Abstract: A microelectronics package assembly and process of making same are disclosed. The flange has an upper surface and a first coating disposed on the upper surface of the flange. The insulator has a bottom surface for mounting onto the flange and an upper surface opposite the bottom surface. A second coating is disposed on the bottom surface of the insulator and a third coating disposed on the upper surface of the insulator. The first coating, the second coating, and the third coating each have a thickness of less than or equal to 1 micron. At least one of the first coating, the second coating, and the third coating is applied via at least one of physical vapor deposition, atomic deposition, or chemical deposition.

Abstract: A friction material comprising a sintered mass of iron in which graphite particles are dispersed, which sintered mass is formed from between 13 and 22 vol. % of iron fibers, between 13 and 22 vol. % of iron particles having a particle size of 10-400 .mu.m, between 40 and 70 vol. % of graphite particles having a particle size of 25-3000 .mu.m, and between 10 and 15 vol. % of a metallic binder having a melting point of 800-1140.degree. C., and a method of preparing such a friction material, wherein a mixture of these components is compressed at a pressure of at least 100 MPa so as to form a compact having a desired form and size, and where the compact thus formed is sintered at a temperature between 800 and 1140.degree. C. for a period of time which is sufficiently long for achieving concretion of iron fibers, iron particles and metallic binder.

Abstract: An improved method for initiating the inductive heating of semiconductors in the float zone refining process in which the oscillator circuit generating the required radio frequency energy is initially powered from a constant current source thereby controlling the rate of temperature rise for the semiconductor.

Abstract: Apparatus for the float zone refining of large semiconductor crystals. Additional support in the form of lightweight pins is provided for the growing monocrystalline rod to hold the rod on the proper vertical axis. The pins protrude from the telescoping inner wall portion of the refining enclosure. This telescoping enclosure portion allows the pins to be in synchronous motion with the monocrystalline rod and also reduces the overall height of the apparatus.

Abstract: An induction heating coil for the float zone melting of semiconductor materials. The distribution of current on the surfaces of the coil is modified by altering the surfaces of the coil. The alteration of the surfaces is in the form of selectively positioned saw slots and solid conductor strips. The current distribution can be controlled independently on the top and bottom surfaces of the coil.