Abstract: A packaged absorbent product including at least one absorbent article having a body surface and a garment surface. The package includes a transparent film layer and a non-white color layer disposed on the transparent film layer. The package has an opacity of 5-55%, and a speculum gloss of 0.1-90.

Abstract: A packaged absorbent product including at least one absorbent article having a body surface and a garment surface. The package includes a transparent film layer and a non-white color layer disposed on the transparent film layer. The package has an opacity of 5-55%, and a speculum gloss of 0.1-90.

Abstract: A first vibrating electrode is provided on a first side of a piezoelectric substrate perpendicular to the thickness direction. A second vibrating electrode is provided on a second side opposite to the first side to face the first vibrating electrode. A first pad and a second pad are respectively formed on a side of the piezoelectric substrate perpendicular to the thickness direction in area having a small vibration displacement. The first pad and the second pad are electrically connected to the first vibrating electrode and the second vibrating electrode.

Abstract: A piezoelectric substrate is constituted by a piezoelectric material of an effective Poisson's ratio being less than 1/3. The substrate has a pair of opposite faces and the opposite faces are provide with a pair of vibrating electrodes in correspondence. The opposite faces of the piezoelectric substrate are rectangular respectively. The sum of the lengths Lc of the one faces in the opposite faces 1a, 1b and the length Wc of the other side of the same is limited within range 2.22 mm≦≦2.24 mm or 2.34 mm≦≦2.48 mm, said one faces being vertical each other. The areas Sc of the opposite faces are 1.22 mm2≦Sc≦1.26 mm2 or 1.35 mm2≦Sc≦1.538 mm2. Accordingly, though using the piezoelectric material of the effective Poisson's ratio being less than 1/3, vibration in the thickness extensional fundamental waves can be steadily utilized.

Abstract: A first vibrating electrode is provided on a first side of a piezoelectric substrate perpendicular to the thickness direction. A second vibrating electrode is provided on a second side opposite to the first side to face the first vibrating electrode. A first pad and a second pad are respectively formed on a side of the piezoelectric substrate perpendicular to the thickness direction in area having a small vibration displacement. The first pad and the second pad are electrically connected to the first vibrating electrode and the second vibrating electrode.

Abstract: The invention provides a rapid temperature rise heater element comprising an exothermic section (1) and a lead section (2), the exothermic section (1) comprising an exothermic section conductor of ceramic material which includes at least four stacked exothermic section conductive layers (1a) with an exothermic section insulating layer (1c) of ceramic material interposed therebetween and connections (1b) each for connecting adjacent exothermic section conductive layers (1a). The lead section (2) includes first and second lead section conductive layers (2a and 2b) electrically connected to the uppermost and lowermost exothermic section conductive layers (1a), respectively, the first and second lead section conductive layers (2a and 2b) being stacked with a lead section insulating layer (2c) of ceramic material interposed therebetween. A durable rapid temperature rise heater element can be efficiently fabricated at low cost while maintaining heater performance.

Abstract: A rectangular plate shaped rapid temperature rise heater element includes a sintered insulating ceramic layer, an exothermic section, and first and second lead layers for applying voltage across the exothermic section to develop heat. Typically the sintered insulating ceramic layer, exothermic section, and lead layers are formed of ceramic compositions composed mainly of an identical insulating component in the form of a metal oxide, typically Al.sub.2 O.sub.3 and an identical conductive component in the form of a metal silicide and/or carbide, typically MoSi.sub.2, blended in different ratios for the respective layers. The heater element is easy and inexpensive to manufacture, capable of rapid heating, and durable.

Abstract: A digital AM transmitter according to the invention converts a audio signal to a digital audio signal of a plurality of bits by an A/D converter, outputs a logical code signal of "1" from each of those output terminals of a code unit, whose number corresponds to the digital value of the digital audio signal, selectively generates driving signals from those output terminals of a code shifter which are equal in number to the logical code signals of "1" from the code unit, while changing the driving-signal-generating output terminals of the code shifter from one to another (or some to others) with the lapse of time, selectively guiding, with the use of carrier wave switches, those portions of a carrier wave signal which have been divided by a carrier wave divider, to power amplifiers in accordance with driving signals generated from the code shifter, amplifies the guided portions of the carrier wave signal by power amplifiers, combined the amplified portions of the carrier wave signal by a combiner, and passes t

Abstract: In this invention, in order to generate a VSB modulation signal from a digital baseband signal, an in-phase component of a modulation signal having a frequency spectrum having a high-frequency component whose level is half that of its low-frequency component, and an orthogonal component of the modulation signal of a high-frequency component having a frequency spectrum whose level is half that of the low-frequency component are generated from the baseband signal. The in-phase component and the orthogonal component are multiplied with carrier signals to obtain a carrier in-phase component and a carrier orthogonal component. The carrier in-phase component and the carrier orthogonal component are synthesized to obtain a VSB modulation signal.

Abstract: A thermistor element for temperature measurement has a thermistor chip in wafer form and thin film electrodes formed on respective principal surfaces of the thermistor chip. The thin film electrodes are formed by evaporation. Lead wires are adhered to the thin film electrodes with heat-resisting conductive material. The assembled members are sealed with glass. The electrodes may be made of two-layer films.