Patents by Inventor Nohyun Kwakg

Nohyun Kwakg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7968225
    Abstract: In the secondary battery, a lead plate is provided so as not to overlap the position of the sealing unit of the electrolyte injection hole to enhance the fixation of the lead plate to the upper surface of the cap plate of a cap assembly. The position of a connection terminal of a protective circuit unit corresponds to the position of the lead plate and together with the connection terminal shape the connection terminal is prevented from being exposed to the outside during hot-melt molding.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: June 28, 2011
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jeongdeok Byun, Kyungwon Seo, Nohyun Kwakg, Sangkwon Nam, Seok Koh, Bohyun Byun
  • Publication number: 20110014502
    Abstract: In the secondary battery, a lead plate is provided so as not to overlap the position of the sealing unit of the electrolyte injection hole to enhance the fixation of the lead plate to the upper surface of the cap plate of a cap assembly. The position of a connection terminal of a protective circuit unit corresponds to the position of the lead plate and together with the connection terminal shape the connection terminal is prevented from being exposed to the outside during hot-melt molding.
    Type: Application
    Filed: September 23, 2010
    Publication date: January 20, 2011
    Inventors: Jeongdeok Byun, Kyungwon Seo, Nohyun Kwakg, Sangkwon Nam, Seok Koh, Bohyun Byun
  • Patent number: 7807291
    Abstract: In the secondary battery, a lead plate is provided so as not to overlap the position of the sealing unit of the electrolyte injection hole to enhance the fixation of the lead plate to the upper surface of the cap plate of a cap assembly. The position of a connection terminal of a protective circuit unit corresponds to the position of the lead plate and together with the connection terminal shape the connection terminal is prevented from being exposed to the outside during hot-melt molding.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: October 5, 2010
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jeongdeok Byun, Kyungwon Seo, Nohyun Kwakg, Sangkwon Nam, Seok Koh, Bohyun Byun
  • Publication number: 20070026296
    Abstract: In the secondary battery, a lead plate is provided so as not to overlap the position of the sealing unit of the electrolyte injection hole to enhance the fixation of the lead plate to the upper surface of the cap plate of a cap assembly. The position of a connection terminal of a protective circuit unit corresponds to the position of the lead plate and together with the connection terminal shape the connection terminal is prevented from being exposed to the outside during hot-melt molding.
    Type: Application
    Filed: July 26, 2006
    Publication date: February 1, 2007
    Inventors: Jeongdeok Byun, Kyungwon Seo, Nohyun Kwakg, Sangkwon Nam, Seok Koh, Bohyun Byun