Abstract: To provide an electrode for an electricity storage device, which electrode employs a porous conductor having conductive nanostructures formed on its surface and makes it possible to provide a less expensive electricity storage device having a high discharge capacity and high charge/discharge cycle resistance. A porous conductor which is used as an electrode for an electricity storage device has a plurality of conductive nanostructures on a surface of the porous conductor.

Abstract: A leakage of electromagnetic waves is suppressed effectively on the periphery of a heat radiating device. A heat radiating device (80) includes a plurality of fins (81) that are arranged on the inside of an opening (52a), a heat pipe (83) that includes a connecting portion (83a) being located between the plurality of fins (81) and a circuit board (50) and extending in a left-right direction along the circuit board (50), and a base plate (82) that supports the plurality of fins (81). The base plate (82) includes a plate left portion (82c). The plate left portion (82c) covers a lower surface of the heat pipe (83), the lower surface facing a side of a board shield (52), and closes a gap (G1) between a left end of the plurality of fins (81) and a left edge of the opening (52a) of the board shield (52).

Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber (R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

Abstract: Disclosed herein is an electronic device including a first circuit board on which a first connector is mounted, a second circuit board on which a second connector connected to the first connector via a cable is mounted, a circuit board shield that covers the first circuit board and exposes the first connector, and a connector shield that is attached to the circuit board shield to cover the first connector and is removable from the circuit board shield.

Abstract: Provided is an electronic device including a circuit board having a first surface and a second surface, a first member covering the first surface to function as a shield of the circuit board and having a first encompassing region having, in at least a portion thereof, a first outer region, and a second member that is placed on a side of the second surface that has a second outer region. One of the first and the second outer regions has at least one outer fixed portion fixed to another of the first and the second outer regions and at least one projection located away from the at least one outer fixed portion in a direction along an outer edge of the circuit board. The first and the second members are in contact with each other with the at least one outer fixed portion and the at least one projection.

Abstract: Information regarding a semiconductor package is written on a stiffener and not on an upper surface of a semiconductor chip. The stiffener is positioned outside an outer edge of the semiconductor chip and inside an outer edge of a package base material. Further, a thermally conductive material having fluidity is disposed between the upper surface of the semiconductor chip and a radiator. Therefore, the semiconductor chip provides high cooling performance.

Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

Abstract: A leakage of electromagnetic waves is suppressed effectively on the periphery of a heat radiating device. A heat radiating device (80) includes a plurality of fins (81) that are arranged on the inside of an opening (52a), a heat pipe (83) that includes a connecting portion (83a) being located between the plurality of fins (81) and a circuit board (50) and extending in a left-right direction along the circuit board (50), and a base plate (82) that supports the plurality of fins (81). The base plate (82) includes a plate left portion (82c). The plate left portion (82c) covers a lower surface of the heat pipe (83), the lower surface facing a side of a board shield (52), and closes a gap (G1) between a left end of the plurality of fins (81) and a left edge of the opening (52a) of the board shield (52).

Abstract: In a structure using a metal having fluidity as a thermally conductive material, the thermally conductive material is prevented from entering an unintended region even in a case where a change in attitude of a semiconductor device or vibration occurs. An electronic apparatus has a thermally conductive material (31) formed between a radiator (50) and a semiconductor chip (11). The thermally conductive material (31) has fluidity at least at a time of operation of the semiconductor chip (11). In addition, the thermally conductive material (31) has electric conductivity. The thermally conductive material (31) is surrounded by a seal member (33). A capacitor (16) is covered by an insulating portion (15).

Abstract: A heat sink includes a plurality of fins arrayed in a first direction, and a heat pipe having a first extension extending in the first direction. A second direction extends perpendicularly to the first direction, a third direction extends perpendicularly to the first direction and the second direction, and when the heat pipe is viewed in the third direction, the heat pipe has a second extension spaced from the first extension in the second direction and extending in the first direction, and a joint which interconnects the first extension and the second extension and which is curved. The fins include a plurality of first fins arrayed along the first extension and the second extension and a second fin disposed around a position of the joint.

Abstract: A heat sink includes a plurality of fins arrayed in a first direction, and a heat pipe having a first extension extending in the first direction. A second direction extends perpendicularly to the first direction, a third direction extends perpendicularly to the first direction and the second direction, and when the heat pipe is viewed in the third direction, the heat pipe has a second extension spaced from the first extension in the second direction and extending in the first direction, and a joint which interconnects the first extension and the second extension and which is curved. The fins include a plurality of first fins arrayed along the first extension and the second extension and a second fin disposed around a position of the joint.

Abstract: A button member for disposing within a housing includes: at least one pressed part that is exposed through an opening formed through the inner and outer surfaces of the housing, where the at least one pressed part is for being pressed by a user in a first direction; at least one elastic arm part extending from the at least one pressed part such that a reaction force is generated when the at least one pressed part is pressed in the first direction, and such that the at least one elastic arm part biases the at least one pressed part in a direction opposite to the first direction to a position of rest; a base part located at an end part of the at least one elastic arm part, at least a portion of the base part extending in the first direction, and where the at least one pressed part, the at least one elastic arm part, and the base part are monolithically molded.

Abstract: Electronic apparatus includes a housing configured to have an inner layer portion forming an inner surface and an outer layer portion forming an outer surface. The inner layer portion and the outer layer portion are formed by two-color molding. The electronic apparatus includes one of a region in which the inner layer portion is not formed and a region in which the inner layer portion is thin. The one region is set in the inner surface of the housing. The electronic apparatus further includes a component configured to be housed in the housing and is disposed in the one region.

Abstract: Electronic apparatus includes a housing configured to have an inner layer portion forming an inner surface and an outer layer portion forming an outer surface. The inner layer portion and the outer layer portion are formed by two-color molding. The electronic apparatus includes one of a region in which the inner layer portion is not formed and a region in which the inner layer portion is thin. The one region is set in the inner surface of the housing. The electronic apparatus further includes a component configured to be housed in the housing and is disposed in the one region.