Patents by Inventor Nobuyuki Tomioka

Nobuyuki Tomioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240026097
    Abstract: The present invention aims to provide: an epoxy resin composition in which the effect of adding an additive can be efficiently obtained even at a high temperature; a molding material which achieves a reduced unevenness in physical properties after curing while allowing the additive to exert its effect; and a fiber-reinforced composite material which has excellent mechanical properties while allowing the additive to exert its effect. To achieve the above-mentioned object, the epoxy resin composition according to the present invention is an epoxy resin composition including the following components (A) to (E): component (A): an epoxy resin having a viscosity at 25° C. of from 0.1 to 1,000 Pa·s and having two or more epoxy groups within one molecule; component (B): an additive having a viscosity at 25° C. of from 0.
    Type: Application
    Filed: September 6, 2021
    Publication date: January 25, 2024
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Tatsuya TAKAMOTO, Norikazu ISHIKAWA, Nobuyuki TOMIOKA
  • Publication number: 20230416448
    Abstract: A purpose of the present invention is to provide a thermosetting epoxy resin composition that manifests latency at a temperature at which the thermosetting resin cures and has an excellent curing rate, and molded articles obtained by thermosetting the same. A further purpose is to provide a fiber-reinforced composite material obtained by blending with reinforcing fibers, a molding material for a fiber-reinforced composite material, and a method for producing a fiber-reinforced composite material. To achieve the above, the thermosetting epoxy resin composition of the present invention is a thermosetting epoxy resin composition including the following constituent elements [a], [b], and [c], wherein the relationship between the curing time (Tc) and the induction time (Ti) satisfies 1<Tc/Ti?9.
    Type: Application
    Filed: December 16, 2021
    Publication date: December 28, 2023
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Hiroya TSUCHIDA, Daisuke KONISHI, Nobuyuki TOMIOKA
  • Publication number: 20230416521
    Abstract: The purpose of the present invention is to provide a thermosetting epoxy resin composition with ability to allow cured products to have excellent toughness and to stably maintain high stiffness. In order to achieve the purpose, the thermosetting epoxy resin composition of the present invention includes the following components [a], [b], [c], and [d], wherein the stoichiometric ratio [b]/[a] of the component [b] to the component [a] is in the range from 0.7 to 2.0 thermosetting epoxy resin composition: [a] an epoxy resin; [b] an isocyanate curing agent; [c] an elastomeric toughening agent; [d] an oxazolidone cyclization catalyst.
    Type: Application
    Filed: December 2, 2021
    Publication date: December 28, 2023
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Shinya HAYASHI, Ko MATSUKAWA, Nobuyuki TOMIOKA
  • Publication number: 20230406994
    Abstract: The purpose of the present invention is to provide a thermosetting epoxy resin composition that is excellent in terms of both pot life and fast curability at low temperatures and also a molded article that is prepared by thermally curing the thermosetting epoxy resin composition and is excellent in terms of both wet heat resistance and toughness. In order to achieve the purpose, the thermosetting epoxy resin composition of the present invention includes the following components [a], [b], [c], and [d], wherein the stoichiometric ratio of [b] to [a] is in the range from 0.5 to 2.0: [a] an epoxy resin; [b] an isocyanate curing agent; [c] a hydroxyl group capping agent; [d] an epoxy curing catalyst.
    Type: Application
    Filed: November 2, 2021
    Publication date: December 21, 2023
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Ko MATSUKAWA, Daisuke KONISHI, Nobuyuki TOMIOKA
  • Patent number: 11667749
    Abstract: An epoxy resin composition for fiber-reinforced composite materials which contains 70% by mass or more of a crystalline epoxy resin as component (A) and 10% by mass or more of a crystalline amine curing agent as component (B) based on 100% by mass of the epoxy resin composition. The difference between the melting points of component (A) and component (B) is in a range of 0 to 60° C.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: June 6, 2023
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Masanori Hirano, Nobuyuki Tomioka
  • Patent number: 11661484
    Abstract: An epoxy resin composition for fiber reinforced composite materials comprising components (A) to (E): component (A), an epoxy resin; component (B), a dicyandiamide or a derivative thereof; component (C), a polyisocyanate compound; component (D), a urea compound as represented by formula (1): (wherein R1 and R2 are each independently H, CH3, OCH3, OC2H5, NO2, halogen, or NH—CO NR3R4; and R3 and R4 are each independently a hydrocarbon group, allyl group, alkoxy group, alkenyl group, aralkyl group, or an alicyclic compound containing both R3 and R4, all containing 1 to 8 carbon atoms); and component (E), at least one compound selected from the group consisting of quaternary ammonium salts, phosphonium salts, imidazole compounds, and phosphine compounds.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: May 30, 2023
    Assignee: Toray Industries, Inc.
