Abstract: A needle-shaped body protrudes from a cantilever made of Si. Furthermore, the rear face of the cantilever is coated with aluminum (first metal) having a Fermi level higher than that of Si. The cantilever is dipped into an aqueous silver nitride solution containing the ions of Ag serving as a second metal. The electrons of Si flow out to the aqueous silver nitride solution due to the existence of the aluminum, and Ag nanostructures are precipitated at the tip end of the needle-shaped body. A probe for tip-enhanced Raman scattering in which the Ag nanostructures are fixed to the tip end of the needle-shaped body is manufactured. The sizes and shapes of the Ag nanostructures can be controlled properly by adjusting the concentration of the aqueous silver nitride solution and the time during which the cantilever is dipped into the aqueous silver nitride solution.

Abstract: A needle-shaped body protrudes from a cantilever made of Si. Furthermore, the rear face of the cantilever is coated with aluminum having a Fermi level higher than that of Si. The cantilever is dipped into an aqueous silver nitride solution containing the ions of Ag serving as a second metal. The electrons of Si flow out to the aqueous silver nitride solution due to the existence of the aluminum, and Ag nanostructures are precipitated at the tip end of the needle-shaped body. A probe for tip-enhanced Raman scattering in which the Ag nanostructures are fixed to the tip end of the needle-shaped body is manufactured. The sizes and shapes of the Ag nanostructures can be controlled properly by adjusting the concentration of the aqueous silver nitride solution and the time during which the cantilever is dipped into the aqueous silver nitride solution.

Abstract: A method of measuring a stress component in a short period of time in a nondestructive manner and a stress component measurement device that includes a stress component comparison section that compares a Raman spectrum L obtained in a predetermined area W1 of a reference specimen W to which a given stress component is applied with the stress component, a correlation data production section that produces correlation data indicating a correlation between the Raman spectrum L and the stress component by the use of a multivariate analysis method based on the comparison results conducted by the stress component comparison section. The comparison is conducted multiple times on different predetermined areas W1.

Abstract: An object of this invention is to provide stress measurement method that is stress of the measuring object nondestructively in a short period of time.

Abstract: An object of this invention is to provide a method that can measure a stress component in a short period of time in a nondestructive manner.

Abstract: An object of this invention is to provide stress measurement method that is stress of the measuring object nondestructively in a short period of time.

Abstract: The present invention provides a method and substrate examining device that sequentially and automatically measures at least the thickness and the internal stress of the thin film at a predetermined measurement point on the surface of every manufactured semiconductor substrate to perform quality control on each substrate, and reliably recognizes the cause of defects to improve productivity. The examining device and method accurately analyzes the correlation between film thickness and stress to establish the manufacturing processes necessary for manufacturing a semiconductor substrate of higher performance, and measures the distribution of a physical quantity such as internal stress, index of refraction, and composition of the semiconductor substrate in the film thickness direction, without being influenced by change in ambient environmental temperature thereby further improving examination precision.

Abstract: The present invention provides a method of and a device for measuring the stress in a semiconductor material. An excitation light is irradiated on a semiconductor material formed with a silicon germanium layer and a strained silicon layer in a multilayer structure on a single crystal silicon substrate from the direction of the strained silicon layer.

Abstract: The present invention provides a method of and a device for measuring the stress in a semiconductor material. An excitation light is irradiated on a semiconductor material formed with a silicon germanium layer and a strained silicon layer in a multilayer structure on a single crystal silicon substrate from the direction of the strained silicon layer.

Abstract: The present invention provides a method and substrate examining device that sequentially and automatically measures at least the thickness and the internal stress of the thin film at a predetermined measurement point on the surface of every manufactured semiconductor substrate to perform quality control on each substrate, and reliably recognizes the cause of defects to improve productivity. The examining device and method accurately analyzes the correlation between film thickness and stress to establish the manufacturing processes necessary for manufacturing a semiconductor substrate of higher performance, and measures the distribution of a physical quantity such as internal stress, index of refraction, and composition of the semiconductor substrate in the film thickness direction, without being influenced by change in ambient environmental temperature thereby further improving examination precision.