Patents by Inventor Nobuyuki Takahashi

Nobuyuki Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240117228
    Abstract: A welding film includes a phenoxy resin, in which a z average molecular weight of the phenoxy resin is 70,000 or more, and a ratio [Mz/Mn] between the z average molecular weight and a number average molecular weight of the phenoxy resin is 5.0 or more.
    Type: Application
    Filed: February 4, 2022
    Publication date: April 11, 2024
    Applicant: Resonac Corporation
    Inventors: Ryota NIIBAYASHI, Nobuyuki TAKAHASHI, Hayato SAITO, Kunihiro KUROKI
  • Patent number: 11919048
    Abstract: The present invention relates to a method of cleaning an optical film-thickness measuring system used for measuring a film thickness of a substrate, such as a wafer, while polishing the substrate. The method includes: cleaning an optical sensor head (7) by supplying a rinsing liquid into a through-hole (51) formed in a polishing pad (2) on a polishing table (3) before or after polishing of a substrate (W) with use of slurry, the optical sensor head (7) being located below the through-hole (51); and discharging the rinsing liquid from the through-hole (51) through a drain line (54).
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: March 5, 2024
    Assignee: EBARA CORPORATION
    Inventors: Nobuyuki Takahashi, Toru Maruyama, Taichi Yokoyama, Zhongxin Wen
  • Publication number: 20240069457
    Abstract: The toner contains binder resin-containing toner particles and silica fine particle S1, wherein the weight-average particle diameter of the toner is 4.0-15.0 ?m, both inclusive, peaks originating with the silica fine particle S1 are observed in 29 Si-NMR measurement of the silica fine particle S1, and, in the spectrum obtained by 29Si CP/MAS NMR or 29Si DD/MAS NMR, the peak area of a peak corresponding to the D1 unit structure in the silica fine particle S1, the peak area of a peak corresponding to the D2 unit structure in the silica fine particle S1, and the peak area of a peak corresponding to the Q unit structure in the silica fine particle S1 satisfy a prescribed relationship.
    Type: Application
    Filed: October 25, 2023
    Publication date: February 29, 2024
    Inventors: RYUJI MURAYAMA, SHIN KITAMURA, TORU TAKAHASHI, DAISUKE TSUJIMOTO, RYUICHIRO MATSUO, HITOSHI SANO, NOBUYUKI FUJITA, SHUJI YAMADA, YUKA GUNJI, TAKAKUNI KOBORI, YOSHIHIRO OGAWA, ATSUHIKO OHMORI, HIROKI KAGAWA, KEISUKE ADACHI, TOMOKO SUGITA
  • Patent number: 11912214
    Abstract: A wiring module includes a flexible substrate, a sensor component (temperature sensor), a connecting member (bus bar), and a holding part-equipped relay member, wherein the holding part-equipped relay member includes: a relay member main body including a base part (first main plate) that is to be fixed to the flexible substrate and the bus bar, and a holding part (first holding piece) that is continuous with the first main plate; a pedestal part (housing) that is to be held by the first holding piece so as to be displaceable in a direction toward or away from the first main plate, and that is to be fixed to a position of the flexible substrate where the temperature sensor is mounted; and a biasing member that has elastic force, that has one end held by the first main plate, and that biases the housing in the direction away from the first main plate.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: February 27, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Nobuyuki Matsumura, Shinichi Takase, Hiroki Shimoda, Hideo Takahashi
  • Publication number: 20240051237
    Abstract: Provided is a method for easily manufacturing a metal-polyolefin bonded body having high bonding strength. This method for manufacturing a metallic member-resin member bonded body comprises: preparing a film that includes at least one modified polyolefin layer selected from the group consisting of a layer containing a reaction product 1 of a maleic anhydride-modified polyolefin, a bifunctional epoxy resin, and a bifunctional phenol compound, a layer containing a reaction product 2 of a maleic anhydride-modified polyolefin and a thermoplastic epoxy resin, and a layer containing a mixture of a polyolefin and a thermoplastic epoxy resin; disposing the film on at least a part of the surface of a metallic substrate so as to expose the modified polyolefin layer, thereby forming a metallic member in which a resin coating layer is laminated on the metallic substrate; and bonding a resin member onto the resin coating layer of the metallic member.