    Inventors: Kazunori Hondo, Norikazu Ishikawa, Masanori Hirano, Nobuyuki Tomioka
  • Publication number: 20230030598
    Abstract: The purpose of the present invention is to provide: an epoxy resin composition having both excellent dispersibility of a solid curing agent and excellent impregnation of reinforcing fibers; a molding material for the fiber-reinforced composite material that has excellent dispersibility of the solid curing agent in the post-thickened resin; and a fiber-reinforced composite material that has excellent appearance quality and mechanical characteristics and little unevenness in physical properties. In order to achieve the aforementioned purpose, this epoxy resin composition has the following configuration. The epoxy resin composition includes all components (A)-(C). The degree of dispersion of component (B) in component (A) is 0.1-0.8, the viscosity at 25° C. is 0.1-100 Pa·s, and the glass transition temperature of an epoxy resin cured product at any hardness between 85%-95% is at least 110° C.
    Type: Application
    Filed: January 27, 2021
    Publication date: February 2, 2023
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Tatsuya TAKAMOTO, Norikazu ISHIKAWA, Nobuyuki TOMIOKA
  • Publication number: 20230024800
    Abstract: The present invention addresses the problem of providing a polyaryletherketone resin composition having excellent toughness and fluidity, a fiber-reinforced resin base material having excellent impregnating ability and toughness, and a molded article thereof. In order to solve said problem, the present invention has the following compositional make-up. A polyaryletherketone resin composition containing, with respect to (A) 100 parts by mass of a polyaryletherketone, (B) 1-100 parts by mass of a liquid crystalline polyester, wherein the polyaryletherketone resin composition forms a sea-island structure, and the average diameter of the island phases is 10-1000 nm.
    Type: Application
    Filed: February 5, 2021
    Publication date: January 26, 2023
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Atsushi MASUNAGA, Hidenobu TAKAO, Kenji ISHITAKE, Nobuyuki TOMIOKA
  • Publication number: 20230027417
    Abstract: The purpose of the present invention is to provide: a molding material from which a carbon fiber reinforced composite material having excellent impact resistance and tensile strength is obtained; and a molding material from which a glass fiber reinforced composite material, that has high bending strength and impact resistance, has excellent weather resistance, and can suppress a decrease in bending strength after water absorption, is obtained. In order to achieve the purpose, the molding material according to the present invention is a molding material formed of an epoxy resin composition and a carbon fiber and/or a glass fiber, wherein the epoxy resin composition includes all of [A] to [C], the carbon fiber satisfies conditions [a] and [b], and the glass fiber has a surface functional group capable of forming a covalent bond with an isocyanate group.
    Type: Application
    Filed: January 27, 2021
    Publication date: January 26, 2023
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Ko MATSUKAWA, Shizue KOYANAGI, Masanori HIRANO, Nobuyuki TOMIOKA
  • Publication number: 20220396696
    Abstract: The present invention aims to provide an epoxy resin composition for a fiber-reinforced composite material that maintains low viscosity during injection into reinforcing fibers to realize good impregnating and also has high toughness and high heat resistance and also aims to provide a fiber-reinforced composite material produced therefrom. Also provided is a molding method for a fiber-reinforced composite material including at least a reinforcing fiber [A] and a cured product of an epoxy resin composition [B], wherein the epoxy resin composition [B] includes the components [a], [b], and [c] specified below, and the epoxy resin composition [B] is cured in such a manner that the absorbance ratio Da/(Da+Db) is in the range of 0.4 to 1 in producing the fiber-reinforced composite material: [a] an epoxy resin having at least two oxirane groups in the molecule, [b] an epoxy resin curing agent having at least two isocyanate groups in the molecule, and [c] a catalyst.
