Abstract: A three-dimensional measurement device includes: a projector that includes: a light source that emits predetermined light; and a reflective optical modulator that converts the predetermined light into a predetermined striped pattern, wherein the projector projects the predetermined striped pattern onto a measurement object at a predetermined number of frames per unit time; an imaging device that takes an image of the measurement object projected with the predetermined striped pattern; a processor that: controls the projector and the imaging device to sequentially project a plurality of different ones of the predetermined striped pattern and take images of the plurality of different ones of the predetermined striped pattern to obtain a plurality of image data having different light intensity distributions; and executes three-dimensional measurement of the measurement object based on the plurality of image data.

Abstract: A substrate position detection device includes: an irradiator that irradiates a predetermined range of a substrate with a predetermined light; an imager that takes an image of the predetermined range of the substrate irradiated with the predetermined light; a moving mechanism that causes a relative movement of the imager and the substrate; and a controller that: detects a position of the substrate by sequentially executing to a plurality of recognition objects on the substrate: a moving process of relatively moving the imager to a position corresponding to a predetermined recognition object among the plurality of recognition objects on the substrate; an imaging process of taking an image of the predetermined recognition object under a predetermined imaging condition; and a recognition process of recognizing the predetermined recognition object based on image data obtained by the imaging process.

Abstract: A solder printing inspection device that inspects a printing state of solder paste printed on a substrate having a through hole into which a lead terminal of an insertion component is inserted, the solder printing inspection device including: a non-printing face side illuminator that irradiates an inspection range on a non-printing face side with a predetermined light, wherein the non-printing face side is opposite to a printing face side, out of a surface and a rear face of the substrate; a non-printing face side camera that takes an image of the inspection range on the non-printing face side of the substrate irradiated with the predetermined light; and a controller that executes inspection with regard to the solder paste in the inspection range, based on image data with regard to the inspection range on the non-printing face side of the substrate taken by the non-printing face side camera.

Abstract: A three-dimensional measurement device includes: a projector including: a light source that emits a predetermined light; a grid that converts the light from the light source into a predetermined striped pattern; and a driver that moves the grid, and the projector projecting the striped pattern onto a measurement object; an imaging device that takes an image of the measurement object on which the striped pattern is projected; and a controller that: controls the projector and the imaging device to obtain a plurality of image data having different light intensity distributions; executes three-dimensional measurement of the measurement object by phase shifting based on the image data having different light intensity distributions; and obtains each of the image data among the image data having different light intensity distributions.

Abstract: A three-dimensional measurement device includes: a projector that includes: a light source that emits predetermined light; and a reflective optical modulator that converts the predetermined light into a predetermined striped pattern, wherein the projector projects the predetermined striped pattern onto a measurement object at a predetermined number of frames per unit time; an imaging device that takes an image of the measurement object projected with the predetermined striped pattern; a processor that: controls the projector and the imaging device to sequentially project a plurality of different ones of the predetermined striped pattern and take images of the plurality of different ones of the predetermined striped pattern to obtain a plurality of image data having different light intensity distributions; and executes three-dimensional measurement of the measurement object based on the plurality of image data.

Abstract: A board inspection apparatus is disclosed, which includes a surface-side irradiator irradiating a surface of each inspection area of a board, a surface-side camera taking a surface-side image of the surface, a rear face-side irradiator irradiating a rear face of each inspection area, a rear face-side camera taking a rear face-side image of the rear face, and a controller moving the surface-side irradiator and the surface-side camera to a position corresponding to the surface of each inspection area, moving the rear face-side irradiator and the rear face-side camera to a position corresponding to the rear face of each inspection area, and inspecting the surface and the rear face of each inspection area based on the surface-side image and the rear face-side image, respectively.

Abstract: A substrate position detection device includes: an irradiator that irradiates a predetermined range of a substrate with a predetermined light; an imager that takes an image of the predetermined range of the substrate irradiated with the predetermined light; a moving mechanism that causes a relative movement of the imager and the substrate; and a controller that: detects a position of the substrate by sequentially executing to a plurality of recognition objects on the substrate: a moving process of relatively moving the imager to a position corresponding to a predetermined recognition object among the plurality of recognition objects on the substrate; an imaging process of taking an image of the predetermined recognition object under a predetermined imaging condition; and a recognition process of recognizing the predetermined recognition object based on image data obtained by the imaging process.

Abstract: A board inspection apparatus is disclosed, which includes one surface-side irradiator that irradiates a first area on a surface side of a board with first light, a surface-side camera that takes an image of the first area, one rear face-side irradiator that irradiates a second area on a rear face side of the board with second light, a rear face-side camera that takes an image of the second area; and a controller that inspects the first area based on image data obtained from the surface-side camera and the second area based on image data obtained from the rear face-side camera.

Abstract: A solder printing inspection device that inspects a printing state of solder paste printed on a substrate having a through hole into which a lead terminal of an insertion component is inserted, the solder printing inspection device including: a non-printing face side illuminator that irradiates an inspection range on a non-printing face side with a predetermined light, wherein the non-printing face side is opposite to a printing face side, out of a surface and a rear face of the substrate; a non-printing face side camera that takes an image of the inspection range on the non-printing face side of the substrate irradiated with the predetermined light; and a controller that executes inspection with regard to the solder paste in the inspection range, based on image data with regard to the inspection range on the non-printing face side of the substrate taken by the non-printing face side camera.

