Abstract: Novel block polyetheramides, well adapted for the usual thermoplastic elastomer applications, e.g., as molded or extruded shaped articles, films, sheaths, composites and the like, have the following general formula: ##STR1## in which D is the residue of an oligoamidediacid having an Mn ranging from 300 to 8,000 and/or the residue of the diacidic polymer chain limiter, PE is the residue of a polyetherdiol having an Mn ranging from 200 to 5,000, X is a linear or branched, (cyclo)aliphatic or aromatic hydrocarbon having form 3 to 20 carbon atoms, R.sub.1 and R.sub.2, which may be identical or different, are either OH or H, n is a number ranging from 0.1 to 10, and m is an average number ranging from 2 to 50, and are prepared by reacting, in the molten state, an oligoamidediacid A with an oligotherdiol B and a low molecular weight diacidic coupler C, the respective molar percentages a, b and c of which being such that:-5.ltoreq.a+c-b.ltoreq.5 and c.gtoreq.3.

Abstract: A composition for a cross-linkable hot melt adhesive is provided and is formed by an ethylene-vinyl acetate copolymer containing primary hydroxyl functions and a blocked polyisocyanate. This composition when associated with a tackifying resin which can also serve as blocking agent of the polyisocyanate, is a cross-linkable hot melt adhesive. The adhesive is used at a temperature at least equal to splitting temperature of the isocyanate functions of the polyisocyanate. The temperature at which such adhesives retain adherence can reach about 200.degree.-220.degree. C.

Abstract: A composition for a cross-linkable hot melt adhesive is provided and is formed by an ethylene-vinyl acetate copolymer containing primary hydroxyl functions and a blocked polyisocyanate. This composition when associated with a tackifying resin, which can also serve as blocking agent of the polyisocyanate, is a cross-linkable hot melt adhesive. The adhesive is used at a temperature at least equal to splitting temperature of the isocyanate functions of the polyisocyanate. The temperature at which such adhesives retains adherence can reach about 200.degree.-220.degree. C.