Patents by Inventor Nor Azam Man

Nor Azam Man has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat spreader for integrated circuit device
    Patent number: 9064838
    Abstract: A BGA type packaged integrated circuit (IC) die has an exposed coronal heat spreader. The die, which is attached to a substrate, is encapsulated in a central segment of molding compound. The central segment is laterally surrounded by, and separated by a moat from a ring segment of molding compound, to a form a slot. The coronal heat spreader is inserted into the slot to cap the central segment. The coronal heat spreader is attached to the substrate and to the central segment with thermal glue. In operation, at least some of the heat generated by the die is dissipated through the coronal heat spreader.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: June 23, 2015
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Ruzaini B. Ibrahim, Mohd Rusli Ibrahim, Nor Azam Man
  • HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE
    Publication number: 20150076680
    Abstract: A BGA type packaged integrated circuit (IC) die has an exposed coronal heat spreader. The die, which is attached to a substrate, is encapsulated in a central segment of molding compound. The central segment is laterally surrounded by, and separated by a moat from a ring segment of molding compound, to a form a slot. The coronal heat spreader is inserted into the slot to cap the central segment. The coronal heat spreader is attached to the substrate and to the central segment with thermal glue. In operation, at least some of the heat generated by the die is dissipated through the coronal heat spreader.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 19, 2015
    Inventors: Ruzaini B. Ibrahim, Mohd Rusli Ibrahim, Nor Azam Man