Abstract: A three-dimensional measurement device includes: a projector including: a light source that emits a predetermined light; a grid that converts the light from the light source into a predetermined striped pattern; and a driver that moves the grid, and the projector projecting the striped pattern onto a measurement object; an imaging device that takes an image of the measurement object on which the striped pattern is projected; and a controller that: controls the projector and the imaging device to obtain a plurality of image data having different light intensity distributions; executes three-dimensional measurement of the measurement object by phase shifting based on the image data having different light intensity distributions; and obtains each of the image data among the image data having different light intensity distributions.

Abstract: A board inspection apparatus is disclosed, which includes a surface-side irradiator irradiating a surface of each inspection area of a board, a surface-side camera taking a surface-side image of the surface, a rear face-side irradiator irradiating a rear face of each inspection area, a rear face-side camera taking a rear face-side image of the rear face, and a controller moving the surface-side irradiator and the surface-side camera to a position corresponding to the surface of each inspection area, moving the rear face-side irradiator and the rear face-side camera to a position corresponding to the rear face of each inspection area, and inspecting the surface and the rear face of each inspection area based on the surface-side image and the rear face-side image, respectively.

Abstract: A board inspection apparatus is disclosed, which includes one surface-side irradiator that irradiates a first area on a surface side of a board with first light, a surface-side camera that takes an image of the first area, one rear face-side irradiator that irradiates a second area on a rear face side of the board with second light, a rear face-side camera that takes an image of the second area; and a controller that inspects the first area based on image data obtained from the surface-side camera and the second area based on image data obtained from the rear face-side camera.

Abstract: A board inspection device includes an irradiation device for irradiating light on a printed circuit board, a CCD camera for imaging the irradiated part of the circuit board. First image processing is performed for a first exposure time such that an inspection target region is free of brightness saturation, and second image processing is performed using a second exposure time corresponding to the insufficiency of the first exposure time relative to a certain exposure time appropriate for measurement of a measurement standard region. Thereafter, image data for three-dimensional measurement is prepared for the inspection target region using the value of image data obtained by the first image processing, and image data for three-dimensional measurement is prepared for the measurement standard region using a value obtained by summing the image data value acquired by the second image processing and the image data value acquired by the first image processing.

Abstract: A device for measuring three dimensional shape is configured to perform one of a first imaging operation as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of a first light pattern of multiply varied phases, and a second imaging operation as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of a second light pattern of multiply varied phases. The device is configured to, simultaneous with completion of the first or second imaging operation, start shifting or switching operation of said first grating or a second grating relating to said first imaging operation. The device is configured to, without waiting for completion of the shifting or switching operation, perform the other imaging operation from among the first and second imaging operations.

Abstract: A device for measuring three dimensional shape is configured to perform one of a first imaging operation as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of a first light pattern of multiply varied phases, and a second imaging operation as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of a second light pattern of multiply varied phases. The device is configured to, simultaneous with completion of the first or second imaging operation, start shifting or switching operation of said first grating or a second grating relating to said first imaging operation. The device is configured to, without waiting for completion of the shifting or switching operation, perform the other imaging operation from among the first and second imaging operations.

Abstract: A three-dimensional measuring device includes an irradiation device configured to irradiate and switch among a multiplicity of light patterns having different periods and having a striped light intensity distribution on at least a measurement object, a camera having an imaging element capable of imaging reflected light from the measurement object irradiated by the light pattern, a rack configured to cause relative change in positional relationship between the imaging element and the measurement object, and a control device configured to perform three-dimensional measurements based on image data imaged by the camera. The control device performs the three-dimensional measurements by performing a phase shift method calculation of height data as a first height data for each pixel unit of image data based on a multiply phase-shifted image data obtained by irradiating on a first position a multiply phase-shifted first light pattern having a first period.

Abstract: A board inspection device includes an irradiation device for irradiating light on a printed circuit board, a CCD camera for imaging the irradiated part of the circuit board. First image processing is performed for a first exposure time such that an inspection target region is free of brightness saturation, and second image processing is performed using a second exposure time corresponding to the insufficiency of the first exposure time relative to a certain exposure time appropriate for measurement of a measurement standard region. Thereafter, image data for three-dimensional measurement is prepared for the inspection target region using the value of image data obtained by the first image processing, and image data for three-dimensional measurement is prepared for the measurement standard region using a value obtained by summing the image data value acquired by the second image processing and the image data value acquired by the first image processing.

Abstract: A three-dimensional measuring device includes an irradiation device configured to irradiate and switch among a multiplicity of light patterns having different periods and having a striped light intensity distribution on at least a measurement object, a camera having an imaging element capable of imaging reflected light from the measurement object irradiated by the light pattern, a rack configured to cause relative change in positional relationship between the imaging element and the measurement object, and a control device configured to perform three-dimensional measurements based on image data imaged by the camera. The control device performs the three-dimensional measurements by performing a phase shift method calculation of height data as a first height data for each pixel unit of image data based on a multiply phase-shifted image data obtained by irradiating on a first position a multiply phase-shifted first light pattern having a first period.