    Type: Application
    Filed: November 16, 2020
    Publication date: December 15, 2022
    Applicant: TORAY Industries, Inc.
    Inventors: Ko MATSUKAWA, Masanori HIRANO, Maki NAGANO, Nobuyuki TOMIOKA
  • Publication number: 20220389161
    Abstract: The objective of the present invention is to provide a polyarylketone resin composition, a fiber-reinforced resin base material, and formed products therefrom having excellent thermal stability and mechanical properties. In order to achieve the above objective, the present invention has the following constitution. That is, the polyaryletherketone resin composition comprises (A) a polyaryletherketone and (B) a transition metal compound, wherein the transition metal content is between 0.001 parts by mass and 4 parts by mass inclusive with respect to 100 parts by mass of (A) the polyaryletherketone.
    Type: Application
    Filed: September 11, 2020
    Publication date: December 8, 2022
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Atsushi MASUNAGA, Kenji ISHITAKE, Nobuyuki TOMIOKA
  • Publication number: 20220275167
    Abstract: The purpose of the present invention is to provide a thermoplastic resin composition having exceptional thermal stability and mechanical characteristics, a fiber-reinforced resin substrate, and a molded article obtained therefrom. In order to achieve the abovementioned purpose, an embodiment of the present invention has the structure described below. Specifically, a thermoplastic resin composition including a thermoplastic resin (A) having an electron-donating group, and a transition metal compound (B), wherein the transition metal compound (B) includes a nickel compound (B1) and a copper compound (B2), the complete decomposition temperature of the copper compound (B2) is 400° C. or higher, and the copper compound (B2) has a nickel content of 0.001-4 parts by mass (inclusive) and a copper content of 0.001-4 parts by mass (inclusive) with respect to 100 parts by mass of the thermoplastic resin (A) having an electron-donating group.
    Type: Application
    Filed: September 11, 2020
    Publication date: September 1, 2022
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Atsushi MASUNAGA, Shinya HAYASHI, Kenji ISHITAKE, Nobuyuki TOMIOKA
  • Patent number: 11339243
    Abstract: An epoxy resin composition contains components (A)-(C), and satisfies the expressions below: Component (A): an aliphatic epoxy resin having one hydroxyl group and two to three epoxy groups in one molecule; Component (B): an aliphatic epoxy resin having no hydroxyl group and three epoxy groups in one molecule; Component (C): a polyisocyanate compound; 0.125?A/B?3; and 0.2<(A+B)/T?0.8 (A: parts by mass of component (A), B: parts by mass of component (B), and T: total parts by mass of the epoxy resins in the epoxy resin composition).
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: May 24, 2022
    Assignee: Toray Industries, Inc.
    Inventors: Norikazu Ishikawa, Kazunori Hondo, Nobuyuki Tomioka
  • Publication number: 20220033641
    Abstract: The present invention enables the achievement of: an SMC which has excellent flexibility, while being suppressed in tackiness; and a fiber-reinforced composite material which uses this SMC, thereby being reduced in voids after molding. In order to achieve the above, a sheet molding compound according to the present invention has the configuration described below. Specifically, a sheet molding compound according to the present invention is formed from reinforcing fibers and a resin composition, and has a weight content of the fibers of from 40% to 60% (inclusive) and an air bubble content of from 5% by volume to 30% by volume (inclusive), while satisfying the formulae below in a dynamic viscoelasticity measurement at 25° C. 105 Pa G? (s)?109 Pa 1?G?(s)/G? (s)?5 G?(s): storage elastic modulus (Pa) of sheet molding compound at 25° C. G?(s): loss elastic modulus (Pa) of sheet molding compound at 25° C.
