Abstract: A coil component includes: a core that includes a winding-core portion and a flange portion that is formed on an end surface of the winding-core portion; a wire that is wound around the winding-core portion; and an outer electrode that is formed on a bottom surface of the flange portion, to which an end portion of the wire is connected, and that includes a first metal layer that forms a surface of the outer electrode. At least a part of the end portion of the wire is embedded in the first metal layer.

Abstract: A film condenser formed of a solderable metal foil composed on one member 1 selected from the group consisting of copper, tin, and aluminum having a heat resistant plastic film 2 coated on one surface and a vapor-deposited metal film 3 on the surface of the heat resistant plastic film facing away from the metal foil. Two lead wires each having a part bent in the shape of a V or u with the open end facing laterally of the length of the wire and having a size to prevent solder in a molten state from flowing out of the bent part during soldering due to the surface tension of the molten solder are soldered to the other surface of the metal foil and to the surface of the metal film facing away from the plastic film.

Abstract: A method of treating a semiconductor device comprising the step of dipping said semiconductor device into a solution of chelating agent selected from the group consisting of .gamma.-pyrones, nitrated catechols, flavones and combinations thereof.

Abstract: An epoxy resin composition for encasing semiconductive devices comprising a homogeneous mixture of a cresol novolak type epoxy resin and phthalic anhydride as a curing agent, the amount of phthalic anhydride being in excess of the equivalents of epoxide groups, a derivative of imidazole as a curing accelerating agent, and remainder being mineral filler.