    Type: Application
    Filed: November 9, 2021
    Publication date: February 15, 2024
    Applicant: Resonac Corporation
    Inventors: Nobuyuki TAKAHASHI, Masahiro SATO, Kazuo OTANI
  • Patent number: 11881198
    Abstract: A sound-insulation material for a vehicle has high rigidity and is capable of exhibiting sufficient sound insulation performance against noise having a frequency of 500 Hz to 5000 Hz generated in a vehicle, while maintaining low weight. The sound-insulation material for a vehicle of the present invention has a multilayer structure, the material including: a hard layer having tubular cells, the tubular cells being arranged in a plurality of rows; and a soft layer provided on one surface of the hard layer, in which a ratio of a dynamic spring constant Kd to a static spring constant Ks, of a structure having the hard layer and the soft layer, is 0<Kd/Ks?1.5.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: January 23, 2024
    Inventors: Kazuki Fukui, Nobuyuki Takahashi
  • Patent number: 11873399
    Abstract: Provided are: a resin composition for easily giving polishing pads which have a hardness suitable for chemical mechanical polishing and have voids of a desired size; a polishing pad produced from the resin composition; and a method for producing the polishing pad. The resin composition comprises a urethane (meth)acrylate (A), at least one unsaturated resin (B) selected from among vinyl ester resins and unsaturated polyester resins, an ethylenically unsaturated compound (C) which has an ethylenically unsaturated bond and is neither the urethane (meth)acrylate (A) nor the unsaturated resin (B), and a hollow object (D), wherein the mass ratio of the content of the urethane (meth)acrylate (A) to the content of the unsaturated resin (B), A:B, is 64:36 to 96:4 and the content of the hollow object (D) is 0.7-9.0 parts by mass per 100 parts by mass of the sum of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C).
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: January 16, 2024
    Assignee: Resonac Corporation
    Inventors: Ryujin Ishiuchi, Nobuyuki Takahashi
  • Publication number: 20240010147
    Abstract: Provided are: a lightweight bumper reinforcement which, with respect to the load during a collision, exhibits high rigidity against a light load and, against a heavy load, is capable of plastic deformation to absorb collision energy while effectively transferring unabsorbed energy to a crash box; a method for manufacturing the same; and a resin reinforcement member for a bumper reinforcement. The bumper reinforcement of the present disclosure comprises a body portion extending along a vehicle width direction, and a resin reinforcement portion extending along the vehicle width direction and disposed on the vehicle body side relative to the body portion. The body portion has at least one first joint portion on the vehicle body side. The resin reinforcement portion has at least one second joint portion joined to the first joint portion, and one or more reinforcement ribs projecting on the vehicle body side and extending along the vehicle width direction.
    Type: Application
    Filed: November 4, 2021
    Publication date: January 11, 2024
    Applicant: Resonac Corporation
    Inventors: Kazuo OTANI, Ryota NIIBAYASHI, Naoyuki KAWATA, Nobuyuki TAKAHASHI, Masahiro SATO
  • Publication number: 20230330946
    Abstract: The present invention relates to a method for bonding a metal and a resin, including bonding a metal and a resin by high-frequency induction welding via an intermediate resin layer which causes a chemical reaction.