    Type: Application
    Filed: November 1, 2019
    Publication date: February 3, 2022
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Norikazu ISHIKAWA, Kazunori HONDO, Nobuyuki TOMIOKA
  • Patent number: 11225560
    Abstract: A preform for fiber rein-forced composite material producing includes a thermosetting resin composition and a dry reinforcing fiber base, the thermosetting resin composition characterized in that when subjected to dynamic viscoelasticity measurement at a traction period of 0.5 Hz while heating at a rate of 1.5° C./min, a temperature change ?T is 45° C. or less as complex viscosity ?* decreases from 1×107 Pa·s to 1×101 Pa·s.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: January 18, 2022
    Assignee: Toray Industries, Inc.
    Inventors: Masanori Hirano, Nobuyuki Tomioka
  • Publication number: 20210347982
    Abstract: The present invention addresses the problem of providing: an epoxy resin composition for fiber-reinforced composite materials, which has excellent handling properties at room temperature, while achieving a good balance between high heat resistance and high toughness, and which exhibits excellent resin impregnation ability during the formation of a fiber-reinforced composite material; and an epoxy resin cured product, a preform and a fiber-reinforced composite material, each of which uses this epoxy resin composition for fiber-reinforced composite materials.
    Type: Application
    Filed: October 17, 2019
    Publication date: November 11, 2021
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masanori HIRANO, Nobuyuki TOMIOKA
  • Publication number: 20210261744
    Abstract: The present invention provides: an epoxy resin composition which has satisfactory handleability during refrigerated transport, is stable and inhibited from increasing in viscosity for a long period even when held at ordinary temperature, well infiltrates into reinforcing fibers, can be sufficiently rapidly cured at a temperature as high as 180° C., and gives molded objects that can be smoothly demolded in a demolding step after the molding since the resin has sufficiently cured and has high heat resistance imparted thereto; and a fiber-reinforced composite material obtained using the epoxy resin composition.
    Type: Application
    Filed: June 17, 2019
    Publication date: August 26, 2021
    Applicant: Toray Industries, Inc.
    Inventors: Kazunori Hondo, Nobuyuki Tomioka
  • Publication number: 20210198414
    Abstract: An epoxy resin composition contains components (A)-(C), and satisfies the expressions below: Component (A): an aliphatic epoxy resin having one hydroxyl group and two to three epoxy groups in one molecule; Component (B): an aliphatic epoxy resin having no hydroxyl group and three epoxy groups in one molecule; Component (C): a polyisocyanate compound; 0.125?A/B?3; and 0.2<(A+B)/T?0.8 (A: parts by mass of component (A), B: parts by mass of component (B), and T: total parts by mass of the epoxy resins in the epoxy resin composition).
    Type: Application
    Filed: August 21, 2019
    Publication date: July 1, 2021
    Inventors: Norikazu Ishikawa, Kazunori Hondo, Nobuyuki Tomioka
  • Patent number: 10829587
    Abstract: An epoxy resin composition produces a cured product having improved elastic modulus and improved nominal strain at compressive fracture. The epoxy resin composition is a fiber-reinforced composite material having excellent compression strength and interlayer toughness. The epoxy resin composition contains at least the following constituent components [A], [B] and [C]. [A] A specific ortho type epoxy resin. [B] At least one component selected from the group consisting of: thermoplastic resins that are compatible with the epoxy resin [A]; and core-shell type polymers. [C] An amine curing agent.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: November 10, 2020
    Assignee: Toray Industries, Inc.
    Inventors: Maki Nagano, Ayako Fuse, Nobuyuki Tomioka
  • Patent number: 10792869
    Abstract: A preform includes a plurality of reinforcement fiber layers connected to each other by binder resin, the binder resin containing spacer particles insoluble in the binder resin, the spacer particles accounting for a volume proportion of 10% to 80% in the binder resin present in interlaminar gaps between the reinforcement fiber layers.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: October 6, 2020
    Assignee: Toray Industries, Inc.
    Inventors: Masanori Hirano, Kazunori Hondo, Nobuyuki Tomioka