Patents by Inventor Nobuyuki Takahashi

Nobuyuki Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250145781
    Abstract: Provided is a fluororesin film with high uniformity in adhesion strength of the film. A fluororesin film that is a film comprising a fluororesin-containing composition, wherein at least one surface of the fluororesin film has an average value of contact angles for water measured at 5 points with intervals of 100 mm in a travel direction of 105° or less and an average value of contact angles for n-hexadecane measured at 5 points with intervals of 100 mm in the travel direction of 45° or less at locations of center and 100 mm from respective left and right ends.
    Type: Application
    Filed: January 13, 2025
    Publication date: May 8, 2025
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Masahiko KAWAMURA, Tatsuya HIGUCHI, Kenzo TAKAHASHI, Hirokazu KOMORI, Hideaki TENKAJI, Junpei TERADA, Nobuyuki KOMATSU
  • Publication number: 20250111969
    Abstract: A coil component includes an element body formed by laminating a plurality of insulator layers, and a pillar part disposed in the element body and extending in a lamination direction of the plurality of insulator layers. The pillar part has a plurality of pillar members laminated in the lamination direction. Between the two pillar members in the lamination direction, a defining part that defines a contact surface between the two pillar members is provided. The defining part is formed of a material different from a material of the pillar part, and is disposed at edges of the two pillar members when viewed from the lamination direction.
    Type: Application
    Filed: September 23, 2024
    Publication date: April 3, 2025
    Applicant: TDK Corporation
    Inventors: Nobuyuki OKUZAWA, Ryuji HASHIMOTO, Yuiko HIROSE, Yuta TAKAHASHI, Hiroki HOSAKA, Koki ENDO
  • Publication number: 20250101560
    Abstract: The present invention relates to an austenitic stainless steel, consisting of: C?0.10 mass %, Si?0.50 mass %, 3.0 mass %?Mn?8.0 mass %, P?0.30 mass %, S?0.30 mass %, 7.0 mass %?Ni?12.0 mass %, 18.0 mass %?Cr ?28.0 mass %, 1.0 mass %?Mo?3.0 mass %, 0.03 mass %?V?0.50 mass %, 0.0003 mass %?B?0.0300 mass %, 0.0001 mass %?Ca?0.0300 mass %, 0.35 mass %?N?0.80 mass %, and 0.001 mass %?Co?1.00 mass %, and optionally, W?2.0 mass %, Zr?0.20 mass %, and Ta?0.50 mass %, with a balance being Fe and unavoidable impurities, and having a number density of coarse alloy carbonitrides of 3×105 pieces/mm2 or less.
    Type: Application
    Filed: September 26, 2024
    Publication date: March 27, 2025
    Inventors: Nobuyuki TAKAHASHI, Daisuke KUDO, Tomohiro ANDO, Yoshihiko KOYANAGI
  • Publication number: 20250091297
    Abstract: Disclosed is a method for producing a joined body obtained by joining a base material A, a solid joining agent containing an amorphous thermoplastic resin, which is at least one of a thermoplastic epoxy resin and a phenoxy resin, as a main component, and a base material B in this order, in which at least the base material A is a thermoplastic resin base material, an epoxy equivalent of the amorphous thermoplastic resin is 1,600 g/eq. or more or the amorphous thermoplastic resin does not contain an epoxy group, and a heat of fusion of the amorphous thermoplastic resin is 15 J/g or less, and the method has a step of superposing and a joining step (1), or has a joining step (2-1) and a joining step (2-2).
    Type: Application
    Filed: December 21, 2022
    Publication date: March 20, 2025
    Applicant: Resonac Corporation
    Inventors: Nobuyuki TAKAHASHI, Masatoshi MORI
  • Publication number: 20250065549
    Abstract: A method is provided for producing a joined body, including: an injection molding step of injecting a thermoplastic resin composition into a cavity of a mold in a state where a solid joining agent containing a thermoplastic resin having an epoxy equivalent of 1,600 or more or containing no epoxy group is placed on a wall surface in the cavity to obtain a first base material in which a resin molded body made of the thermoplastic resin composition and the solid joining agent are integrated; and a joining step of melting and then solidifying the solid joining agent in a state where the solid joining agent of the first base material is in contact with a second base material to obtain a joined body between the first base material and the second base material.
