a breakdown strength of 400 V/?m or higher.

Abstract: The present invention provides a film having excellent heat resistance and a small difference between the permittivity at low temperatures and the permittivity at high temperatures. The present invention provides a film having a relative permittivity of 8 or more at a frequency of 1 kHz at 30° C., wherein the rate of change is ?8 to +8% as calculated from a relative permittivity A at a frequency of 1 kHz at 30° C. and a relative permittivity B at a frequency of 1 kHz at 150° C. according to the following formula: Rate of change (%)=(B?A)/A×100.

Abstract: The present invention aims to provide a film having a high dielectric constant and a low dissipation factor. The high dielectric film of the present invention includes a vinylidene fluoride/tetrafluoroethylene copolymer (A) with a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 95/5 to 80/20. The film includes an ?-crystal structure and a ?-crystal structure. The ratio of the ?-crystal structure is 50% or more.

Abstract: A method of producing fiber-reinforced plastic uses a molding die which includes a resin filling port at one end; a resin suction port at the other end; a laminate body of a plurality of laminated fiber-reinforced base materials and housed in the inner space of the molding die; a resin diffusion medium extending from the resin filling port and provided on opposite surfaces of the laminate body to supply resin onto opposite surfaces of the laminate body from the resin filling port; and a resin suction medium extending from the resin suction port and provided along a side surface of the laminate body on the suction port side to contact the side surface or to have a gap from the side surface, in a state that gas or resin can be suctioned from the laminate body so that the gas or resin can be moved from the laminate body toward the resin suction port.

Abstract: The present invention aims to provide a multilayer film which can increase the capacitance. The present invention relates to a multilayer film including a first electrode layer, a resin substrate, a second electrode layer, and a dielectric layer stacked in the order set forth. The dielectric layer includes a vinylidene fluoride/tetrafluoroethylene copolymer (A). The copolymer (A) satisfies a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 97/3 to 60/40.

Abstract: Provided is a film for a film capacitor in which electrical insulation, and especially electrical properties at high temperatures are improved while a high dielectric constant of a vinylidene fluoride resin is maintained. The film for a film capacitor includes a tetrafluoroethylene resin (a1) that includes a vinylidene fluoride unit and a tetrafluoroethylene unit in the vinylidene fluoride unit/tetrafluoroethylene unit ratio (mol %) of 0/100 to 49/51 as a film-forming resin (A).

Abstract: The present invention provides a high dielectric film for a film capacitor obtained by molding a film forming composition for a film capacitor comprising a thermoplastic resin (A) and surface-treated high dielectric inorganic particles (B) obtained by treating the surfaces of high dielectric inorganic particles (b1) having a dielectric constant (20° C., 1 kHz) of 100 or more with a low dielectric compound (b2) having a dielectric constant (20° C., 1 kHz) of 10 or less. This high dielectric film for a film capacitor can restrain the decrease of electrical insulating property, in spite of the high dielectric inorganic particles being dispersed at a high filling rate.

Abstract: The present invention relates to a highly dielectric film formed by using (A) a fluorine-containing resin comprising vinylidene fluoride unit and tetrafluoroethylene unit in a total amount of not less than 95% by mole, and provides a film for a film capacitor which has high dielectric property and high withstanding voltage and can be made thin.

Abstract: There is provided a coating composition comprising (A) a thermoplastic non-fluorine-containing polymer, (B) inorganic ferroelectric particles, (C) an affinity-improving agent comprising at least one of a coupling agent, a surfactant and an epoxy group-containing compound, and (D) a solvent, and there is provided a film formed using the coating composition which has highly dielectric property and low dielectric loss, can be made thin, is excellent in winding property (flexibility) and is suitable as a highly dielectric film for a film capacitor.

Abstract: There is provided a thin highly dielectric film for a film capacitor being excellent in mechanical strength, in which highly dielectric inorganic particles can be blended to a dielectric resin at high ratio, and rubber particles (B) and preferably highly dielectric inorganic particles (C) are dispersed in a thermoplastic resin (A).

Abstract: A hydrophobic dielectric film for electrowetting, which can drive a conductive liquid by using a low voltage and containing a vinylidene fluoride based polymer.