Abstract: A memory device includes source-level material layers including a source contact layer, an alternating stack of insulating layers and electrically conductive layers located over the source-level material layers, a memory opening vertically extending through the alternating stack and the source contact layer, and a memory opening fill structure located in the memory opening and including a vertical semiconductor channel including an intrinsic or first conductivity type semiconductor material, a memory film surrounding the vertical semiconductor channel, and a conical source pedestal in contact with the source contact layer and in contact with a bottom surface of the vertical semiconductor channel, such that at least portion of the conical source pedestal includes a second conductivity type semiconductor material.

Abstract: An optical semiconductor device includes an optical semiconductor chip in which at least one optical element is formed in a semiconductor substrate, and an extended wire pattern that is connected to a first electrode and a second electrode of the optical element and that extends outside the optical semiconductor chip. The first electrode and the second electrode of the optical semiconductor device are formed on the front surface side of the optical semiconductor chip, and the extended wire pattern is disposed on the front surface of the optical semiconductor chip or disposed at a position apart from the front surface.

Abstract: The toner contains binder resin-containing toner particles and silica fine particle S1, wherein the weight-average particle diameter of the toner is 4.0-15.0 ?m, both inclusive, peaks originating with the silica fine particle S1 are observed in 29 Si-NMR measurement of the silica fine particle S1, and, in the spectrum obtained by 29Si CP/MAS NMR or 29Si DD/MAS NMR, the peak area of a peak corresponding to the D1 unit structure in the silica fine particle S1, the peak area of a peak corresponding to the D2 unit structure in the silica fine particle S1, and the peak area of a peak corresponding to the Q unit structure in the silica fine particle S1 satisfy a prescribed relationship.

Abstract: A semiconductor laser device includes a submount having a bottom plate part and a projecting part projecting from a surface of the bottom plate part, and a semiconductor laser bonded to the submount. The semiconductor laser includes a semiconductor substrate, a semiconductor structure part that is formed on the semiconductor substrate and has an active layer, a first electrode, and a second electrode. A side face of the semiconductor laser facing the projecting part, and the second electrode thereof are respectively bonded to the projecting part facing the semiconductor laser and the bottom plate part with a bonding member. The bonding member for bonding the projecting part and the side face of the semiconductor laser is such that an end part thereof in a z-direction in which the projecting part projects is located further away in the z-direction than a surface of the semiconductor substrate of the semiconductor laser.

Abstract: A resin for an energy device electrode contains a structural unit derived from a nitrile group-containing monomer; and a structural unit derived from a monomer represented by the following Formula (I), wherein the resin does not contain a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group, or the resin has a ratio of a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group of 0.01 moles or less with respect to 1 mole of the structural unit derived from a nitrile group-containing monomer, and a ratio of the structural unit derived from a nitrile group-containing monomer to a total of structural units derived from each monomer is from 90% by mole to less than 100%.

Abstract: Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150° C. to 230° C. in an amount of 10% by mass or more in a total amount of the residual solvent.

Abstract: The disclosure provides a detecting composition or layer; a film, a device, a tape and a detecting system having the detecting layer; and methods of use thereof.

Abstract: An optical semiconductor device includes an optical semiconductor chip in which at least one optical element is formed in a semiconductor substrate, and an extended wire pattern that is connected to a first electrode and a second electrode of the optical element and that extends outside the optical semiconductor chip. The first electrode and the second electrode of the optical semiconductor device are formed on the front surface side of the optical semiconductor chip, and the extended wire pattern is disposed on the front surface of the optical semiconductor chip or disposed at a position apart from the front surface.

Abstract: Provided is an electrolyte composition, comprising one or two or more polymers, oxide particles, at least one electrolyte salt selected from the group consisting of a lithium salt, a sodium salt, a calcium salt, and a magnesium salt, and a solvent, wherein structural units constituting the one or two or more polymers comprises a first structural unit selected from the group consisting of tetrafluoroethylene and vinylidene fluoride, and a second structural unit selected from the group consisting of hexafluoropropylene, acrylic acid, maleic acid, ethyl methacrylate, and methyl methacrylate, a content of the one or two or more polymers is more than 90% by mass based on a total amount of polymers in the electrolyte composition, and a mass ratio of a content of the first structural unit to a content of the second structural unit in the one or two or more polymers is 50/50 or more.

Abstract: An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order. The layer A is a resin composition which contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m2/g or more, and the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) is within the range from 30:1 to 2:1. The layer B contains a thermosetting resin composition which is in a solid state at a temperature lower than 40° C. but melts at a temperature of 40° C. or higher but lower than 140° C.

Abstract: The present disclosure provides a binder resin composition comprising a polyolefin particle, an organic solvent and a polymer that is soluble in the organic solvent, as well as an electrode for a lithium ion secondary battery and a lithium ion secondary battery each using the binder resin composition.

Abstract: A resin for an energy device electrode contains a structural unit derived from a nitrile group-containing monomer; and a structural unit derived from a monomer represented by the following Formula (I), wherein the resin does not contain a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group, or the resin has a ratio of a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group of 0.01 moles or less with respect to 1 mole of the structural unit derived from a nitrile group-containing monomer, and a ratio of the structural unit derived from a nitrile group-containing monomer to a total of structural units derived from each monomer is from 90% by mole to less than 100%.

Abstract: A resin for an energy device electrode contains a structural unit derived from a nitrile group-containing monomer; and a structural unit derived from a monomer represented by the following Formula (I), wherein the resin does not contain a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group, or the resin has a ratio of a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group of 0.01 moles or less with respect to 1 mole of the structural unit derived from a nitrile group-containing monomer. In Formula (I), R1 represents a hydrogen atom or a methyl group, R2 represents a hydrogen atom or a monovalent hydrocarbon group, and n represents an integer from 1 to 50.

Abstract: The disclosure provides a detecting composition or layer; a film, a device, a tape and a detecting system having the detecting layer; and methods of use thereof.

Abstract: Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150° C. to 230° C. in an amount of 10% by mass or more in a total amount of the residual solvent.

Abstract: The present disclosure provides a binder resin composition comprising a polyolefin particle, an organic solvent and a polymer that is soluble in the organic solvent, as well as an electrode for a lithium ion secondary battery and a lithium ion secondary battery each using the binder resin composition.

Abstract: An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order. The layer A is a resin composition which contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m2/g or more, and the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) is within the range from 30:1 to 2:1. The layer B contains a thermosetting resin composition which is in a solid state at a temperature lower than 40° C. but melts at a temperature of 40° C. or higher but lower than 140° C.

Abstract: Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof.

Abstract: In the production equipment for a precipitation hardened alloy strip, a solution treatment unit includes a heating chamber provided to heat the material alloy strip having a precipitation hardening alloy composition to a temperature of not lower than a recrystallization temperature but not higher than a melting point, a cooling chamber located adjacent to the heating chamber, and a pair of cooling rolls incorporated in the cooling chamber to hold therebetween and cool down the material alloy strip heated in the heating chamber. This production equipment can quench the material alloy strip to form a solid solution supersaturated with precipitation hardening elements and thereby forming a precipitation hardened alloy strip having a good shape and a favorable surface condition.

Abstract: The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.