    Type: Application
    Filed: December 21, 2022
    Publication date: February 27, 2025
    Applicant: Resonac Corporation
    Inventors: Nobuyuki TAKAHASHI, Masatoshi MORI
  • Publication number: 20250065574
    Abstract: Provided is a method for manufacturing a bumper reinforcement in which bonding process time is short and open time is long. A method for manufacturing a bumper reinforcement of one embodiment includes: a pre-bonding step of preparing a layered body containing, in the following order, a metal member, which is a body section, a solid adhesive mainly comprising an amorphous thermoplastic resin that is at least one of a thermoplastic epoxy resin and a phenoxy resin, and a resin member, which is a resin reinforcement; and a bonding step of heating and pressurizing the layered body to melt the solid adhesive, and bonding the metal member and the resin member. Either the epoxy equivalent of the amorphous thermoplastic resin is 1,600 or more or the amorphous thermoplastic resin does not contain epoxy groups, and the heat of fusion of the amorphous thermoplastic resin is 15 J/g or less.
    Type: Application
    Filed: November 28, 2022
    Publication date: February 27, 2025
    Applicant: Resonac Corporation
    Inventors: Nobuyuki TAKAHASHI, Masahiro SATO, Hayato SAITO
  • Patent number: 12188113
    Abstract: The present disclosure relates to an austenitic stainless steel contains C?0.10 mass %, Si?0.50 mass %, 3.0?Mn?8.0 mass %, P?0.30 mass %, S?0.30 mass %, 7.0?Ni?12.0 mass %, 18.0?Cr?28.0 mass %, 1.0?Mo?3.0 mass %, 0.03?V?0.50 mass %, 0.0003?B?0.0300 mass %, 0.0001?Ca?0.0300 mass %, 0.35?N?0.80 mass %, W?2.0 mass %, Zr?0.20 mass %, Cu?0.5 mass %, Al?0.10 mass %, and O?0.050 mass %, with a balance being Fe and unavoidable impurities. The austenitic stainless steel has a number density of coarse alloy carbonitrides of 3×105 pieces/mm2 or less.
    Type: Grant
    Filed: February 2, 2023
    Date of Patent: January 7, 2025
    Assignee: DAIDO STEEL CO., LTD.
    Inventors: Nobuyuki Takahashi, Daisuke Kudo, Tomohiro Ando, Yoshihiko Koyanagi
  • Publication number: 20240363357
    Abstract: Embodiments of the present technology may include semiconductor processing methods. The methods may include providing deposition precursors to a processing region of a semiconductor processing chamber. The deposition precursors may include a silicon-containing precursor and a nitrogen-containing precursor. A substrate including one or more materials may be disposed within the processing region. The substrate may be characterized by a first bowing of the substrate. The methods may include generating plasma effluents of the deposition precursors. The methods may include forming a layer of silicon-and-nitrogen-containing material on the substrate. The layer of silicon-and-nitrogen-containing material may be characterized by a tensile stress. Subsequent forming the layer of silicon-and-nitrogen-containing material, the substrate may be characterized by a second bowing of the substrate that is less than the first bowing of the substrate.
    Type: Application
    Filed: April 10, 2024
    Publication date: October 31, 2024
    Applicant: Applied Materials, Inc.
    Inventors: David H. Collins, Nobuyuki Takahashi, Pin Hian Lee, Rio Soedibyo, Sanggil Bae, Houssam Lazkani, Songkram Sonny Srivathanakul, Raman Gaire, Gopal Bajaj
  • Publication number: 20240345392
    Abstract: A vehicle display device includes a display unit that emits display information to be visually recognized by a driver as display light, and an aspheric mirror that reflects the display light toward a windshield. The display unit emits the display light that is narrower than an eye range based on a distribution range of eye points of a plurality of drivers, and corresponds to an eye box, which is a light distribution range based on an acquired eye point.
    Type: Application
    Filed: June 26, 2024
    Publication date: October 17, 2024
    Inventors: Kunimitsu Aoki, Nobuyuki Takahashi, Go Nakamura
  • Publication number: 20240308148
    Abstract: Provided is a method for producing a joined body obtained by joining a base material A, a film containing an amorphous thermoplastic resin, which is at least one of a thermoplastic epoxy resin and a phenoxy resin, as a main component, and a resin B in this order. The method includes a first joining step of joining the base material A and the film by melting and then solidifying the film in a state in which the film is in contact with the base material A, and a second joining step of joining the base material A and the resin B by melting and then solidifying the film in a state in which the film joined to the base material A is in contact with the resin B. The base material A is at least one of a metal and an inorganic substance, an epoxy equivalent of the amorphous thermoplastic resin is 1,600 g/eq. or more, or the amorphous thermoplastic resin does not contain an epoxy group, and a heat of fusion of the amorphous thermoplastic resin is 15 J/g or less.
