Abstract: A method for a closed power control feedback loop allows a single portable transceiver architecture to be used for systems in which a transmit signal including both a phase modulated (PM) component and an amplitude modulated (AM) component are supplied to a power amplifier and in systems in which the transmit signal has only a PM component supplied to a power amplifier. By injecting the inverse of the AM portion of the desired transmit signal into the closed power control feedback loop, the feedback loop will not cancel the AM portion of the signal, thus allowing a system where both a PM component and an AM component of the transmit signal are present at the output of the power amplifier to function using a closed power control feedback loop.

Abstract: A system that provides packaging for a surface acoustic wave filter in such a way that the surface acoustic wave filter is capable of integration with a number of additional electronic devices on an integrated substrate. The surface acoustic wave filter is mounted in a “flip chip” configuration that enables the surface of the surface acoustic wave filter to be protected from a molding compound during and after the encapsulation of the surface acoustic wave filter and other circuitry contained on the integrated substrate. The manner in which the surface acoustic wave filter is packaged provides a great reduction in cost and occupied real estate on the integrated substrate, in that, the surface acoustic wave filter is mounted in such as way as not to require conventionally used ceramic packaging that encases the surface acoustic wave filter. An air gap is preserved between the surface acoustic wave filter side of the surface acoustic wave filter and the integrated substrate on which it is mounted.

Abstract: A system that provides packaging for a surface acoustic wave filter in such a way that the surface acoustic wave filter is capable of integration with a number of additional electronic devices on an integrated substrate. The surface acoustic wave filter is mounted in a “flip chip” configuration that enables the surface of the surface acoustic wave filter to be protected from a molding compound during and after the encapsulation of the surface acoustic wave filter and other circuitry contained on the integrated substrate. The manner in which the surface acoustic wave filter is packaged provides a great reduction in cost and occupied real estate on the integrated substrate, in that, the surface acoustic wave filter is mounted in such as way as not to require conventionally used ceramic packaging that encases the surface acoustic wave filter. An air gap is preserved between the surface acoustic wave filter side of the surface acoustic wave filter and the integrated substrate on which it is mounted.

Abstract: A closed power control feedback loop system allows a single portable transceiver architecture to be used for systems in which a transmit signal including both a phase modulated (PM) component and an amplitude modulated (AM) component are supplied to a power amplifier and in systems in which the transmit signal has only a PM component supplied to a power amplifier. By injecting the inverse of the AM portion of the desired transmit signal into the closed power control feedback loop, the feedback loop will not cancel the AM portion of the signal, thus allowing a system where both a PM component and an AM component of the transmit signal are present at the output of the power amplifier to function using a closed power control feedback loop.

Abstract: A translation loop modulator and power amplifier in a phase and amplitude modulated transmission environment includes a translation loop having a phase locked loop and that is configured to receive a first modulated signal (PM) and that is also configured to provide a frequency specific modulated signal. The invention also includes a power amplifier configured to receive the frequency specific modulated signal, a variable gain element configured to provide a second modulated signal (AM) to the power amplifier and a switching element configured to receive a portion of an output of the translation loop and a portion of an output power of the power amplifier.

Abstract: A system that provides packaging for a surface acoustic wave filter in such a way that the surface acoustic wave filter is capable of integration with a number of additional electronic devices on an integrated substrate. The surface acoustic wave filter is mounted in a “flip chip” configuration that enables the surface of the surface acoustic wave filter to be protected from a molding compound during and after the encapsulation of the surface acoustic wave filter and other circuitry contained on the integrated substrate. The manner in which the surface acoustic wave filter is packaged provides a great reduction in cost and occupied real estate on the integrated substrate, in that, the surface acoustic wave filter is mounted in such as way as not to require conventionally used ceramic packaging that encases the surface acoustic wave filter. An air gap is preserved between the surface acoustic wave filter side of the surface acoustic wave filter and the integrated substrate on which it is mounted.

Abstract: A system for using a translation loop upconverter and power amplifier including a secondary phase-error correction loop uses the output of the upconverter to lock a feedback loop during a time in which the output of the power amplifier is insufficient to provide feedback to the upconverter. After the power amplifier has developed sufficient power to provide feedback to the upconverter, the feedback to the upconverter is taken from the output of the power amplifier. By placing a phase detector and phase shifter in the secondary feedback path taken from the output of the power amplifier, any phase distortion present in the system can be detected and corrected.

Abstract: A system for controlling a power amplifier using a dual feedback translation loop uses the output of the translation loop during a first time period where a power amplifier has insufficient power to lock the loop and uses the output of the power amplifier to lock the translation loop only after the power amplifier provides sufficient power. By using a first feedback loop taken from the output of the translation loop and a second feedback loop taken from the output of the power amplifier, the translation loop can lock to the output of the translation loop until the power output of the power amplifier is sufficient to lock the translation loop. A pair of phase detectors and corresponding charge pumps associated with each of the feedback loops provides a smooth switching function while transitioning from the first loop to the second loop.

Abstract: A single multi-layer carrier module is disclosed which carries the power amplifier components in a GSM mobile digital cellular telephone. In a first embodiment of the present invention the power amplifier and the power amplifier controller are placed upon a ceramic or laminate carrier module along with necessary connection circuitry. The carrier module is then connected to the RF board. In a second preferred embodiment of the present invention the power amplifier, the power amplifier controller and a voltage controlled oscillator are placed upon the carrier module.