    Type: Application
    Filed: August 4, 2021
    Publication date: October 19, 2023
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuo OTANI, Nobuyuki TAKAHASHI, Ryota NIIBAYASHI
  • Publication number: 20230331088
    Abstract: A vehicle display device includes an output unit that outputs output light of display information to be visually recognized as a virtual image by an occupant in a vehicle cabin, a reflector that directly or indirectly receives the output light, and reflects the output light toward an eye box indicating a region in which the occupant can visibly recognize the virtual image, and a controller that controls an operation of the output unit. The output unit includes a display unit that emits the display information as display light, a turning-back mirror that reflects, as the output light, the display light emitted from the display unit, a holding member that holds the display unit and the turning-back mirror without changing relative positions of the display unit and the turning-back mirror, and a drive mechanism that can reciprocate the holding member along an optical axial direction of the turning-back mirror.
    Type: Application
    Filed: April 17, 2023
    Publication date: October 19, 2023
    Applicant: Yazaki Corporation
    Inventors: Junichi ICHIKAWA, Nobuyuki TAKAHASHI, Jun SHIHAKU
  • Publication number: 20230257861
    Abstract: The present disclosure relates to an austenitic stainless steel contains C?0.10 mass %, Si?0.50 mass %, 3.0?Mn?8.0 mass %, P?0.30 mass %, S?0.30 mass %, 7.0 Ni?12.0 mass %, 18.0?Cr?28.0 mass %, 1.0?Mo?3.0 mass %, 0.03?V?0.50 mass %, 0.0003?B?0.0300 mass %, 0.0001?Ca?0.0300 mass %, 0.35?N?0.80 mass %, W?2.0 mass %, Zr?0.20 mass %, Cu?0.5 mass %, Al?0.10 mass %, and O?0.050 mass %, with a balance being Fe and unavoidable impurities. The austenitic stainless steel has a number density of coarse alloy carbonitrides of 3×105 pieces/mm2 or less.
    Type: Application
    Filed: February 2, 2023
    Publication date: August 17, 2023
    Inventors: Nobuyuki TAKAHASHI, Daisuke Kudo, Tomohiro Ando, Yoshikiko Koyanagi
  • Publication number: 20230196321
    Abstract: According to one embodiment, a mobile terminal for use in a self-service checkout system includes a processor, a communication interface connectable to a reservation management server, and a display screen. The processor receives product identification information for identifying a product to be purchased in a sales transaction, and displays a reservation request screen on the display screen to receive a reservation request for which a reservation time for using an accounting device for settlement processing of the sales transaction is set. The processor sends the reservation request to the reservation management server via the communication interface and receives a reservation request response from the reservation management server. The reservation request response includes reservation information when the reservation request is accepted by the reservation management server.
    Type: Application
    Filed: October 5, 2022
    Publication date: June 22, 2023
    Inventor: Nobuyuki TAKAHASHI
  • Patent number: D997057
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: August 29, 2023
    Assignee: Resonac Corporation
    Inventors: Masahiro Sato, Nobuyuki Takahashi
  • Patent number: D997058
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: August 29, 2023
    Assignee: Resonac Corporation
    Inventors: Masahiro Sato, Nobuyuki Takahashi
  • Patent number: D997059
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: August 29, 2023
    Assignee: Resonac Corporation
    Inventors: Masahiro Sato, Nobuyuki Takahashi
  • Patent number: D997060
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: August 29, 2023
    Assignee: Resonac Corporation
    Inventors: Masahiro Sato, Nobuyuki Takahashi
  • Patent number: D997061
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: August 29, 2023
    Assignee: Resonac Corporation
    Inventors: Masahiro Sato, Nobuyuki Takahashi
  • Patent number: D997802
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: September 5, 2023
    Assignee: SHOWA DENKO K.K.
    Inventors: Masahiro Sato, Nobuyuki Takahashi
  • Patent number: D997803
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: September 5, 2023
    Assignee: Resonac Corporation
    Inventors: Masahiro Sato, Nobuyuki Takahashi
  • Patent number: D999690
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: September 26, 2023
    Assignee: Resonac Corporation
    Inventors: Masahiro Sato, Nobuyuki Takahashi