    Type: Application
    Filed: December 21, 2022
    Publication date: September 19, 2024
    Applicant: Resonac Corporation
    Inventors: Nobuyuki TAKAHASHI, Masatoshi Mori
  • Publication number: 20240300213
    Abstract: Provided is a method for producing a joined body, including a pre-joining step in which a base material A, a solid joining agent containing an amorphous thermoplastic resin, which is at least one of a thermoplastic epoxy resin and a phenoxy resin, as a main component, and a base material B are disposed in this order to prepare a laminated body, and a joining step in which the solid joining agent is melted by heating and pressurizing the laminated body to join the base material A and the base material B, in which an epoxy equivalent of the amorphous thermoplastic resin is 1,600 or more, or the amorphous thermoplastic resin does not contain an epoxy group, and a heat of fusion of the amorphous thermoplastic resin is 15 J/g or less.
    Type: Application
    Filed: June 24, 2022
    Publication date: September 12, 2024
    Applicant: Resonac Corporation
    Inventors: Nobuyuki TAKAHASHI, Kunihiro KUROKI, Hayato SAITO
  • Publication number: 20240279764
    Abstract: Disclosed is a martensitic stainless steel for a hydrogen gas environment, having a composition consisting of: 0.02 mass %?C?0.30 mass %, Si?1.50 mass %, Mn?1.50 mass %, P?0.150 mass %, S?0.150 mass %, 8.0 mass %?Cr?22.0 mass %, 1.0 mass %?Ni?6.0 mass %, 0.01 mass %?Nb?1.0 mass %, and N?0.12 mass %, and optionally at least one selected from the group consisting of: Cu?6.00 mass %, Mo?3.00 mass %, V?1.50 mass %, and B?0.0500 mass %, with the balance being Fe and inevitable impurities; having: a crystal grain size number of prior austenite grains of 2.0 or more, an amount of retained austenite of 40 vol % or less, a tensile strength of 1,500 MPa or less, and satisfying DH2(0.7)/Dair?0.8.
    Type: Application
    Filed: January 11, 2024
    Publication date: August 22, 2024
    Inventors: Nobuyuki TAKAHASHI, Daisuke KUDO, Tomohiro ANDO, Yoshihiko KOYANAGI, Huhei OGAWA, Hisao MATSUNAGA
  • Patent number: 12062563
    Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: August 13, 2024
    Assignee: EBARA CORPORATION
    Inventors: Itsuki Kobata, Keita Yagi, Katsuhide Watanabe, Yoichi Shiokawa, Toru Maruyama, Nobuyuki Takahashi
  • Publication number: 20240247331
    Abstract: The present invention relates to an austenitic stainless steel for high-pressure hydrogen gas or liquid hydrogen, having a composition consisting of: C?0.20 mass %, 0.10 mass %? Si?1.00 mass %, 0.10 mass %?Mn?2.0 mass %, P?0.050 mass %, S?0.050 mass %, 2.0 mass %?Cu<4.0 mass %, 8.0 mass %? Ni?11.5 mass %, 17.0 mass %<Cr?22.0 mass %, Mo?0.20 mass %, and N?0.050 mass %, with the balance being Fe and inevitable impurities; having an Ni equivalent Nieq of 24.0 or more; and having a relative reduction in area of 0.8 or more.
    Type: Application
    Filed: December 21, 2023
    Publication date: July 25, 2024
    Inventors: Daisuke KUDO, Nobuyuki TAKAHASHI, Tomohiro ANDO, Yoshihiko KOYANAGI
  • Publication number: 20240209468
    Abstract: Disclosed is a martensitic stainless steel material for a hydrogen gas environment, having a composition consisting of: 0.03 mass %?C?1.20 mass %, Si?1.00 mass %, Mn?1.50 mass %, P?0.060 mass %, S?0.250 mass %, Cu?0.50 mass %, 8.0 mass %?Cr?22.0 mass %, Ni?1.00 mass %, and N?0.40 mass %, and optionally at least one selected from the group consisting of: Mo?3.00 mass %, V?1.50 mass %, Nb?1.00 mass %, Pb?0.30 mass %, and B?0.0500 mass %, with the balance being Fe and inevitable impurities; having: a content of a precipitate of 1.50 mass % or more, a crystal grain size number of prior austenite grains of 2.0 or more, a metal structure including a martensite structure, a tensile strength of 1,800 MPa or less, and satisfying DH2(0.7)/Dair?0.8.
