Abstract: The object of the present invention is to provide a gasket forming mold with a structure in which curling of the reversing section of the gasket molding does not occur easily. To achieve said object, the forming mold for integrally forming an endless shaped gasket has forming grooves as cavities in the parting surfaces of the forming mold and the forming grooves have a reversing section in a part thereof. The reversing section has two linear portions and the ends of the two linear portions are connected by an arc-shaped curved section. The two linear portions are arranged at literally-symmetrical positions and are arranged so that a distance therebetween is enlarged little by little from one end toward the other. The ends where said distance is enlarged are connected by the circular arc-shaped curved section.

Abstract: The object of the present invention is to provide a gasket forming mold with a structure in which curling of the reversing section of the gasket molding does not occur easily. To achieve said object, the forming mold for integrally forming an endless shaped gasket has forming grooves as cavities in the parting surfaces of the forming mold and the forming grooves have a reversing section in a part thereof. The reversing section has two linear portions and the ends of the two linear portions are connected by an arc-shaped curved section. The two linear portions are arranged at literally-symmetrical positions and are arranged so that a distance therebetween is enlarged little by little from one end toward the other. The ends where said distance is enlarged are connected by the circular arc-shaped curved section.

Abstract: A semiconductor device comprises a semiconductor element mounted on a first surface of a wiring substrate, and a plurality of conductive land portions formed and exposed at a second surface of the wiring substrate which is opposite to the first surface. A plurality of solder balls are respectively joined to the plurality of conductive land portions. A plurality of reinforcement resin film portions are formed to reinforce coupling between the solder balls and the conductive land portions. Each of the reinforcement resin film portions is formed around a portion of the solder ball joining to the conductive land portion. Each of the reinforcement resin film portions being bent to form a portion along the wiring substrate and a portion along the side surface of the solder ball. The coupling between the solder balls and the conductive land portions is reinforced by elastic force of the bent portions of the reinforcement resin film portions.

Abstract: A semiconductor device comprises a semiconductor element mounted on a first surface of a wiring substrate, and a plurality of conductive land portions formed and exposed at a second surface of the wiring substrate which is opposite to the first surface. A plurality of solder balls are respectively joined to the plurality of conductive land portions. A plurality of reinforcement resin film portions are formed to reinforce coupling between the solder balls and the conductive land portions. Each of the reinforcement resin film portions is formed around a portion of the solder ball joining to the conductive land portion. Each of the reinforcement resin film portions being bent to form a portion along the wiring substrate and a portion along the side surface of the solder ball. The coupling between the solder balls and the conductive land portions is reinforced by elastic force of the bent portions of the reinforcement resin film portions.

Abstract: A semiconductor device including a semiconductor element mounted on a first surface of a wiring substrate, and a plurality of conductive land portions formed and exposed at a second surface of the wiring substrate which is opposite to the first surface. A plurality of solder balls are respectively joined to the plurality of conductive land portions. A plurality of reinforcement resin film portions are formed to reinforce coupling between the solder balls and the conductive land portions. Each of the reinforcement resin film portions is formed around a portion of the solder ball joining to the conductive land portion. Each of the reinforcement resin film portions being bent to form a portion along the wiring substrate and a portion along the side surface of the solder ball. The coupling between the solder balls and the conductive land portions is reinforced by elastic force of the bent portions of the reinforcement resin film portions.

Abstract: A semiconductor device comprises a semiconductor element mounted on a first surface of a wiring substrate, and a plurality of conductive land portions formed and exposed at a second surface of the wiring substrate which is opposite to the first surface. A plurality of solder balls are respectively joined to the plurality of conductive land portions. A plurality of reinforcement resin film portions are formed to reinforce coupling between the solder balls and the conductive land portions. Each of the reinforcement resin film portions is formed around a portion of the solder ball joining to the conductive land portion. Each of the reinforcement resin film portions being bent to form a portion along the wiring substrate and a portion along the side surface of the solder ball. The coupling between the solder balls and the conductive land portions is reinforced by elastic force of the bent portions of the reinforcement resin film portions.

Abstract: A semiconductor memory device includes a memory cell array which is composed of a plurality of memory cells arranged in a matrix manner. Each of rows of the memory cell array is connected to a word line and each of columns of the memory cell array is connected to a pair of bit lines, and one of the word lines and one of the pairs of bit lines are selected in accordance with an address such that one of the plurality of memory cells is selected. An internal signal generating section generates a first activation signal in response to input of the address, and a power supply voltage detecting section determines whether a power supply voltage is higher than a predetermined voltage and generates a voltage detection signal when the power supply voltage is higher than the predetermined voltage. The selected word line is normally set to the power supply voltage and is set to a boosted voltage in response to the voltage detection signal. The boosted voltage is higher than the power supply voltage.