Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a swing nozzle that is arranged on one side of the support module, moves in a swing manner, and sprays a chemical solution to the substrate, a sensor arranged on one side of the swing nozzle to sense movement of the swing nozzle, an electromagnet and a magnet installed on the other side of the swing nozzle so as to be able to adjust spacing relative to each other, and a controller for receiving a sensing result of the sensor and performing a damping operation to the swing nozzle by providing power to the electromagnet to generate an attractive force or repulsive force between the electromagnet and the magnet.

Abstract: According to an embodiment of the present invention, there is provided an article transport vehicle capable of speeding up and reducing vibration in a manufacturing plant, a rail assembly, and an article transport system including the same. The article transport vehicle that conveys an article between manufacturing facilities along a rail of an article transport system in a manufacturing plant includes an article holder, a vehicle body, a magnetic levitation actuator, and a linear motor coil.

Abstract: Provided is an apparatus for conveying a carrier and a system for controlling a carrier having the same, which couples a hoist and a hand using a non-contact damping structure using an eddy current. The apparatus for conveying the carrier conveys a carrier containing a wafer, and includes: a gripper for gripping the carrier; and a lifter for raising and lowering the gripper, in which the gripper and the lifter are connected in a non-contact damping structure, and a relative motion thereof is suppressed.

Abstract: Provided is an apparatus for conveying a carrier and a system for controlling a carrier having the same, which couples a hoist and a hand using a non-contact damping structure using an eddy current. The apparatus for conveying the carrier conveys a carrier containing a wafer, and includes: a gripper for gripping the carrier; and a lifter for raising and lowering the gripper, in which the gripper and the lifter are connected in a non-contact damping structure, and a relative motion thereof is suppressed.

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a swing nozzle that is arranged on one side of the support module, moves in a swing manner, and sprays a chemical solution to the substrate, a sensor arranged on one side of the swing nozzle to sense movement of the swing nozzle, an electromagnet and a magnet installed on the other side of the swing nozzle so as to be able to adjust spacing relative to each other, and a controller for receiving a sensing result of the sensor and performing a damping operation to the swing nozzle by providing power to the electromagnet to generate an attractive force or repulsive force between the electromagnet and the magnet.

Abstract: Disclosed is a linear evaporation source used for forming a thin film for an organic semiconductor device, the linear evaporation source comprising a crucible having a receiving space formed therein, for accommodating an evaporation material and an opening section formed at one side of the crucible in a length direction, wherein the opening section becomes narrow as it travels from both ends to a center portion thereof. If the thin film is formed using the linear evaporation source, a low material use rate of the vacuum evaporation source for the formation of the thin film is improved, thickness uniformity of the deposited thin film throughout the whole area is secured, and shadow effect due to the shadow mask is improved.