    Type: Application
    Filed: December 13, 2023
    Publication date: June 27, 2024
    Inventors: Nobuyuki TAKAHASHI, Daisuke KUDO, Tomohiro ANDO, Yoshihiko KOYANAGI, Yuhei OGAWA, Hisao MATSUNAGA
  • Patent number: 12017323
    Abstract: A polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, substrate, or panel, is disclosed. The polishing head system includes a polishing head having a plurality of piezoelectric elements configured to apply pressing forces to a workpiece, and an operation controller configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: June 25, 2024
    Assignee: EBARA CORPORATION
    Inventors: Itsuki Kobata, Hozumi Yasuda, Akio Yanai, Nobuyuki Takahashi, Takamasa Nakamura, Keisuke Sakata, Nobuyuki Takada, Yuji Yagi, Yasuhiro Takada, Katsuhide Watanabe
  • Publication number: 20240170209
    Abstract: A capacitor module that includes: a case having a bottom surface and a side surface extending from the bottom surface to define an opening that faces the bottom surface, and the side surface including a through hole; one or more of capacitors in the case; a capacitor connection bus bar connected to an electrode of the one or more capacitors; a terminal bus bar extending through the through hole, and includes a first end inside the case and a second end outside the case, the first end being connected to the capacitor connection bus bar; and a sealing resin filled in the case, wherein the capacitor connection bus bar includes a connector, and at least a part of the connector is inclined in a direction from the opening toward the bottom surface of the case and connected to the first end of the terminal bus bar.
    Type: Application
    Filed: December 26, 2023
    Publication date: May 23, 2024
    Inventor: Nobuyuki TAKAHASHI
  • Publication number: 20240117228
    Abstract: A welding film includes a phenoxy resin, in which a z average molecular weight of the phenoxy resin is 70,000 or more, and a ratio [Mz/Mn] between the z average molecular weight and a number average molecular weight of the phenoxy resin is 5.0 or more.
    Type: Application
    Filed: February 4, 2022
    Publication date: April 11, 2024
    Applicant: Resonac Corporation
    Inventors: Ryota NIIBAYASHI, Nobuyuki TAKAHASHI, Hayato SAITO, Kunihiro KUROKI
  • Patent number: 11919048
    Abstract: The present invention relates to a method of cleaning an optical film-thickness measuring system used for measuring a film thickness of a substrate, such as a wafer, while polishing the substrate. The method includes: cleaning an optical sensor head (7) by supplying a rinsing liquid into a through-hole (51) formed in a polishing pad (2) on a polishing table (3) before or after polishing of a substrate (W) with use of slurry, the optical sensor head (7) being located below the through-hole (51); and discharging the rinsing liquid from the through-hole (51) through a drain line (54).
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: March 5, 2024
    Assignee: EBARA CORPORATION
    Inventors: Nobuyuki Takahashi, Toru Maruyama, Taichi Yokoyama, Zhongxin Wen
  • Publication number: 20240051237
    Abstract: Provided is a method for easily manufacturing a metal-polyolefin bonded body having high bonding strength. This method for manufacturing a metallic member-resin member bonded body comprises: preparing a film that includes at least one modified polyolefin layer selected from the group consisting of a layer containing a reaction product 1 of a maleic anhydride-modified polyolefin, a bifunctional epoxy resin, and a bifunctional phenol compound, a layer containing a reaction product 2 of a maleic anhydride-modified polyolefin and a thermoplastic epoxy resin, and a layer containing a mixture of a polyolefin and a thermoplastic epoxy resin; disposing the film on at least a part of the surface of a metallic substrate so as to expose the modified polyolefin layer, thereby forming a metallic member in which a resin coating layer is laminated on the metallic substrate; and bonding a resin member onto the resin coating layer of the metallic member.
    Type: Application
    Filed: November 9, 2021
    Publication date: February 15, 2024
    Applicant: Resonac Corporation
    Inventors: Nobuyuki TAKAHASHI, Masahiro SATO, Kazuo OTANI